Patent classifications
H05K3/385
Circuit board
A circuit board with conductive wiring which is precisely shaped and sized includes a two-part conductive element, namely a first conductive wiring layer and a second conductive wiring layer, a first cover film and a second cover film. The first conductive wiring layer and the second conductive wiring layer are in direct contact to each other. A projection of the first conductive wiring layer and a projection of the second conductive wiring layer along a direction perpendicular to the circuit board overlap with each other. The first and the second cover films wrap the first and the second conductive wiring layers, respectively.
COMPOSITE STRUCTURE AND MANUFACTURING METHOD THEREOF
The invention is directed to a composite structure in which a metal member having a roughened surface and a resin member are joined in a state in which at least a portion of the roughened surface is included. The resin member is made of a molded article obtained by melt-molding a polyarylene sulfide resin composition containing a polyarylene sulfide resin. In the roughened surface, a cumulative pore volume of a pore diameter in a range of 0.1 μm to 20 μm is in a range of 0.5 nL/mm.sup.2 or more and 5 nL/mm.sup.2 or less measured by mercury porosimetry. According to the invention, it is possible to provide a composite structure that is obtained by joining a metal member and a molded article made of polyarylene sulfide resin composition and is more excellent in joining strength, heat cycle resistance, and sealing properties, and a method for producing the composite structure.
ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS
An electro-optical device includes a plurality of digital scanning lines, a digital signal line, and a plurality of pixel circuits. Each of the pixel circuits includes a light emitting element and a digital driving circuit. The digital driving circuit performs digital driving to turn the light emitting element ON-state or OFF-state based on a grayscale value. The digital driving circuit keeps the light emitting element ON-state by supplying a drive current to the light emitting element, in a period in which an enable signal is active, of a grayscale display period having a length corresponding to the grayscale value. The control line driving circuit sets a period in which the enable signal is active. A ratio, with respect to the grayscale display period, of an ON-state period in which the light emitting element is ON-state changes in accordance with the period in which the enable signal is active.
COMPOSITE COPPER COMPONENTS
The present invention is directed to provide novel composite copper components. For example, provided is a composite copper component including a copper oxide-containing layer formed on at least a portion of the surface of a copper component, in which when the surface of the composite copper component is bonded to a resin substrate by thermocompression, and the copper component is peeled off from the resin substrate after the thermocompression bonding, metal contained in the copper oxide-containing layer is transferred to the resin substrate.
One-Step Oxide Bath for Improving Adhesion of Polymeric Materials to Metal Substrates
An oxide coating composition and a process for enhancing adhesion between a metal conducting layer and an in organic material or polymeric resin material using the oxide coating composition. The process includes the steps of applying the oxide coating composition to the metal conducting layer and bonding the inorganic material or polymeric resin material to the metal conducting layer. The oxide coating composition comprises (a) an alkali; (b) an oxidizing agent; (c) an acid; and (d) a corrosion inhibitor comprising a nitrogen heterocyclic compound;
MANUFACTURING METHOD FOR CIRCUIT BOARD BASED ON COPPER CERAMIC SUBSTRATE
A manufacturing method for circuit board on copper ceramic substrate comprises stamping a copper sheet into a copper circuit board in a shape matching a ceramic substrate, fitting the copper circuit board to the ceramic substrate and sintering the copper circuit board and the ceramic substrate together by direct bonding copper.
Printed circuit board and method of manufacturing same
A printed circuit board has a core made of an aluminum material; a bonding member positioned on opposite surfaces of the core; a base layer bonded to the opposite surface of the core through the bonding member; a receiving hole extending through the core, the bonding member, and the base layer; a zinc substitution layer positioned on a surface of the base layer and a portion of the base layer exposed on an inner surface of the receiving hole; and a plating layer positioned on the zinc substitution layer, and having a circuit pattern.
METAL SURFACE TREATMENT LIQUID AND LIQUID CONCENTRATE THEREOF, METAL SURFACE TREATMENT LIQUID SET, METAL SURFACE TREATMENT METHOD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
The present invention provides a surface treatment liquid for metal having a sufficiently high film-forming property. The present invention relates to a surface treatment liquid for metal comprising an azole silane coupling agent, the surface treatment liquid further comprises (A) an organic acid ion having one to three acidic groups in one molecule; (B) an inorganic acid (or mineral acid) ion; (C) an alkali metal ion and/or an ammonium ion; and (D) a copper ion.
Methods of treating metal surfaces and devices formed thereby
Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.
ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS
An electro-optical device includes a plurality of digital scanning lines, a digital signal line, and a plurality of pixel circuits. Each of the pixel circuits includes a light emitting element and a digital driving circuit. The digital driving circuit performs digital driving to turn the light emitting element ON-state or OFF-state based on a grayscale value. The digital driving circuit keeps the light emitting element ON-state by supplying a drive current to the light emitting element, in a period in which an enable signal is active, of a grayscale display period having a length corresponding to the grayscale value. The control line driving circuit sets a period in which the enable signal is active. A ratio, with respect to the grayscale display period, of an ON-state period in which the light emitting element is ON-state changes in accordance with the period in which the enable signal is active.