A modular data center includes a cooling module with a cooling module enclosure and a first cooling unit housed within the cooling module enclosure. The cooling module enclosure includes a first interface side wall with a first cooling module supply opening that receives a first portion of cooling air from the first cooling unit. The center further includes a data module with a data module enclosure for housing data equipment. The data module enclosure includes a second interface side wall with a first data module supply opening that receives the first portion of cooling air from the first cooling module supply opening such that the first portion of cooling air flows into the data module enclosure and removes heat from the data equipment.

A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.

A modular data center includes a cooling module with a cooling module enclosure and a first cooling unit housed within the cooling module enclosure. The cooling module enclosure includes a first interface side wall with a first cooling module supply opening that receives a first portion of cooling air from the first cooling unit. The center further includes a data module with a data module enclosure for housing data equipment. The data module enclosure includes a second interface side wall with a first data module supply opening that receives the first portion of cooling air from the first cooling module supply opening such that the first portion of cooling air flows into the data module enclosure and removes heat from the data equipment.

In one embodiment, a radio frequency (RF) impedance matching network includes electronically variable capacitors (EVCs), each EVC including discrete capacitors operably coupled in parallel. The discrete capacitors include fine capacitors each having a capacitance value substantially similar to a fine capacitance value, and coarse capacitors each having a capacitance value substantially similar to a coarse capacitance value. The increase of the variable total capacitance of each EVC is achieved by switching in more of the coarse capacitors or more of the fine capacitors than are already switched in without switching out a coarse capacitor that is already switched in.

Disclosed is an air conditioning arrangement, in particular a cooling arrangement, at least comprising a switchgear cabinet (1) that has a supporting device (4). Electric and/or electronic devices (2) that are to be air-conditioned are disposed in rows on top of and next to one another on the front side (17) of the supporting device (4), said front side (17) facing the doors of the switchgear cabinet. The disclosed air conditioning arrangement is characterized in that the devices (2) in the switchgear cabinet (1) can be at least partially air-conditioned by at least one heat sink (50), each of which forms an autonomous component.

A cooling system for electronic equipment including an evaporator, a rack to which the electronic equipment can be mounted above the evaporator, and a condenser spaced apart from the evaporator. Air warmed by the electronic equipment is directed to the evaporator, cooled at the evaporator, and directed back to the electronic equipment to cool the electronic equipment.

A system, according to one embodiment, includes: a first frame of an automated tape library, wherein an interior of the first frame includes one or more tape drives, an area for storing tape cartridges, and an accessor channel, and a first air conditioning unit coupled to the first frame. The first air conditioning unit is configured to cool the interior of the first frame. Moreover, one or more fans of the one or more tape drives are configured to generate air flow within the interior of the first frame. Other systems, computer-implemented methods, and computer program products are described in additional embodiments.

An equipment cooling rack device, with a cooling cabinet, having a cooled area, adapted for holding multiple different heat creating structures to be cooled; a cooling structure, coupled to the cooling cabinet, and providing a first cooling coil for a left side of the rack and a second cooling coil for a right side of the rack, and orthogonal fans. The fans and coolant are controlled according to thermographic color of the cooling cabinet.

A cooling arrangement for autonomous cooling of a rack hosting components and fans comprises a closed loop and an open loop. Liquid cooling is used in the closed loop to transfer heat from heat-generating units of the components to a primary side of a liquid-to-liquid heat exchanger. An air-to-liquid cooling unit is used in the open loop to absorb heat expelled from the rack by the fans. A liquid from a cold supply line is first heated to some degree in the air-to-liquid cooling unit before reaching a secondary side of the liquid-to-liquid heat exchanger. The primary side being hotter than the secondary side, heat is transferred from the primary side to the secondary side of the liquid-to-liquid heat exchanger. The liquid is expelled at a higher temperature from the secondary side to a hot return line.

In one embodiment, an RF impedance matching network utilizing at least one electronically variable capacitors (EVC) is disclosed. Each EVC includes discrete capacitors operably coupled in parallel, the discrete capacitors including fine capacitors and coarse capacitors. A control circuit determines a parameter related to the plasma chamber and, based on the parameter, determines which of the coarse capacitors and which of the fine capacitors to have switched in to cause an impedance match. The increase of the variable total capacitance of each EVC is achieved by switching in more of the coarse capacitors or more of the fine capacitors than are already switched in without switching out a coarse capacitor that is already switched in.