Patent classifications
H05K7/20272
COOLING BATH FOR MULTIPROCESSOR CIRCUIT BOARDS
A system and a method are disclosed for a cooling bath designed to provide a sufficient and evenly distributed coolant flow throughout the bath. The cooling system includes a holding unit with a coolant distribution chamber that will distribute coolant through multiple distribution pipes beneath device chambers, promoting even distribution of coolant through the device chambers. An external pump causes coolant to be expelled from the cooling bath. The flow of coolant expelled from the cooling bath is controlled in a coolant separation chamber with a separation layer that bisects the coolant separation chamber. The separation layer is perforated with calibrated holes to slow down the speed of coolant exiting the cooling bath to prevent a funnel effect, protect the device chambers from coolant waves and coolant level fluctuation generated by the pump, and evenly distribute removal of hot coolant from the cooling bath.
ELECTRONIC DEVICE
An electronic device includes a first housing and a second housing connected to the first housing. An accommodation cavity is formed between the first housing and the second housing. The electronic device further includes a heat generation member arranged in the accommodation cavity and a flow channel arranged in the first housing. The flow channel is configured to accommodate heat exchange liquid and dissipate heat for the heat generation member through the heat exchange liquid.
LIQUID COOLING SYSTEM FOR COMPUTERS
A system for cooling computer hardware includes a first heat exchanger and a pump. The first heat exchanger includes a computer hardware contact surface configured to be in thermal contact with the computer hardware on a first side and to be in thermal contact with a cooling liquid on a second side. The first heat exchanger also includes a liquid chamber having a pump interface with at least one chamber inlet and at least one chamber outlet. The pump includes a chamber interface with at least one pump outlet and at least one pump inlet. The pump is configured to: detachably connect at the chamber interface to the pump interface, and drive the cooling liquid from a second heat exchanger to the at least one pump outlet and from the at least one a pump inlet to the second heat exchanger.
LIQUID COOLING DEVICE FOR THE ARRANGEMENT OF A POWER SEMICONDUCTOR DEVICE
A liquid cooling device with a main body has a planar surface for the arrangement of a power semiconductor device. This main body has a first end face and a second end face opposite said first one, and a plurality of tubular cooling recesses extending from the first to the second end face. A first swirling element arranged in an associated cooling recess, wherein the swirling element has an operative section arranged within the associated cooling recess and a locking section, wherein the locking section interacts with a locking abutment and/or with a further swirling element, and therefore prevents rotation of the operative section in the associated recess.
LIQUID COOLING JACKET AND COOLING DEVICE
A liquid cooling jacket includes a refrigerant flow path which is a flow path having a width in a second direction and in which a heat dissipation assembly is located on a first side in a third direction, where a direction in which a refrigerant flows is defined as a first direction. The refrigerant flow path includes a narrow flow path portion. A width in the third direction of the narrow flow path portion is smaller than a width in the third direction of a flow path on a first side in the first direction with respect to the narrow flow path portion and a width in the third direction of a flow path on a second side in the first direction with respect to the narrow flow path portion.
IMMERSION TANK, INFORMATION PROCESSING APPARATUS, AND METHOD OF COOLING
An immersion tank is used for cooling an electronic circuit. The immersion tank includes a tank body that stores coolant, a housing that is provided inside the tank body and that houses the electronic circuit, a moving member movably supported relative to the tank body, a supply hole which is formed in the housing and through which the coolant is supplied to an inside of the housing, an opening/closing member that is displaced from a closed position at which the opening/closing member closes the supply hole to an open position at which the opening/closing member opens the supply hole, and an operatively associated mechanism that displaces the opening/closing member in accordance with movement of the moving member.
Liquid cooling high-density pluggable modules for a network element
A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.
LIQUID COOLING STRUCTURE WITH LOW-FORCE QUICKSEAL JOINTS FOR CARRYING COOLANT, CABINET, AND SERVER
A liquid cooling structure for a server with low-force quickseal joints to carry the coolant includes a first support, a first joint, a second support, a second joint, a first magnet, and a second magnet. The first support is set on the cabinet body. The second support is set on the server body. The first joint is set on the first support. The second joint is arranged on the second support and can be coupled with the first joint. The first magnet is set on first support. The second magnet is set on second support. The first magnet and second magnet with opposite magnetism attract each other to reduce the amount of force required for coupling the first joint and the second joint, and is labor-saving.
Electrical assembly
An electrical assembly may include a contactor, a bus bar connected to the contactor, a bracket connected to the bus bar, a flexible circuit electrically connected to the contactor, and/or a cooling member connected to the bracket. A method of assembling an electrical assembly may include disposing a flexible circuit at least partially on and/or in the bracket, connecting a bus bar with the one or more contactors, connecting the bus bar with the bracket, electrically connecting the flexible circuit to the one or more contactors, disposing a cooling member on or about the bracket, and/or connecting the cooling member with the bracket.
Electronic equipment for a vehicle
An electronic device for a motor vehicle, includes a first housing portion to receive one or more first electronic components, a second housing portion to receive one or more second electronic components, the second housing assembled with the first housing, and a coolant fluid inlet and a coolant fluid outlet, a coolant channel being provided in the electronic device for the coolant fluid flowing from the inlet to the outlet so as to cool all or part of the first electronic components and/or all or part of the second electronic components, said channel having, over most of the course thereof in the device, in particular over the whole of the course thereof in the device, a section perpendicular to the flow direction of the fluid which is: exclusively provided in the first housing portion or exclusively provided in the second housing portion.