An apparatus including: a base plate; a guide rail being disposed on the base plate; a sliding bar with a first side being disposed on the guide rail, wherein the sliding rail includes a wedge on a second side of the sliding bar opposite the first side; and a heat sink, wherein the base plate and the heat sink form a slot for insertion of a pluggable module at a front of the slot.

The invention relates to a module housing made of plastic, in particular a thermosetting polymer, with an embedded cooling element and at least one screw sleeve, which has a collar with an exposed mounting surface with which the module housing can be mounted on a support functioning as an external heat sink. The cooling element and the at least one screw sleeve form a monolithic element with which heat can be conducted from the cooling element to the support via at least the mounting surface.

A solid-state drive device includes a first module including a first region containing a volatile main memory device and a controller device and a second region containing a first nonvolatile memory device, a second module disposed on the first module and having a third region containing a second nonvolatile memory device, the second module being connected to the first module, and a heat dissipating member disposed on the second module as vertically juxtaposed with the first and second modules. The heat dissipating member has a protruding portion protruding toward the first module and in direct thermal contact with the first region, and a plate-shaped portion having a main surface in direct thermal contact with the third region.

A heat sink faces an exhaust port of a blower fan in use, and includes: a first plate-shaped portion; a second plate-shaped portion disposed in parallel with the first plate-shaped portion having a gap therebetween; a plurality of fins that stand up between the first plate-shaped portion and the second plate-shaped portion and are disposed side by side with a gap therebetween to define an air flow path between the fins, through which air flows from the exhaust port; and a protrusion that is disposed at a part of each fin including a center of the upright height, and protrudes into the air flow path.

A method of producing a semiconductor module arrangement includes providing a first subassembly having a number N1 of first adjustment openings, a second subassembly having a number N2 of second adjustment openings and a third subassembly having a plurality of adjustment pins which are fixedly connected to one another, the first subassembly, the second subassembly and the third subassembly being independent of one another and not connected to one another. The first subassembly, the second subassembly and the third subassembly are arranged relative to one another in such a way that each of the adjustment pins engages into one of the first adjustment openings and/or into one of the second adjustment openings.

Electrical equipment comprising a cover, a circuit board, and a heatsink arranged to dissipate heat produced by the circuit board outwards from the electrical equipment, the heatsink comprising at least one free fin and at least one fastener fin, the electrical equipment being such that, when the electrical equipment is assembled, the free fin(s) extend(s) outwards from the electrical equipment without being covered by the cover, and the cover is snap-fastened to the fastener fin(s).

Provided is a circuit assembly that enables suppression of a decrease in heat dissipation properties. A circuit assembly includes a circuit board having a conductive path, a heat dissipation member on which the circuit board is placed, and an insulating layer that is interposed between the circuit board and the heat dissipation member. A surface of the heat dissipation member that faces the circuit board is a rough surface having protrusions and recessions, and the circuit board and the heat dissipation member are fixed to each other by the insulating layer penetrating the protrusions and recessions of the rough surface.

An immersion cooling system miniaturized by the omission of a pump and heat exchanger includes a first casing for containing a non-conductive coolant in which a heat-generating component is immersed, fins disposed on and located outside the first casing, and a second casing. The first casing is disposed in the second casing, and the second casing defines a first vent hole exposing the fins. The immersion cooling system dissipates heat by means of natural convection.

The disclosure provides a charger, a charging device, an energy supply device and a control method of the charger. The charger comprises a housing, a charging position, a charging port and a first heat dissipation unit. The charger comprises a base and a supporting part. The supporting part is arranged on the base. The charging position is arranged on the base and distributed around the supporting part. The charging port is arranged on the charging position and matched with a battery pack. The first heat dissipation unit is arranged on the supporting part for heat dissipation of the battery pack. With the charger of the disclosure, multiple battery packs can be charged at the same time.

Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes a thermally conductive enclosure with a sealed inner compartment, and a porous heat transfer element within the sealed inner compartment. The porous heat transfer element is sized and located to facilitate conducting heat from the electronic component across the sealed inner compartment of the thermally conductive enclosure. The pressure sensor senses pressure within the sealed inner compartment of the thermally conductive enclosure to facilitate identifying a pressure change indicative of a tamper event.