This document describes a passive thermal-control system that can be integrated into an electronic speaker device and associated electronic speaker devices. The passive thermal-control system uses an architecture that combines heat spreaders and thermal interface materials to transfer heat from heat-generating electronic devices of the electronic speaker device to a housing component of the electronic speaker device. The housing component dissipates the heat to prevent a thermal runaway condition.

An apparatus including: a base plate; a guide rail being disposed on the base plate; a sliding bar with a first side being disposed on the guide rail, wherein the sliding rail includes a wedge on a second side of the sliding bar opposite the first side; and a heat sink, wherein the base plate and the heat sink form a slot for insertion of a pluggable module at a front of the slot.

A data storage device includes a memory module including a circuit board, a plurality of light emitting elements and a light guiding unit. The light emitting elements are electrically connected to the circuit board. The light guiding unit includes a light-homogenizing plate and a light output portion. The plate is disposed between the light output portion and the light emitting elements. A light diffusion space is disposed between the plate and the light output portion. The light emitted by the light emitting elements propagates sequentially into the plate, the light diffusion space, and the light output portion and then is output through the light output portion.

Disclosed is an assembly (11) of an electronic board (22) and a heat sink (24), in particular for a motor-fan unit (10) of a motor vehicle, comprising an electronic board (22); a heat sink (24) comprising a plate (28) fastened to the electronic board (22), the surface of which has through-openings (30); and a thermal paste (26) arranged between the electronic board (22) and the plate (28).

A method of forming integrated power electronics packages by 3D-printing the PCB on and around power devices includes bonding a power device to a first surface of a cold plate and printing, using a 3D-printer, a circuit board on and around the power devices such that the circuit board includes one or more insulating portions and one or more conductive portions.

A thermal pad and an electronic device comprising the thermal pad includes a first heat conducting layer and a second heat conducting layer. The first heat conducting layer is deformable under compression, and a heat conduction capability of the first heat conducting layer in a thickness direction of the first heat conducting layer is greater than a heat conduction capability of the first heat conducting layer in a plane direction of the first heat conducting layer. The second heat conducting layer is not deformable under compression, and a heat conduction capability of the second heat conducting layer in a plane direction of the second heat conducting layer is greater than or equal to a heat conduction capability of the second heat conducting layer in a thickness direction of the second heat conducting layer.

Exfoliated graphite materials, and composite materials including exfoliated graphite, having enhanced through-plane thermal conductivity can be used in thermal management applications and devices. Methods for making such materials and devices involve processing exfoliated graphite materials such as flexible graphite to orient or re-orient the graphite flakes in one or more regions of the material.

A heat exchange ribbon includes a base portion to be attached to a spacer to be mounted to a circuit board, a tail portion substantially parallel to the base portion, and a leg connecting the tail portion to the base portion. A height of the leg extends in the same direction as a height of the base portion and the tail portion so as to create an opening at least partially surrounded by the base portion, the leg, and the tail portion. The base portion, the tail portion, and the leg portion have a one-piece construction. The leg extends below a lower edge of the base portion such that at least a portion of the tail portion is located below a lower edge of the base portion, and at least a portion of an inner surface of the tail portion does not oppose the outer surface of the base portion.

A set of electronic package elements intended to be mounted on an electronic board having a component to be cooled including: a chassis, a heatsink fixed by a retaining piece inside the chassis, a cover configured to be fixed on the chassis so as to retain the electronic board in the package. The heatsink is configured to be fixed on the electronic board while maintaining a predetermined distance between a lower face of the heatsink and the component. The cover is configured to be able to be fixed by a fixing point to the heatsink. The retaining piece is connected to the heatsink so as to allow the heatsink a translational movement relative to the chassis in three orthogonal directions.

A liquid cooling system can be installed to an information technology (IT) rack. The liquid cooling system can include a cooling assembly that has a cooling chassis and cold plates fixed at a bottom portion of the cooling chassis. Fluid lines are arranged in an interior of the cooling chassis to fluidly connect the cold plates to a supply line and a return line. The cooling chassis includes an outlet port that provides a path for a leaked fluid to flow out of the cooling chassis. The outlet port is inserted into an opening of a detection channel that has one or more fluid sensors within the detection channel. The floor of the cooling chassis may have a shape or other features to assist flow of leaked fluid towards the outlet port to assist in depositing the leaked fluid in the detection channel.