In one aspect, thermal management units are described herein which, in some embodiments, offer one or more advantages compared to other units for managing or controlling thermal energy. In particular, units and systems described herein incorporate one or more phase change materials (PCMs), such as one or more PCMs having a certain phase transition temperature, latent heat, and/or phase transition type. The PCMs are contained in equipment housing with the application of various components to provide management or controlling of thermal energy.

An electronic device and a control method for controlling the electronic device is disclosed. The electronic device includes: a middle frame; a heat source mounted on the middle frame; a housing having a heat dissipation area and a non-heat-dissipation area, the heat source being located between the heat dissipation area and the middle frame, and a heat dissipation coefficient of the heat dissipation area being higher than that of the non-heat-dissipation area; and a processing module, configured to adjust heat dissipation power of the heat dissipation area according to a temperature of a non-contact position of the housing and a measured temperature of a contact position of the housing.

A cooling apparatus (100) cools a heat-generating instrument, such as an electronic instrument (2), installed in an installation apparatus. The cooling apparatus (100) includes a refrigerant flow path configured circularly by sequentially connecting a pump (1) that circulates a refrigerant in a liquid state, a cooler (3) that cools the heat-generating instrument with the refrigerant, and a radiator (5) that cools the refrigerant. The cooling apparatus (100) includes a discharge-side heat exchanger (7) provided in a flow path from the pump (1) to the cooler (3) in the refrigerant flow path, a suction-side heat exchanger (8) provided in a flow path from the radiator (5) to the pump (1) in the refrigerant flow path, and a Peltier device (9) that is provided between the discharge-side heat exchanger (7) and the suction-side heat exchanger (8), and transfers heat from the refrigerant flowing through the suction-side heat exchanger (8) to the refrigerant flowing through the discharge-side heat exchanger (7).

A heat exchange system for heat dissipation of an electronic control assembly includes: a first heat exchange portion including a first end having a first communication port and a second end having a second communication port; a second heat exchange portion including a first end having a third communication port and a second end having a fourth communication port, and at least a part of the second heat exchange portion being configured to be in contact with the electronic control assembly; a first connection tube communicating the first communication port with the third communication port; and a second connection tube communicating the second communication port with the fourth communication port. The first and second heat exchange portions and the first and second connection tubes constitute a loop, the loop has an opening, and the opening is closed when the heat exchange system is in an operative state.

A computer system includes a mist cooling system. The mist cooling system suspended droplets of dielectric fluid in air to form a mist and conveys the mist to heat producing components of the computer system. The liquid droplets of the mist wet the heat producing components and remove waste heat as part of a phase change from a liquid phase to a vapor phase. Vaporized dielectric fluid is condensed via a heat exchanger in a chassis of the computer system and is returned to a reservoir for use in generating mist.

A heat dissipating device includes a thermosyphon, a first liquid cooling tube and a first heat dissipating fin set. The thermosyphon has an evaporation portion and a condensation portion. The first liquid cooling tube is sleeved on the condensation portion. The first heat dissipating fin set is sleeved on the first liquid cooling tube.

An illustrative example embodiment of an antenna device includes a substrate, a plurality of antenna elements supported on the substrate, an integrated circuit supported on one side of the substrate, and a metallic waveguide antenna situated against the substrate. The metallic waveguide antenna includes a heat dissipation portion in a thermally conductive relationship with the integrated circuit. The heat dissipation portion is configured to reduce a temperature of the integrated circuit.

A cooling plate module includes a first cooling plate layer having a single phase area within and a second cooling plate layer having a phase change area within. The first cooling plate layer includes a first liquid inlet port to receive a first cooling liquid into the single phase area and a first liquid outlet port to expel the first cooling liquid from the single phase area. The second cooling plate layer includes a second liquid inlet port to receive a second cooling liquid into the phase change and a vapor outlet port to expel the second cooling liquid in a vapor state from the phase change area, where the first cooling plate layer is in thermal contact with the second cooling plate layer, and the first cooling plate layer is in thermal contact with IT components to be cooled.

An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat transfer rail extending along an edge of circuit board and coupled to the heat generating component, a housing covering the circuit board, and a heat transfer clamp between the heat transfer rail and the housing. The heat transfer clamp includes a flexible, heat conductive layer having a first portion in thermal contact with the heat transfer rail and a second portion in thermal contact with the housing. The first and second portions are thermally coupled, and a clamp and a compressible layer thereon extends between the first and second portions of the flexible, heat conductive layer.

Disclosed is thermal management device that combines a vapor chamber with a mechanical heat sink to provide improved cooling performance under extreme conditions—the vapor chamber and heat sink combination comprises a single-unit device where the vapor chamber side of the device is in direct contact with the heat source and the opposite side of the vapor chamber is equipped with cooling fins that mate with cooperatively sized fins on the heat sink portion of the device.