H
ELECTRICITY
H
ELECTRICITY
H05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00
Apparatus or processes for manufacturing printed circuits
H05K3/00
Apparatus or processes for manufacturing printed circuits
H05K3/38
Improvement of the adhesion between the insulating substrate and the metal
H05K3/38
Improvement of the adhesion between the insulating substrate and the metal
H05K3/386
by the use of an organic polymeric bonding layer, e.g. adhesive
H05K3/386
by the use of an organic polymeric bonding layer, e.g. adhesive