A vehicular camera includes a printed circuit board (PCB) having an imager disposed thereat. A lens barrel accommodates a lens and includes a first end and a second end and an annular flange between the first end and the second end. A front camera housing includes a first portion having a first material having a first coefficient of thermal expansion (CTE) and a second portion having a second material having a second CTE, with the first CTE being higher than the second CTE. A rear camera housing and the second portion of the front camera housing are joined to encase the PCB within a cavity formed by joining the front camera housing and the rear camera housing.

The disclosure provides an electronic control apparatus including a printed circuit board with a first surface side and a second surface side and with at least one electronic component that is arranged on at least one of the surface sides of the printed circuit board. At least one heat sink is arranged on the printed circuit board on the opposite surface side from the electronic component for the purpose of heat dissipation. The printed circuit board with the electronic component and the heat sink are surrounded by a casing made from a thermosetting plastic material such that at least one outer side of the heat sink is free of thermosetting plastic material.

An electronic component module (100) includes a module board (10) having electronic components (40) mounted on at least one of a first surface (front surface) (12) and a second surface (back surface) (14), mold portions (22 and 23), and a shield (32). The mold portions (22 and 23) cover the mounted electronic components (40). The shield (32) covers at least a part of the mold portions (22 and 23) and the side surfaces of the module board (10). Protrusions (15) protruding from the side surfaces are formed on the module board (10). The shield (32) is separated by the protrusions (15).

Embodiments herein are directed to an assembly that includes a circuit board, a plurality of terminal pins, a first material layer, a second material layer, and a third material layer. The plurality of terminal pins extend from the circuit board. The first material layer encases a portion of the circuit board. The second material layer encapsulates a portion of the plurality of terminal pins and encases the first material layer. The second material layer defines a connector interface. A material of the second material layer is different from a material of the first material layer. The third material layer encases the first material layer and at least a portion of the second material layer. The third material layer defines a housing that is formed from a material different then the material of the first material layer and different from the material of the second material.

Electronics modules according to embodiments of the present technology may include a circuit board having a first surface from which an electronic component extends and a second surface opposite the first surface. The circuit board may include a tie-bar residual extending from a sidewall of the circuit board beyond the width across the first surface. The modules may also include an overmold at least partially encapsulating the circuit board. The overmold may be characterized by a first height extending normal to the first surface of the circuit board across the width of the circuit board. The overmold may extend laterally beyond the width along a length of the first surface. The overmold may define a region about the tie-bar residual characterized by a recessed height. The overmold may define a notch recessed from an outer edge of the overmold. The notch may be located across the tie-bar residual.

A circuit module may include a circuit board and an overmold. The circuit board may have a first surface from which an electronic component extends and a second surface opposite the first surface. The circuit board may be characterized by a width across the circuit board. The circuit board may include a tie-bar residual extending from a sidewall of the circuit board beyond the width across the circuit board. The overmold may at least partially encapsulate the first surface of the circuit board and the second surface of the circuit board. The overmold may extend laterally beyond the width of the circuit board along a length of the circuit board. The overmold may define a region about the tie-bar residual characterized by a first recessed height with respect to the first surface and a second recessed height with respect to the second surface. The overmold may define a notch within the region recessed from an outer edge of the overmold.

A method for manufacturing an electronic device casing having a coupling structure is provided. The electronic device casing is made of a casing material including a supportive substrate and a first thermoplastic substrate. A preliminary connecting section is formed on the first thermoplastic substrate by a hot-pressing molding process, and a molding plastic material is injected onto the preliminary connecting section by an in-mold injection process. After being cooled, the molding plastic material engages with the preliminary connecting section to form a secondary connecting section for a coupling element to couple with. Thus, the coupling structure of the electronic device casing can be directly formed during a manufacturing process without any additional procedures, thereby overall manufacturing time and costs are reduced.

A vehicular camera module includes a circuit element and a lens mounting element disposed at the circuit element and optically aligned with an imager of the circuit element. An inner lower pressure polymer molding is formed at least partially over and around the circuit element and the lens mounting element so that the inner molding and the lens mounting element substantially encase the circuit element. A connector element is disposed at an aperture of the inner molding so as to be in electrical contact with the electrical connecting elements of the circuit element. An outer higher pressure injection molded shell is molded over and around the inner molding and part of the lens mounting element so as to encase the inner molding. The outer shell includes a connector portion that generally surrounds the connector element, with the connector element being accessible at the connector portion of the outer shell.

There is a problem that contact resistance increases due to formation of an oxide film on a contact interface or biting of abrasion powder caused by micro-sliding when a contact connecting portion of a connection terminal including non-noble metal members is exposed to high temperature environment or a repetitious temperature cycle. An object of the present invention is to provide an in-vehicle electronic module that has connection reliability equivalent to that of the conventional in-vehicle electronic module even when being placed in the environment of an engine compartment and can achieve cost reduction by reducing the number of parts and assembly steps. The electronic module includes a mounting board having a circuit board on which an electronic component is mounted, and a case member for accommodating and protecting the mounting board from surrounding environment, The electronic module has a connection structure in which a portion of the circuit board is protruded to the outside through an opening of the case and inserts a board terminal into an external female connector to obtain electrical continuity, and a portion of the case member forms a connector housing that receives the female connector and isolates a space in which the board terminal is present from surrounding environment and an insulating resin member for fixing the circuit board in the case is integrally molded or joined with the circuit board.

There is provided an on-vehicle electronic module that includes an external connecting function and environment resistant reliability similar to a previous on-vehicle electronic module and that simultaneously achieves downsizing without a male connector housing component and cost reduction due to reduction of the number of components and assembly man-hours. There are included a circuit board 1 including a mounting region 2 and a terminal forming region 3, and a case housing the mounting region 2 of the circuit board 1. Electronic components 9 and 10 are mounted on the mounting region 2. A board terminal is formed in the terminal forming region 3. The case includes a case member 13 integrally formed with a wall surface and a male connector housing 13a. The wall surface forms a case internal space 21 that houses the mounting region 2. A female connector is mounted to the male connector housing 13a. The circuit board 1 penetrates the case member 13 such that the terminal forming region 3 is exposed to a housing space 22 side of the male connector housing 13a.