Methods and apparatus to manage noise in computing systems are disclosed. An example server includes a housing to at least partially contain components of the server, a transducer to output an indication of noise detected outside of the housing, machine readable instructions, and programmable circuitry to at least one of instantiate or execute the machine readable instructions to adjust the operation of the server based on the output of the transducer to reduce noise.

A number of slots in a chassis of an information handling system and a number of a plurality of sleds to be housed in the chassis may be determined. An airflow for each of the plurality of sleds in each of the plurality of placement configurations may be determined based, at least in part, on the number of slots in the chassis and the number of the plurality of sleds to be housed in the chassis. A recommended placement for each of the sleds may be determined based at least in part on the airflow for each of the plurality of sleds for the plurality of placement configurations. A notification may be generated comprising the recommended placements for each of the plurality of sleds.

An electronic device includes a first body including a first part and a second part hinged to each other, a second body, and a hinge structure hinged between an edge of the second body and the second part. The first part has a recess. When the second body is unfolded relative to the first body from a folded state to a first unfolded state, the hinge structure pushes against the first part to rotate the first part relative to the second part. When the second body is continuously unfolded relative to the first body from the first unfolded state to a second unfolded state, the edge of the second body pushes against the first part, so that the first part continues to rotate relative to the second part. When the second body is in the folded state, the hinge structure is at least partially accommodated in the recess.

Provided is an electronic apparatus, including a heat generating element, a heat dissipation module, and a control unit. The heat dissipation module is adapted for performing heat dissipation on the heat generating element. The control unit is coupled to the heat dissipation module and is adapted for measuring temperature variation of at least one temperature module and state variation of at least one system component and for adjusting the heat dissipation module via a control signal based on the state variation and the temperature variation. In addition, a dynamic heat dissipation control method and a dynamic heat dissipation control system are also provided.

An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.

A fan control circuit for controlling at least one fan of a power supply device includes a load sensing unit, a temperature sensing unit, a control unit connected to the load sensing unit, the temperature sensing unit and the fan, and a mode switching unit. The load sensing unit generates a load signal according to an output condition of the power supply device. The temperature sensing unit senses the temperature in the power supply device and generates a temperature signal. The control unit comprises a low-speed operating mode for controlling the fan according to the load signal, a mute mode for controlling the fan according to the temperature signal, and a full-speed operating mode for controlling the fan to run in a rated rotational speed. The mode switching unit controls the control unit to adjust the rotational speed of the fan by one of the three modes.

Apparatuses, systems, and techniques to cool computer processors. In at least one embodiment, a system comprises one or more processors and a heatsink connected by a flexible heat conduit to the one or more processors, and a position of the heatsink is adjustable.

An information handling system includes a plurality of computing devices, and at least one environmental management unit external to the plurality of the computing devices and configured to manage an internal environment of the information handling system.

A cooling system is described. The cooling system includes a support structure, a cooling element, and drive electronics. The cooling element has a central axis and is supported by the support structure at the central axis. First and second portions of the cooling element are on first and second sides of the central axis and unpinned. The first and second portions of the cooling element undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The cooling element further has first and second piezoelectrics having opposite polarizations. The first piezoelectric is part of the first portion of the cooling element. The second piezoelectric is part of the second portion of the cooling element. The drive electronics drive the first and second portions of the cooling element using a single drive signal.

In one embodiment, a method for managing a heatsink of an information handling system includes: determining, by a controller unit of the information handling system, that a vibration event is to occur, the vibration event associated with a vibration unit of the information handling system, the controller unit communicably coupled to the vibration unit, the vibration unit removably coupled to the heatsink; and causing, by the controller unit, the vibration unit to generate the vibration event, the vibration event causing the vibration unit to apply one or more vibrations to the heatsink, the one or more vibrations causing a boundary layer of particles to be removed from a surface of the heatsink.