According to one embodiment, a rack cooling module for an electronics rack. The module includes a manifold section that has a supply manifold that is coupled to a supply manifold connector, the supply manifold is arranged to supply liquid coolant from a coolant source to supply manifold connectors, and a return manifold that is coupled to return manifold connectors, the return manifold is arranged to return liquid coolant from the return manifold connector to the coolant source. The module also includes a detection section that has a channel that extends vertically within the detection section and a leak detection sensor that is disposed within the channel, a pump that couples the channel to the return manifold, and a valve that couples the channel to the supply manifold.

A flow detection device comprises a fluidic input port connected to a fluidic output port via a channel and a float located within the channel. A specific weight of the float exceeds a specific weight of a fluid injected in the flow detection device. Respective locations of the fluidic input port, of the channel and of the fluidic output port on the flow detection device cause the float to rise within the channel when a sufficient flow of the fluid is injected in the flow detection device. A sensor is provided to detect a position of the float within the channel. The flow detection device may be integrated in a cooling circuit having a cooling device for an electronic device to detect an eventual lack of a flow of a cooling fluid in the cooling circuit. A status of the flow of the cooling fluid is reported to a processor.

A highly available and modular cooling distribution unit (CDU) includes a heat exchange module and a pair of redundant pump modules, all configured to occupy a designated rack space that is comparable to rack space required for a conventional 1×CDU without redundancy. The heat exchange module may be fluidically coupled to one or more rack information handling resources via liquid coolant conduits, manifolds and accompanying valves, sensors, etc. In at least one embodiment, the heat exchange module includes a heat exchanger to dissipate heat from a liquid coolant and a fan assembly to move heated air in proximity to the heat exchanger. Each pump module is coupled to the heat exchange module and configured to circulate liquid coolant through a closed loop circuit that includes the heat exchanger, the liquid coolant conduits and manifolds, and information handling resources.

A highly available and modular cooling distribution unit (CDU) includes a heat exchange module and a pair of redundant pump modules, all configured to occupy a designated rack space that is comparable to rack space required for a conventional 1×CDU without redundancy. The heat exchange module may be fluidically coupled to one or more rack information handling resources via liquid coolant conduits, manifolds and accompanying valves, sensors, etc. In at least one embodiment, the heat exchange module includes a heat exchanger to dissipate heat from a liquid coolant and a fan assembly to move heated air in proximity to the heat exchanger. Each pump module is coupled to the heat exchange module and configured to circulate liquid coolant through a closed loop circuit that includes the heat exchanger, the liquid coolant conduits and manifolds, and information handling resources.

In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.

In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.

A cold plate has, on a surface thereof, an attachment surface for contacting a cooling object, and has, in the interior thereof, an accommodating portion that accommodates a cooling medium. The cold plate is provided with a first opening that communicates with the accommodating portion, a body-side connection pipe is connected to the first opening, a tube-side connection pipe, which has a bendable tube connected to one end thereof, is connected to the body-side connection pipe. The body-side connection pipe and the tube-side connection pipe are connected so as to be able to rotate about the pipe axis.

A cold plate has, on a surface thereof, an attachment surface for contacting a cooling object, and has, in the interior thereof, an accommodating portion that accommodates a cooling medium. The cold plate is provided with a first opening that communicates with the accommodating portion, a body-side connection pipe is connected to the first opening, a tube-side connection pipe, which has a bendable tube connected to one end thereof, is connected to the body-side connection pipe. The body-side connection pipe and the tube-side connection pipe are connected so as to be able to rotate about the pipe axis.

An electrical device including a skeleton-like frame structure and at least one electrical module is provided. The skeleton-like frame structure has a low rigidity, while the at least one electrical module provides an increased rigidity when mounted.

In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.