The heat dissipation cabinet includes a cabinet body, a cabinet door, and a baffle. The cabinet body includes a top wall and a bottom wall that are oppositely disposed, and a side wall connected between the top wall and the bottom wall. The cabinet door is installed at a position of the side wall in the cabinet body, and an air outlet passage is disposed in the cabinet body that is close to a position of the top wall. An air inlet component and an air outlet component are disposed in the cabinet door, and the air outlet component is located between the air inlet component and the top wall, and is located at one end of the air outlet passage. An electronic apparatus placement area is disposed in the cabinet body, and the baffle is disposed between the electronic apparatus placement area and the cabinet door.

A system for managing temperature, that can be adapted to an electrical enclosure, the electrical enclosure delimiting a first volume, the system comprising: a first chamber delimiting a closed second volume and a tank housed in the first chamber and delimiting a closed third volume inside the first chamber, first air transfer means arranged between a first air inlet/outlet connected to the second volume and a second air inlet/outlet intended to be connected to the first volume, second air transfer means arranged between a third air inlet/outlet connected to the third volume and a fourth air inlet/outlet intended to be connected to the first volume, and a control and processing unit intended to apply a mode of operation of the system.

A heat dissipation case includes a case body, a carrying frame configured to be slidably mounted on the case body, a shutter rotationally mounted on the case body, and a number of levers rotationally mounted on the case body. One end of the levers resists against the shutter. The carrying frame is configured to resist against the other end of the levers, so that the end of the levers resisting against the shutter drives the shutter to rotate and open toward the carrying frame.

The heat exchange module is used in the cabinet that includes a cabinet body. The cabinet body has a first space and a second space. A temperature of the first space is higher than a temperature of the second space. The heat exchange module has a first air circulation system and a second air circulation system, and heat exchange may be performed between the first air circulation system and the second air circulation system. Both an air intake vent and an air exhaust vent of the first air circulation system are configured to be connected to the first space. An air exhaust vent of the second air circulation system is connected to an external space, and an air intake vent of the second air circulation system can be configured to be selectively connected to the external space and/or the second space.

An airflow guiding mechanism includes a housing and a shielding assembly. The housing includes an airflow guiding portion and a guiding track. The shielding assembly is movably connected to the guiding track. The shielding assembly is able to move within the airflow guiding portion along the guiding track. In an embodiment, the shielding assembly may include a first shielding plate and at least one second shielding plate. The first shielding plate is connected to the housing. The at least one second shielding plate and the first shielding plate are movably connected to each other. The at least one second shielding plate are able to move with respect to each other to be folded and unfolded, so as to open and shield the airflow guiding portion.

A chassis includes a first computing component; a second computing component; and an air mover that generates an airflow in the chassis used to thermally manage the first computing component and the second computing component. The chassis also includes an airflow control component that modifies a first portion of the airflow proximate to the first computing component based on a corrosion rate of the first computing component without modifying a second portion of the airflow proximate to the second computing component.

According to one aspect, an apparatus includes a first component, a plurality of line card slots, a fan array, and a sensor arrangement. The first component has a first opening defined therein and a second opening defined therein. The first component includes a first configurable line card flapper is arranged to at least partially cover the first opening and a second configurable line card flapper is arranged to at least partially cover the second opening. The plurality of line card slots includes a first line card slot associated with the first opening and a second line card slot associated with the second opening. The fan array includes a plurality of fans. The sensor arrangement includes at least one sensor arranged to monitor at least one condition. The first and second configurable line card flappers are arranged to be configured using information obtained from the sensor arrangement.

A heat dissipation case includes a case body, a carrying frame configured to be slidably mounted on the case body, a shutter rotationally mounted on the case body, and a number of levers rotationally mounted on the case body. One end of the levers resists against the shutter. The carrying frame is configured to resist against the other end of the levers, so that the end of the levers resisting against the shutter drives the shutter to rotate and open toward the carrying frame.

A method, system and computer program product for implementing enhanced component reliability for leading edge components in a server computer system based upon system humidity conditions. A humidity value is identified and compared with a threshold value at an air flow input in contact with the leading edge components. One or more air flow control elements are used to direct air flow based upon the compared humidity values of the server system.

An apparatus for dynamic thermal control is provided. The apparatus includes a fan module with multiple fan units, a deflection member configured to direct airflow received from the fan module, and a system component. The apparatus also includes a chassis management controller (CMC). The CMC is coupled to the fan module, deflection member, and the system component. The CMC is configured to dynamically control the deflection member to direct airflow from the fan module to the system component by accounting for at least one environmental element within the apparatus.