A cooling system for cooling electronic aircraft equipment comprises a primary cooling arrangement configured to provide basic cooling energy for cooling the electronic aircraft equipment and a supplemental cooling arrangement configured to provide supplemental cooling energy for cooling the electronic aircraft equipment. The supplemental cooling arrangement comprises a coolant supply system and a coolant distribution system. The coolant supply system is configured to supply a compressed coolant to the electronic aircraft equipment to be cooled, and the coolant distribution system is configured to selectively direct the compressed coolant supplied by the coolant supply system to at least one of a plurality of components of the electronic aircraft equipment.

Apparatus cools electronic circuitry. An enclosure surrounds the circuitry. Air intake holes are only in a portion of a first panel that faces a first direction. Air exhaust holes are only in a portion of a second panel that faces a second direction opposite the first. Air plenum piece is disposed within the enclosure, and a substantially planar portion extends from a first panel inner wall and ends a distance from a second panel inner wall. At least one tab extends from the substantially planar portion to an upper panel inner wall. The air plenum piece divides an enclosure interior into a first volume, enclosed by the first panel inner wall, substantially planar portion, at least one tab, and upper panel inner wall, into which the air intake holes open and a second volume into which the air exhaust holes open. The second volume is a remaining interior volume.

One feature pertains to a data storage cooling module. The data storage cooling module comprises a fan cage assembly, the fan cage assembly including a fan cage that includes at least one fan bay, at least one fan assembly removably coupled to the at least one fan bay, and an interface board removably coupled to the fan cage assembly, the interface board including a first interface surface that includes at least one power connector configured to interface with the at least one fan assembly, and a second interface surface that includes at least one drive connector configured to interface with a baseboard.

A fan tray, for a fan module of a network device chassis, may include an inner assembly that includes an inner cassette, one or more fans connected to the inner cassette, a first latch connected to the inner cassette and configured to removably connect to an outer assembly of the fan tray, and a fan controller connected to the inner cassette and configured to control operation of the one or more fans. The outer assembly may be configured to receive and retain the inner assembly, and may include an outer cassette with one or more openings configured to communicate with the one or more fans, a second latch connected to the outer cassette and configured to removably connect to a rear portion of the network device chassis, and an adaptor connected to the outer cassette and configured to connect and provide power to the fan controller.

There is provided a casing, adapted to a board having a first air vent and a second air vent, including: a base plate; a first side plate and a second side plate provided on a first side and a second side of the base plate, respectively, with both the first side plate and the second side plate having hollowed-out patterns, and after the board being fixed in the casing, the first side plate being opposite to the first air vent, and the second side plate being opposite to the second air vent; a connection backplate on a fourth side of the base plate; and at least one insert plate on the base plate, with an extension direction in which the insert plate extends intersecting with an extension direction in which a third side of the base plate extends. An electronic device including the casing described above is further provided.

Systems and methods for controlling airflow through a casing or shelf assembly are provided. An apparatus, according to one implementation, includes a mount plate configured to be attached to a side panel of a casing for housing network equipment. For example, the mount plate may include a window. The apparatus also includes one or more hinges arranged at an edge of the window of the mount plate and a baffle pivotably attached to the one or more hinges. The baffle can be arranged within a range of positions with respect to the mount plate to control an amount of airflow through the window. Within these range of positions, the baffle is configured to redirect the airflow in a front-to-back direction through the casing.

Disclosed is a heat dissipation subrack, including a cabinet body defining an accommodating space. The cabinet body defines an air inlet, two air supplementing openings, and an air outlet. The accommodating space has an air inlet region, and a heat source region communicatively coupled to the air inlet region. An opening direction of the air inlet and an opening direction of each of the air supplementing openings intersect in the air inlet region. The cabinet body includes multiple baffles, each of the baffles includes two wind shielding surfaces, and airflow passages are defined between each two adjacent baffles and between one of inner walls of the cabinet body and an baffle adjacent to the one of the inner walls of the cabinet body.

A heat dissipation case includes a case body, a carrying frame configured to be slidably mounted on the case body, a shutter rotationally mounted on the case body, and a number of levers rotationally mounted on the case body. One end of the levers resists against the shutter. The carrying frame is configured to resist against the other end of the levers, so that the end of the levers resisting against the shutter drives the shutter to rotate and open toward the carrying frame.

An wireless audio transceiver housing comprising an air inlet, an intake manifold, one or more fans, directing vanes, and an exhaust port, wherein the geometry of the intake manifold, the directing vanes, and the exhaust port are configured to enhance airflow from the one or more fans through the housing, over a heatsink, and out the exhaust port towards the rear of the housing by minimizing the pressure drop for the one or more fans and maximizing the potential for airflow through the unit.

A fan tray, for a fan module of a network device chassis, may include an inner assembly that includes an inner cassette, one or more fans connected to the inner cassette, a first latch connected to the inner cassette and configured to removably connect to an outer assembly of the fan tray, and a fan controller connected to the inner cassette and configured to control operation of the one or more fans. The outer assembly may be configured to receive and retain the inner assembly, and may include an outer cassette with one or more openings configured to communicate with the one or more fans, a second latch connected to the outer cassette and configured to removably connect to a rear portion of the network device chassis, and an adaptor connected to the outer cassette and configured to connect and provide power to the fan controller.