A resin substrate includes an insulating base material in which conductive particles are mixed with resin, and conductor patterns provided on the principal surfaces of the insulating base material. When a length at a position at which a distance between two conductor patterns that are adjacent to each other without directly electrically connecting to each other on the same principal surface of the insulating base material is smallest is indicated by L1 and a length at a position at which a distance between two conductor patterns that face each other without directly electrically connecting to each other between the different principal surfaces of insulating base materials is smallest is indicated by L2, L1 is larger than or equal to L2 (L1 L2).

A method of lamination of dielectric circuit materials is provided. The method includes preparing first and second circuit layers of dielectric materials, stacking the first and second circuit layers with circuit trace elements interposed between the first and second circuit layers and ultrasonically welding the second circuit layer onto the first circuit layer around the circuit trace elements.

A component built-in substrate incorporates a chip capacitor in a multilayer substrate including laminated base material layers made of thermoplastic resin. The chip capacitor includes an uneven portion including a recessed portion and a projected portion on one side in a laminated direction. On one side of the chip capacitor in the multilayer substrate, a density of low fluid member with a melting point higher than a fluidization temperature of the base material layers is higher in a region overlapping the recessed portion of the chip capacitor than in a region overlapping the projected portion of the chip capacitor when viewed in the lamination direction.

A apparatus comprising a printed circuit board (“PCB”). The PCB comprises a first insulating layer and a second insulating layer. The first insulating layer is made of a first material and the second insulating layer is made of a second material. The first material has a lower dissipation factor than the second material. The first material and second material have substantially similar dielectric constants.

A flexible sheet of light-emitting diode (LED) light emitters includes a support substrate having a thermally conductive material. The flexible sheet of LED light emitters also has an LED emitter sheet overlying the support substrate, and the LED emitter sheet including a plurality of LED light emitters. The flexible sheet of LED light emitters also has a flexible circuit sheet overlying the LED emitter sheet, and a phosphor sheet overlying the flexible circuit sheet. The phosphor sheet includes a wave-length converting material. The flexible sheet of LED light emitters also has a lens sheet overlying the phosphor sheet. The lens sheet includes a plurality of lenses.

A high-frequency signal transmission structure capable of transmitting high frequency signals with reduced attenuation includes a first wiring board and a second wiring board. The first wiring board includes a first conductor layer, a second conductor layer, and a first base film layer sandwiched between the first conductor layer and the second conductor layer. The second wiring board includes a second base film layer and a third conductor layer. the second base film layer covers the surface of the first conductor layer facing away from the first base film layer. The first base film layer and the second base film layer surround the first conductor layer and both include an aerogel film layer having an air to gel ratio by volume of 80-99%. A method for manufacturing the high-frequency signal transmission structure is also disclosed.

A resin composition of the present invention contains: a maleimide compound (A) having a maleimide functional group equivalent of 300 g/eq. or more, and a transmittance of 1% or more at a wavelength of 405 nm (h-line); a maleimide compound (B) having a maleimide functional group equivalent of less than 300 g/eq.; and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).

Methods and systems for providing a user with content relevant to a location of interest to the user, when the user is determined to be at or near the location, are presented. The user's interest in the location may be determined based on queries about the location received from the user prior to the user arriving at the location. The queries received from the user about the location are used to build a location recommendation model, which generates personalized content relevant to the location and to one or more interest verticals identified for the user. The location recommendation model is built using a location recommendation engine that collects data about the user, the queried location, one or more associations between the user, the queried location, and/or one or more other users, as well as various other information related to the user's interests and the queried location.

A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.

A light-emitting module includes (i) a board provided with: a circuit pattern and a plurality of bottomed holes in each of a set of wiring pads continuous with the circuit pattern on a first surface; electrically conductive paste extending over two or more of the bottomed holes; and an insulating resin covering the electrically conductive paste at a side close to the first surface, and (ii) a plurality of light-emitting segments connected to a second surface of the board with an adhesive sheet interposed therebetween. The light-emitting segments each include a plurality of light-emitting devices that are aligned. The electrically conductive paste includes a portion disposed on a portion of a surface of the wiring pad extending over two or more of the bottomed holes.