A memory cooler includes a unitary thermal transfer device and a pair of endcaps. The unitary thermal transfer device includes heat transfer tubes, a first end block, a second end block, an inlet chamber, an outlet chamber, an inlet, and an outlet. The first and second end blocks are structurally integrated with each of the heat transfer tubes. The inlet and outlet chambers are partially defined by either the first end block or the second end block. Each of the inlet and outlet chambers are fluidly coupled with the respective liquid flow channel of the at least one heat transfer tube. The respective flow channels to which the inlet and outlet chambers are coupled may be the same or different to define either a direct or a serpentine flow path. Each endcap is affixed to a respective one of the first end block and the second end block to define, in conjunction with the first end block and second end block, the inlet chamber and the outlet chamber.

A wearable electronic device is disclosed. The device can include a support structure and an electronic component disposed in or on the support structure. A heat exchanger element can be thermally coupled with the electronic component, the heat exchanger element comprising a fluid inlet port and a fluid outlet port. A first conduit can be fluidly connected to the fluid inlet port of the heat exchanger, the first conduit configured to convey, to the heat exchanger, liquid at a first temperature. A second conduit can be fluidly connected to the fluid outlet port of the heat exchanger, the second conduit configured to convey, away from the heat exchanger, liquid at a second temperature different from the first temperature.

A heat dissipation structure including a plurality of heat dissipating members, and a support plate for supporting the heat dissipating members. Each of the heat dissipating members includes a plurality of cushion members each having a hollow or a solid shape, and a heat conduction sheet covering an outer surface of the cushion members. The support plate includes a plurality of grooves for supporting the heat dissipating members in a direction orthogonal to a longitudinal direction of the heat dissipating members. Each of the grooves is a curved recess portion formed in a thickness direction, opened to the side of the heat dissipating member, formed to have a radius of curvature larger than a radius of curvature of the heat dissipating member, and to have a depth smaller than a circular conversion diameter of the heat dissipating member, and a battery provided with the heat dissipating structure.

A cooling system for a circuit board includes a conforming layer that conforms to the profile of the circuit board, including a base and at least one heat generating component. A cap is connected to the conforming layer and offset from the conforming layer with a gap. A working fluid is flowed through the gap and used to cool the heat generating component. This allows for a low-cost and flexible cooling system for a circuit board without a redesign of a cold plate with each change to the circuit board.

A wire harness unit including: a conduction path that conducts electricity between in-vehicle devices; and a cooling tube that cools the conduction path, wherein: the conduction path has a hollow tubular conductor having conductivity, and a tubular first insulating layer covered by the tubular conductor, and the first insulating layer is the cooling tube and configured to circulate a cooling medium therethrough.

A method includes receiving a power supply unit (“PSU”) replacement signal for a power supply chassis that includes plurality of supply enclosures. Each power supply enclosure includes a plurality of power supply units (“PSUs”). Each of the PSUs in the power supply enclosures is connected to a power bus powering computing equipment. PSU redundancy policy has at least one PSU being redundant. In response to the PSU replacement signal, the method calculates a power cap limit equal to a capacity of the plurality of supply enclosures that are not being removed. Power consumption of the computing equipment is limited to the power cap limit. In response to detecting a replacement power supply enclosure, the method recalculates the power cap limit based on all of the PSUs according to the PSU redundancy policy. Power consumption of the computing equipment is limited to the recalculated power cap limit.

A liquid-cooling heat sink is disclosed which includes a substrate, a cover and a separator. The substrate includes a plate, a set of first heat sinking fins and a set of second heat sinking fins. The cover has water inlet and outlet ports. The cover and the plate together delimit a heat exchange chamber in which both the set of first heat sinking fins and the set of second heat sinking fins are confined. The separator is disposed between the set of first heat sinking fins and the set of second heat sinking fins to divide the heat exchange chamber into a water inlet compartment and a water outlet compartment. The water inlet compartment and water outlet compartment are in communication with the water inlet and outlet ports respectively. The liquid-cooling heat sink has not only enhanced overall structural strength but also improved heat exchange efficiency with a coolant fluid.

A middle bezel frame with heat dissipation structure includes a main body, which includes a frame portion and at least one heat-exchange portion. The frame portion is located around and connected to the heat-exchange portion. The heat-exchange portion internally has an airtight chamber, in which at least one wick structure and a working fluid are provided. With these arrangement, the middle bezel frame has enhanced structural strength while provides good heat dissipation effect.

An electrical connector assembly includes a connector housing, a planar busbar having a rectangular cross section defining two opposed major surfaces and four minor surfaces, a cooling plate that is sized, shaped, and arranged to be in conductive thermal contact with a first major surface of the planar busbar, and an L-shaped busbar partially disposed within the connector housing having a first end connected to an electrical terminal and having a second end attached to, and in conductive thermal contact with, a second major surface of the planar busbar. The cooling plate is configured to reduce a temperature of the planar busbar and the attached L-shaped busbar. A method of assembling such an electrical connector is also presented.

Obtained is a power conversion device that suppresses size increase thereof while improving cooling performance for a smoothing capacitor. The power conversion device includes: a cooler having a cooling surface on an outer side thereof and a flow path on an inner side thereof, the flow path being formed such that a coolant flows through the flow path; and a smoothing capacitor fixed to the cooler, the smoothing capacitor being thermally connected to the cooling surface with a heat transfer member therebetween and configured to smooth DC power. A thickness of the heat transfer member between the smoothing capacitor and a portion, of the cooling surface, to which the smoothing capacitor is thermally connected is set to be smaller than a wall thickness of the cooler between the flow path and the portion, of the cooling surface, to which the smoothing capacitor is thermally connected.