An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.

An electronic module includes a module substrate has an upper surface and a lower surface. The module substrate has a package pad array having package contact pads at the upper surface. The module substrate has a socket pad array having socket contact pads at the upper surface. The module substrate has guide pin locating pads associated with the socket pad array. The electronic module has an electronic package coupled to the package contact pads at the package pad array. The electronic module has guide pins surface mounted to the guide pin locating pads. The electronic module has a socket assembly coupled to the module substrate. The socket assembly has a socket housing holding socket contacts. The socket contacts are coupled to the socket contact pads at the socket pad array. The socket frame including pockets receiving the guide pins to locate the socket assembly relative to the module substrate.

Example devices include a graphics processing unit (GPU), a central processing unit (CPU), and a vapor chamber. The 0 vapor chamber includes a first side in contact with the CPU and a second side in contact with the GPU. In addition, the vapor chamber includes a fluid disposed therein that is to vaporize to transfer heat from the GPU and the CPU.

A socket connector includes an array of socket contacts arranged in rows and columns. The socket contacts have upper mating interfaces for mating with a first electronic package and lower mating interfaces for mating with a second electronic package. The socket contacts are configured to electrically connect the first and second electronic packages. Each socket contact includes an upper cap, a lower cap, and a spring beam helically coiled between the upper cap and the lower cap. The spring beam is compressible. The upper cap, the lower cap and the spring beam are additive manufactured such that the upper cap, the lower cap and the spring beam form a unitary, three-dimensional conductive structure to electrically connect the first and second electronic packages.

A power delivery module includes a frame having rails defining an opening that receives an electronic package. A bottom of the frame is mounted to a host circuit board and faces an upper surface of the electronic package. The frame is a layered structure including a power plate, a ground plate, and an insulator electrically isolating the power plate from the ground plate. The power deliver module includes module power contacts electrically connected to the power plate and extending from the bottom for electrical connection to package power contacts of the electronic package. Module ground contacts are electrically connected to the ground plate and extend from the bottom for electrical connection to package ground contacts of the electronic package. The module power contacts and the module ground contacts deliver power to the electronic package.

An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.

A power delivery module includes a frame having rails defining an opening that receives an electronic package. A bottom of the frame is mounted to a host circuit board and faces an upper surface of the electronic package. The frame is a layered structure including a power plate, a ground plate, and an insulator electrically isolating the power plate from the ground plate. The power deliver module includes module power contacts electrically connected to the power plate and extending from the bottom for electrical connection to package power contacts of the electronic package. Module ground contacts are electrically connected to the ground plate and extend from the bottom for electrical connection to package ground contacts of the electronic package. The module power contacts and the module ground contacts deliver power to the electronic package.

There is described a modular connector receptacle comprising a shield and a modular connector assembly. The shield comprises an electrically-conductive material, and comprises a lumen defining an inner surface which comprises a thread. The modular connector assembly comprises peripheral winglets which engage with the thread of the inner surface of the lumen for screwably housing the modular connector assembly inside the shield. The peripheral winglets are electrically conductive, thus providing a ground. Low-pass filters are provided on a PCB in the modular connector assembly, and the PCB comprising the low-pass filters can have a PCB shield enclosing the PCB and electrically connected to the peripheral winglets for grounding to the shield.

An electronic assembly includes an electronic package having an integrated circuit component and interposer assemblies with compressible interposer contacts electrically connected thereto. Cable connector modules are coupled to the interposer assemblies. A cover assembly is coupled to the upper surface of the electronic package over the cable connector modules. The cover assembly includes bridge assemblies having plates in a plate stack that are independently movable. A load plate engages upper edges of the plates of the bridge assemblies and press against the plates to drive the bridge assemblies into the cable connector modules using compression hardware. The cable connector modules compress the interposer contacts of the interposer assemblies when the load plate presses the plates of the bridge assemblies into the cable connector modules.

The present disclosure provides a reverse clamping compression device for CPO or NPO. The device includes a mechanical bolster placed on a main board, a compression cover covering optical modules, and a fastening connecting and fixing the compression cover to the mechanical bolster and protruding below the mechanical bolster. In the present disclosure, the compression cover above the optical modules is used to apply a compression force to the optical modules, and the spring element is placed in space below the main board, therefore, the space above the compression cover is not occupied, which can maximize the use of the space above the optical modules, greatly shorten the heat conduct path of the heat sink module, and ensure that the entire device is still assembled from top to bottom.