A method for manufacturing a wiring circuit board that is a double-sided wiring circuit board includes a first step of preparing a laminate and a second step. The laminate includes a metal core layer, insulating layer, and conductor layers. The insulating layer has a region and an opening that are adjacent to each other. The insulating layer has a region including a part facing the region in a thickness direction, and an opening adjacent to the region. The conductor layer includes a wiring portion and a conductive portion. The conductor layer includes a wiring portion and a conductive portion. In the second step, the first and second etching treatments for etching the metal core layer through the openings are carried out to form a via portion having a periphery surrounded by a space, extending between the regions, and connected to the conductive portions.

A wiring circuit board includes an insulating layer having a via penetrating in a thickness direction, a first conductive layer disposed on a one-side surface in the thickness direction of the insulating layer, a second conductive layer disposed on the other-side surface in the thickness direction of the insulating layer, and a conductive portion disposed on an inner peripheral surface of the via and electrically connecting the first and second conductive layers. Length L of 1 .Math.m-10 .Math.m inclusive, is measured by: drawing a segment joining first and second connection points from respectively, the one-side surface to the other-side surface in the thickness direction of the insulating layer and the inner peripheral surface in the cross-sectional view; identifying an outermost position farthest outward from the segment on the inner peripheral surface in the cross-sectional view; and measuring the length as the shortest distance from the segment to the outermost position.

A method of making a printed wiring board (“PWB”) is disclosed. The PWB may be made by forming openings in a substrate. The substrate may be a dielectric substrate. The dielectric substrate may be at least partially uncured. A conductive sheet may be placed on one or both sides of the substrate to cover the openings. The substrate may be cured. The conductive sheet(s) may then be etched to form conductive tabs within the openings. The conductive tabs are free of dielectric material on both sides of the conductive tab. The conductive tabs may then be coupled to terminals of electrochemical cells to form a circuit as desired.

An electrical break is created in a via that would ordinarily electrically connect different layers of a printed circuit board. The electrical break severs the via into two or more separate and electrically disconnected vias. The electrical break may be placed at any depth along the via, thus demarking different purposes associated with different layers.

A film composite with electrical functionality for application on a substrate includes at least one conductive structure, a first bonding coat, a film layer and a second bonding coat. The first bonding coat is disposed on an underside of the at least one conductive structure, wherein the first bonding coat has an adhesive effect for application of the at least one conductive structure on the substrate. The second bonding coat is disposed between an upper side of the at least one conductive structure and the film layer. The second bonding coat has an adhesive effect, by which the film layer adheres to the at least one conductive structure.

A method for producing a camera module having a first part, preferably a housing part, and a second part, preferably a circuit board or a cover part, in which the two parts are connected in positive locking fashion. The positive lock is produced in that a connecting element connected to the first part in the form of a tongue, sleeve or a pin is guided through an opening of the second part, the first part is brought to abut on the second part and subsequently the end of the connecting element protruding beyond the second part is curled in a deforming process so that the curled end abuts on the second part in a pretensioned manner. A camera module is also described.

A method for producing a camera module having a first part, preferably a housing part, and a second part, preferably a circuit board or a cover part, in which the two parts are connected in positive locking fashion. The positive lock is produced in that a connecting element connected to the first part in the form of a tongue, sleeve or a pin is guided through an opening of the second part, the first part is brought to abut on the second part and subsequently the end of the connecting element protruding beyond the second part is curled in a deforming process so that the curled end abuts on the second part in a pretensioned manner. A camera module is also described.

An electrical connection between the backplane and the light-transmissive front electrode of an electrowetting device is provided by forming an aperture through the top front electrode coupled and a substrate coupled thereto and subsequently introducing a flowable, electrically-conductive material into the aperture. The flowable, electrically-conductive material provides an electrical contact between the light-transmissive electrically-conductive layer and the backplane.

An electrical connection between the backplane and the light-transmissive front electrode of an electro-optic display is provided by forming an aperture through the top front electrode coupled and a substrate coupled thereto and subsequently introducing a flowable, electrically-conductive material into the aperture. The flowable, electrically-conductive material provides an electrical contact between the light-transmissive electrically-conductive layer and the backplane.

A method and structure are provided for implementing stub-less printed circuit board (PCB) vias and custom interconnect through laser-excitation conductive track structures. Stub-less printed PCB vias are formed which terminate at desired signal layers by controlled laser excitation without stubs or the need to back-drill to remove such stubs.