Techniques and mechanisms for providing socket connection to a substrate. In an embodiment, a socket device includes a first socket body portion that is to provide for signal exchanges as part of a socket connector including the first socket body portion and a second socket body portion. The first socket body portion and the second socket body portion comprise respective zones, wherein, of the two zones, only one such zone has a first electro-mechanical characteristic. The first electro-mechanical characteristic is selected from the group consisting of an interconnect dimension, an interconnect material, an interconnect structure, a socket body material, and a shielding structure. In another embodiment, modular socket sub-assemblies each comprise a respective one of the first zone and the second zone.

A contacting device having a carrier and at least one contacting unit, wherein the carrier has a bottom side and a top side, the top side of the carrier having a plurality of mutually insulated conductive tracks, the contacting unit having a plurality of contact elements that at least partially are formed of an electrically conductive material and in each case are mutually electrically insulated, each contact element along a longitudinal axis being composed of at least one fixing section and a contacting portion adjoining the fixing section, each fixing section being supported on the top side of the carrier, having a first contact surface and being positively and conductively connected to one of the conductive tracks, each contacting portion having a distance to the top side varying between zero and a maximum distance.

A surface-mountable socket has a wiping function. A socket 100 of the present technology can be surface-mounted to a board 210. The socket 100 includes a plurality of contacts 110, and each contact 110 includes a contact portion 112 that can contact a terminal of a semiconductor device, a locking portion 116 connected to the contact portion 112, and a board-side contact portion 118 that extends from the locking portion 116 and can contact a conductive region formed on a board surface. The socket 100 further includes a stopper member 120 that holds the locking portion 116 of the plurality of contacts 110 and a guide member 180 that is disposed so as to oppose the stopper member 120, and the guide member 180 is formed with a plurality of through holes 184 that houses a board-side contact 118 protruding from the stopper member.

This disclosure relates to a method of fabrication contact pins 24 used in testing circuit components, typically integrated circuits and the contact pins themselves. It is desirable to selectively radius certain portions of each pin to achieve desired performance of the entire pin. The portion to be radiused is cut to the desire shaped from a blank material. The portion which is not to be radiused is not cut to its final shape from the blank but to a larger shape which includes the material for the final shape. The entire cut portion is then treated to shape or round all exposed edges. Then the remaining portion of the pin is cut out from the larger blank area which was previously retained, leaving those portions with non-radiused edged.

An electric component socket in which a pressing member is not brought into contact with the tip end of the a contact pin when the socket is pressed by the pressing member in a state where an electric component is not housed in the socket. The electric component socket is provided with a movable plate supported so as to move vertically, a floating plate that is provided above the movable plate and houses the electric component, and a movable spacer that protrudes upward from an upper surface of the movable plate. The electric component socket is configured so that the movable plate is thereby moved downward, thereby enabling the regulating section of the movable plate to move the contact pin downward when the movable spacer is moved downward.

A power electronic module including at least one pair of power electronic components, each pair including a first and a second component, each component including a first face, configured to be supported on a support and a second face configured to be electrically connected to an electrical circuit with a smaller thermal contact area than the contact area between the first face and the support, and a first and a second support. The first component in each pair is supported by the first support and is connected to a second electrical circuit of the second support and the second component in each pair is supported on the second support and is connected to a first electrical circuit of the first support.

A contacting device having a carrier and at least one contacting unit, wherein the carrier has a bottom side and a top side, the top side of the carrier having a plurality of mutually insulated conductive tracks, the contacting unit having a plurality of contact elements that at least partially are formed of an electrically conductive material and in each case are mutually electrically insulated, each contact element along a longitudinal axis being composed of at least one fixing section and a contacting portion adjoining the fixing section, each fixing section being supported on the top side of the carrier, having a first contact surface and being positively and conductively connected to one of the conductive tracks, each contacting portion having a distance to the top side varying between zero and a maximum distance.

Techniques and mechanisms for providing socket connection to a substrate. In an embodiment, a socket device includes a first socket body portion that is to provide for signal exchanges as part of a socket connector including the first socket body portion and a second socket body portion. The first socket body portion and the second socket body portion comprise respective zones, wherein, of the two zones, only one such zone has a first electro-mechanical characteristic. The first electro-mechanical characteristic is selected from the group consisting of an interconnect dimension, an interconnect material, an interconnect structure, a socket body material, and a shielding structure. In another embodiment, modular socket sub-assemblies each comprise a respective one of the first zone and the second zone.

A processor package module includes a socket having a first side and a second side, where the second side includes interconnect joints. The socket further includes a root complex and a non-root complex over the first side. An interconnect layer is on the first side of the socket and has one or more levels of routing traces. A first set of socket pins connects the root complex and non-root package to the interconnect layer, where the first set of socket pins terminate at the interconnect layer.