Patent classifications
H05K7/20481
PASSIVE THERMAL-CONTROL SYSTEM OF AN ELECTRONIC SPEAKER DEVICE AND ASSOCIATED ELECTRONIC SPEAKER DEVICES
This document describes a passive thermal-control system that can be integrated into an electronic speaker device and associated electronic speaker devices. The passive thermal-control system uses an architecture that combines heat spreaders and thermal interface materials to transfer heat from heat-generating electronic devices of the electronic speaker device to a housing component of the electronic speaker device. The housing component dissipates the heat to prevent a thermal runaway condition.
Thermal nanoparticles encapsulation for heat transfer
Systems and methods described herein can provide a thermal interface for an electronic device including: obtaining an enclosure and a circuit within the enclosure, wherein the circuit is disposed within the enclosure such that there is space between the circuit and an internal surface of the enclosure; and positioning a thermally conductive material in the space between the circuit and an internal surface of the enclosure such that the thermally conductive material is in physical contact with an outer surface of the circuit and the internal surface of the enclosure to provide heat transfer from the circuit to the enclosure.
MOBILE TERMINAL
There is disclosed a mobile terminal including a case comprising an electric control unit in which electronic components are loaded; a display unit coupled to a front surface of the case; a frame coupled to the case and supporting a rear surface of the display unit, the frame comprising a metallic material; a mainboard loaded in the case; a drive chip loaded in the mainboard; a shield can covering components loaded in the mainboard, the shied comprising a hole formed, corresponding to the drive chip; a thermal conductivity sheet comprising one surface in contact with a top surface of the drive chip and the other surface in contact with an inner surface of the frame; and a flexible material insertedly filling in a space formed between the thermal conductivity sheet and the frame, so that the heat generated in the drive chip of the mobile terminal may be effectively emitted and that only the portion of the mobile terminal, where the drive chip is loaded, may be prevented from being heated when the user is using the mobile terminal and the other components may be prevented from being damaged by the heat.
Thermal Pad and Electronic Device
A thermal pad and an electronic device comprising the thermal pad includes a first heat conducting layer and a second heat conducting layer. The first heat conducting layer is deformable under compression, and a heat conduction capability of the first heat conducting layer in a thickness direction of the first heat conducting layer is greater than a heat conduction capability of the first heat conducting layer in a plane direction of the first heat conducting layer. The second heat conducting layer is not deformable under compression, and a heat conduction capability of the second heat conducting layer in a plane direction of the second heat conducting layer is greater than or equal to a heat conduction capability of the second heat conducting layer in a thickness direction of the second heat conducting layer.
Thermal interface material structures for directing heat in a three-dimensional space
A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.
FLEXIBLE GRAPHITE STRUCTURE
Disclosed is a flexible graphite structure that can be used as a heat dissipation sheet of a flexible electronic device through a graphite sheet unit including a stretchable area formed as a cut area or an overlapping area. A disclosed flexible graphite structure includes: a graphite sheet unit comprising a single graphite sheet layer or multiple graphite sheet layers having at least one stretchable area; and a stretchable sheet layer configured to be attached to at least one of both outermost sides of the graphite sheet unit and to cover the at least one stretchable area, wherein the at least one stretchable area is formed by providing at least one pair of cutout areas in the single graphite sheet layer or by providing an overlapping area where the single graphite sheet layer or the multiple graphite sheet layers overlap.
HANDHELD ELECTRONIC DEVICE
A mobile phone may include a display, an enclosure enclosing the display and including a front cover positioned over the display and defining a front exterior surface, and a rear cover defining a rear exterior surface and a raised sensor array region along the rear exterior surface. The raised sensor array region may define a first hole and a second hole. The second hole may be defined by a first opening along an interior surface of the rear cover and having a first opening size and a second opening along the rear exterior surface of the rear cover and having a second opening size smaller than the first opening size. The mobile phone may further include a first camera having a first lens assembly extending into the first hole, and a second camera having a second lens assembly extending into the second hole.
RADIATIVE HEATSINK
A radiative heatsink includes a cold plate, a radiator mounted to the cold plate and a thermal compound located between and coupling the heat source to the cold plate. The thermal compound converts a portion of a first phononic thermal energy from the heat source into a first photonic near-field and a first photonic far-field thermal radiation and transfers the first photonic near-field, the first photonic far-field and the remaining of the first phononic thermal energy to the cold plate. The cold plate combines the first photonic near-field, the first photonic far-field and the remaining first phononic thermal energy into a second phononic thermal energy and provides the second phononic thermal energy to the radiator. The radiator converts the second phononic thermal energy into a second photonic near-field and a second photonic far-field and emits the second photonic near-field or the second photonic far-field such that cold plate is regenerated.
Thermal conduction sheet and heat dissipating device including thermal conduction sheet
Provided is a thermal conduction sheet, including graphite particles (A) of at least one kind selected from the group consisting of flake-shaped particles, ellipsoidal particles, and rod-shaped particles, in which: when the graphite particles (A) are flake-shaped particles, a planar direction of the graphite particles (A) is oriented in a thickness direction of the thermal conduction sheet, when the graphite particles (A) are ellipsoidal particles, a major axis direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, when the graphite particles (A) are rod-like particles, a longitudinal direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, the thermal conduction sheet has an elastic modulus of 1.4 MPa or less under a compression stress of 0.1 MPa at 150° C., and the thermal conduction sheet has a tack strength of 5.0 N.Math.mm or higher at 25° C.
Talc-filled polycarbonate compositions
The invention relates to the use of PMMI copolymers for reducing the decrease in molecular weight of the polymer induced by addition of talc in compositions based on aromatic polycarbonate. At the same time, the mechanical, optical and rheological properties of the thermoplastic composition, in spite of the addition of the PMMI copolymer, remain good and are in some cases even improved.