An electrical assembly may include a contactor, a bus bar connected to the contactor, a bracket connected to the bus bar, a flexible circuit electrically connected to the contactor, and/or a cooling member connected to the bracket. A method of assembling an electrical assembly may include disposing a flexible circuit at least partially on and/or in the bracket, connecting a bus bar with the one or more contactors, connecting the bus bar with the bracket, electrically connecting the flexible circuit to the one or more contactors, disposing a cooling member on or about the bracket, and/or connecting the cooling member with the bracket.

A piezoelectric cooling system and method for driving the cooling system are described. The piezoelectric cooling system includes a first piezoelectric cooling element and a second piezoelectric cooling element. The first piezoelectric cooling element is configured to direct a fluid toward a surface of a heat-generating structure. The second piezoelectric cooling element is configured to direct the fluid to an outlet area after heat has been transferred to the fluid by the heat-generating structure.

An apparatus can be employed as a mobile wireless order point and pick-up station. The apparatus can be configured to house a display device and to allow the display device to be used in many different locations for the purpose of receiving and/or picking up orders. To facilitate its mobility, the apparatus can include an integrated pallet jack and be configured with wireless communication capabilities and a portable power source. The apparatus may also include a retractable awning which can serve to provide shading to the display device to facilitate its use and to reduce heating when the apparatus is used in an outdoor environment.

A cooling system for a capacitor may include a housing for the capacitor, the housing comprising of a bottom surface, a top surface, and at least one side surface connecting the bottom surface and the top surface, the housing further including: a bottom inlet manifold and a bottom outlet manifold extending along the bottom surface; an inlet side channel extending along the side surface, the inlet side channel being in fluid communication with the bottom inlet manifold; an outlet side channel extending along the side surface, the outlet side channel being in fluid communication with the bottom outlet manifold; a top inlet manifold extending along the top surface, the top inlet manifold being in fluid communication with the inlet side channel; and a top outlet manifold extending along the top surface, the top outlet manifold being in fluid communication with the outlet side channel.

A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.

An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

According to an embodiment of the disclosure, a wearable electronic device may include a housing, a first printed circuit board (PCB), a second PCB disposed in parallel with the first PCB, a first interposer, and a second interposer, and the housing may include at least one first opening formed on a first portion, and the first interposer and the second interposer may be disposed between the first PCB and the second PCB, the first interposer and the second interposer may be disposed to have a first end of the first interposer and a second end of the second interposer facing the first end, spaced apart by a designated distance, and a first space between the first end and the second end may be connected to the at least one first opening of the housing. Various other embodiments are possible.

A server device includes a casing, an electronic assembly, a cover, and a heat dissipation device. The electronic assembly includes a circuit board and at least one heat source. The circuit board is disposed on the casing, and the heat source is disposed on the circuit board. The cover is removably disposed on the casing. The heat dissipation device includes at least one air cooling heat exchanger and at least one liquid cooling heat exchanger. The air cooling heat exchanger is fixed on and thermally coupled with the heat source. The liquid cooling heat exchanger is fixed on the cover and thermally coupled with the air cooling heat exchanger.

A protective shroud includes a top plate, a first side plate that is adapted to be disposed proximate a first edge region of a plurality of cooling fins of a heat exchanger for an integrated circuit, and a second side plate that is adapted to be disposed proximate a second edge region of the plurality of cooling fins.

A housing for electronic components, for example, for a control unit of a vehicle is disclosed. The housing comprises a housing element having an upper wall and a peripheral wall surrounding three sides of the housing element, the upper wall and the peripheral wall defining an interior for receiving one or more electronic components, the housing element having on one side a substantially U-shaped receiving portion for receiving a connection element. The housing element may have a ventilation portion configured to allow a gas flow between the interior and the exterior of the housing element. The ventilation portion comprises a flow chamber having first and second opening, the first opening communicating with the atmosphere and the second opening communicating with the interior of the housing element. A corresponding control unit comprising such a housing is also disclosed.