An electronic device includes a first electrical element, a heat dissipation sheet having a heat diffusion member for diffusing the heat generated from the first electrical element, and an anti-shock member arranged to be stacked with at least a part of the heat diffusion member; and a bracket which provides a space for accommodating the heat dissipation sheet. The heat dissipation sheet includes a first area, a second area, and a third area arranged between the first area and the second area.

A heat dissipation substrate structure having a non-rectangular heat dissipation layer is provided. The heat dissipation substrate structure having the non-rectangular heat dissipation layer includes a heat dissipation substrate and the non-rectangular heat dissipation layer. The non-rectangular heat dissipation layer is disposed on the heat dissipation substrate, and has one or more positioning features located at one corner of a brazing area of the non-rectangular heat dissipation layer, so as to position a component for subsequent brazing. The non-rectangular heat dissipation layer has one or a plurality of heat dissipation pins that extend from one or more sides of the brazing area of the non-rectangular heat dissipation layer.

Provided is a generator that includes a housing, a high-power circuit including a power amplifier, and a low-power circuit. An air flow guidance plate divides the housing into at least two compartments including a high-power compartment and a low-power compartment. The high-power circuit is disposed within the high-power compartment and the low-power circuit is disposed within the low-power compartment.

An assembled circuit board has a topology that defines positions, dimensions and power dissipation of components mounted to the circuit board, including a high power component and one or more low power components. A cold plate makes thermal contact to the high power component through a thermal interface material. A thermally conductive sheet overlays the circuit board and is formed to match the topology of the low power component or components. The sheet has a first portion that makes thermal contact with the cold plate and a second portion that overlays the low power component or components. The cold plate removes heat directly from the high power component and indirectly through the thermally conductive sheet from the low power component or components. The thermally conductive sheet conforms to the topology of the low power components either by preforming or by flexibility.

A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.

A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.

An optical device may include an outer box. The optical device may include an inner box within the outer box. The optical device may include a heating element on a surface of the inner box. The heating element may include one or more openings. The optical device may include one or more mounting pads. A mounting pad of the one or more mounting pads may be arranged in an opening of the one or more openings and mechanically couple the inner box to the outer box through the opening.

An electronics cooling system includes a printed circuit board (PCB) assembly having a heat generating component connected to a base. A plurality of thermally conductive microtubes are connected to the PCB assembly with a first spatial density. The plurality of thermally conductive microtubes are connected to a heat plate of a cooling system with a second spatial density to evenly spread the heat flux of the PCB assembly over the heat plate.

A split enclosure apparatus for fan-less cooling may be provided. The apparatus may comprise a device and a housing. The device may comprise a plurality of components. The housing may enclose the device and may comprise a first external surface, a second external surface, and a joint between the first external surface and the second external surface. The first external surface may be dedicated to cooling a first one of the plurality of components. The second external surface may be dedicated to cooling a second one of the plurality of components. The joint between the first external surface and the second external surface may be electrically conductive and thermally resistive.

A two-phase immersion type heat dissipation substrate is in contact with a heat generating element, and includes an immersion type heat dissipation base and at least one first and at least one second fin assembly that are formed on an upper surface thereof. The at least one first fin assembly is located directly above at least one high-temperature heat source area of the heat generating element, and the at least one second fin assembly is located directly above an area that is not the at least one high-temperature heat source area of the heat generating element. The at least one first and at least one second fin assembly include multiple first fins and multiple second fins, respectively. An arrangement density of the first fins is greater than that of the second fins, and a fin height of the first fins is greater than that of the second fins.