An apparatus including: a base plate; a guide rail being disposed on the base plate; a sliding bar with a first side being disposed on the guide rail, wherein the sliding rail includes a wedge on a second side of the sliding bar opposite the first side; and a heat sink, wherein the base plate and the heat sink form a slot for insertion of a pluggable module at a front of the slot.

A power converter apparatus includes a power module assembly including a power module and a cooler overlapping with the power module to allow the cooler to cover both sides of the power module, and a capacitor and a low voltage direct-current (DC)-DC converter (LDC) which are coupled in a state of pressing the power module assembly on both sides of the power module assembly.

Example implementations relate to a host device and a method for thermal management of a removable device, such as a pluggable electronic transceiver comprising a plurality of spring fingers that provide multipoint contact conduction cooling of the removable device. The host device includes a host circuit board having a connector, and a thermal management unit having a cooling component and the plurality of spring fingers. The cooling component is coupled to a portion of the host circuit board and includes a partially protruded portion. Each of the plurality of spring fingers includes a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of the removable device to allow waste-heat to transfer from the removable device to the cooling component through each spring finger.

An electrical device includes a housing part and a cover part, the cover part being connected to the housing part, in particular with the aid of screws, the cover part in particular covering an opening of the housing part. A first circuit board is connected to the cover part, and an elastically preloaded sheet-metal part, in particular an elastically preloaded tab section of a sheet-metal part, presses at least one heat-generating component, in particular a controllable semiconductor switch, in the direction of the cover part, in particular for the purpose of dissipating heat from the heat-generating component into the environment via the cover part.

A heat dissipation device (2) for an electronic component is disclosed. The heat dissipation device includes a heat dissipating component (20) disposed on a first side of the electronic component (1); at least one elastic element (30) arranged on a second side of the electronic component (1) opposite the first side; a pressure plate (40) arranged such that the at least one elastic element (30) is located between the pressure plate (40) and the electronic component (1), the pressure plate (40) being connected to a fixed structure to apply pressure to the electronic component (1) via the at least one elastic element (30) in the direction of the heat dissipating component (20). An AC-DC converter or a DC-AC converter or a DC-DC converter comprising the heat dissipation device, and a motor vehicle comprising the above converter are also disclosed.

A heat dissipation apparatus is provided. The apparatus includes: a bracket assembly including an accommodation portion used for accommodating a heat source component, a first opening, and a second opening; a heat sink. A heat conducting protrusion is disposed on a first surface of the heat sink, and the heat conducting protrusion extends into the accommodation portion through the second opening; and guide grooves are respectively provided in two side surfaces of the heat sink, and an extension direction of the guide grooves is inclined toward the first surface in an insertion direction of the heat source component; and fastening assemblies, each including a connecting member and a pressing member, where the pressing members are disposed on two sides of the bracket assembly, one end of the connecting member is slidably assembled in a guide groove located on a same side, and the other end abuts against a pressing member.

A fastening device is introduced. The fastening device includes a seat body, a first fastening body and a second fastening body. The seat body may be disposed on a first object; the first fastening body is movably provided in the seat body, the first fastening body cooperates with the seat body for fastening and unfastening, so that the first fastening body couples with or separates from a second object; the second fastening body is movably provided in the first fastening body, the second fastening body cooperates with the first fastening body for fastening and unfastening, so that the second fastening body couples with or separates from a third object.

Thermal management systems having pre-stressed biasing elements and related methods are disclosed. An example electronic component includes a circuit board, a processor coupled to the circuit board, and a thermally conductive structure positioned adjacent the processor. The thermally conductive structure is to dissipate heat generated by the processor. The electronic component includes a pre-stressed biasing element coupled to the thermally conductive structure and positioned between the processor and the thermally conductive structure. The pre-stressed biasing element is pre-stressed prior to attachment to the thermally conductive structure and the circuit board.

The present disclosure relates to a thermal coupling element, a method of manufacturing the coupling element, and a switchable arrangement for heat dissipation from electrical or electronic components of a motor vehicle.

A heat dissipating mechanism is used to dissipate heat generated by a heat generation component of an electronic device. The heat generation component is disposed on a circuit board. The heat dissipating mechanism includes a rotation component and a heat dissipation component. The rotation component is disposed on the circuit board. The heat dissipation component is rotatably disposed on the rotation component. The heat dissipation component includes a contacting surface and a fin body. The contacting surface is a bottom surface of the fin body and configured to contact against the heat generation component.