An apparatus and method for reducing differential cross-talk in a pin arrangement of a socket are described. Socket pins within a differential pair use a modified shape to tighten the intra-pair pin coupling to reduce the crosstalk without changing the pin map. The middle vertical segment of one pin of a diagonally adjacent differential pin pair is modified to be closer to the other pin than other corresponding locations of the pins. The spring beam that extends from the middle vertical segment of the one pin is modified to accommodate the package landing pad that the spring beam contacts to maintain a uniform pitch.

Example implementations relate to a host device and a method for thermal management of a removable device, such as a pluggable electronic transceiver comprising a plurality of spring fingers that provide multipoint contact conduction cooling of the removable device. The host device includes a host circuit board having a connector, and a thermal management unit having a cooling component and the plurality of spring fingers. The cooling component is coupled to a portion of the host circuit board and includes a partially protruded portion. Each of the plurality of spring fingers includes a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of the removable device to allow waste-heat to transfer from the removable device to the cooling component through each spring finger.

Example implementations relate to a host device and a method for thermal management of a removable device, such as a pluggable electronic transceiver comprising a plurality of spring fingers that provide multipoint contact conduction cooling of the removable device. The host device includes a host circuit board having a connector, and a thermal management unit having a cooling component and the plurality of spring fingers. The cooling component is coupled to a portion of the host circuit board and includes a partially protruded portion. Each of the plurality of spring fingers includes a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of the removable device to allow waste-heat to transfer from the removable device to the cooling component through each spring finger.

A motherboard with shockproof, shakeproof and waterproof functions is installed in a cabinet of an electronic device, the motherboard includes a PCB board, wherein front surface of the PCB board is provided with a plurality of structural members, a camera seat unit, an audio seat unit, a functional seat unit, a holder seat and a battery seat with shockproof and shakeproof functions; wherein each of the structural members is dispersedly fixed on a side of the PCB board, wherein the structural member screws and fixes the PCB board inside the cabinet, and wherein each of the seats and the PCB board are coated with waterproof coating.

A motherboard with shockproof, shakeproof and waterproof functions is installed in a cabinet of an electronic device, the motherboard includes a PCB board, wherein front surface of the PCB board is provided with a plurality of structural members, a camera seat unit, an audio seat unit, a functional seat unit, a holder seat and a battery seat with shockproof and shakeproof functions; wherein each of the structural members is dispersedly fixed on a side of the PCB board, wherein the structural member screws and fixes the PCB board inside the cabinet, and wherein each of the seats and the PCB board are coated with waterproof coating.

Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a carrier plate including a first surface to face a heatsink; a second surface opposite the first surface, and an aperture extending between the first and second surfaces, the aperture dimensioned to surround a semiconductor device, and a spring carried by the carrier plate, the spring to contact a surface of the semiconductor device proximate an outer edge of the semiconductor device.

A relay assembly comprises a vital relay used in a vital circuit and configured to be rack-installed in an equipment room in a railroad case or a railroad housing for providing a modular solid-state current-limiting. The relay assembly further comprises a plurality of vital relay contacts to which a current flow is restricted by a single supply solid-state current limiter. The relay assembly further comprises a relay socket base assembly coupled to the vital relay. The relay socket base assembly includes a relay socket base including a plurality of vital relay contact prongs, a plug assembly including a plurality of printed circuit board (PCB) mounted contact terminals, and a plurality of contact terminals that provide a connection between the plurality of vital relay contact prongs and the plurality of printed circuit board (PCB) mounted contact terminals. The relay assembly further comprises an ancillary electrical control module.

A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a circuit board and a package mounted thereon. The larger solder balls are accommodated by recessing each ball in the package substrate, the circuit board, or both the package substrate and the circuit board. Additionally, a ball attach method for mounting a plurality of solder balls having different average diameters is disclosed.

A housing for electronic components, for example, for a control unit of a vehicle is disclosed. The housing comprises a housing element having an upper wall and a peripheral wall surrounding three sides of the housing element, the upper wall and the peripheral wall defining an interior for receiving one or more electronic components, the housing element having on one side a substantially U-shaped receiving portion for receiving a connection element. The housing element may have a ventilation portion configured to allow a gas flow between the interior and the exterior of the housing element. The ventilation portion comprises a flow chamber having first and second opening, the first opening communicating with the atmosphere and the second opening communicating with the interior of the housing element. A corresponding control unit comprising such a housing is also disclosed.

A housing for electronic components, for example, for a control unit of a vehicle is disclosed. The housing comprises a housing element having an upper wall and a peripheral wall surrounding three sides of the housing element, the upper wall and the peripheral wall defining an interior for receiving one or more electronic components, the housing element having on one side a substantially U-shaped receiving portion for receiving a connection element. The housing element may have a ventilation portion configured to allow a gas flow between the interior and the exterior of the housing element. The ventilation portion comprises a flow chamber having first and second opening, the first opening communicating with the atmosphere and the second opening communicating with the interior of the housing element. A corresponding control unit comprising such a housing is also disclosed.