A liquid-cooled plate and a heat dissipation device are disclosed. The liquid-cooled plate includes a single-phase channel and a two-phase channel. First fins are spaced apart in the single-phase channel and second fins are spaced apart in the two-phase channel. The first fins are configured to perform a heat exchange with a liquid-state coolant flowing through the single-phase channel to convert the liquid-state coolant after the heat exchange into a gas-liquid two-phase coolant, and the second fins are configured to perform a heat exchange with a gas-liquid two-phase coolant flowing through the two-phase channel to output a coolant after the heat exchange.

A heat dissipation cabinet includes a cabinet body and a heat dissipation apparatus. A first accommodation region of the cabinet body can accommodate a plugboard in a stacked manner, and heat source components of the plugboard dissipate heat through the heat dissipation apparatus. An evaporator, a condenser, and an evaporation pipeline of the heat dissipation apparatus are connected to a liquid return pipeline to form a heat exchange loop, and the evaporator is in thermal contact with an outer surface of a heat source component. The condenser is disposed in a second accommodation region and located above the evaporator. A refrigerant flows in the heat exchange loop, to draw heat of the heat source component far to the condenser, and take away heat of the condenser using air generated by a fan. A second accommodation region is used as an independent air duct whose path is relatively short.

A fanless cooling system for particularly fail-safe and efficient cooling of electronic modular systems in vehicles, more particularly in rail vehicles, includes a preferably frame-shaped rack or assembly carrier for holding at least one module or assembly, more particularly a processor module having high-performance multi-core processors. A heat transport body can be mounted in a heat-transferring manner on a part or component of the module. The rack has at least one heat distribution body, to which the heat transport body can be fastened in a heat-transferring manner, preferably detachably, when the module having the part coupled to the heat transfer body is held in the rack. At least one heat tube is connected to the heat distribution body in a heat-transferring manner. An electronic modular system with a fanless cooling system is also provided.

A system for cooling electronics includes at least two modular thermal energy storage cards stacked in one of a horizontal or a vertical stack, where the stack provides cooling to a portion to electronics. The cards include: a thermally conductive enclosure bounding an interior cavity, a cell wall structure that includes cells disposed within the interior cavity and in thermal communication with the thermally conductive enclosure, a phase change material having a melting point where the phase change material disposed within the cells and in thermal communication with cell walls of the cells, and a thermally conductive interface disposed between the thermally conductive enclosure and a portion of the electronics that includes a heat generating surface. The thermally conductive interface extends from the interior cavity a distance beyond the interior cavity of the enclosure and is in contact with the heat generating surface.

The invention concerns an avionics bay (1) for the installation of at least one electrical module (M), comprising a fluid cooling system and a housing (2) that is complementary to the electrical module (M) and that comprises an open front face (21) through which the module (M) can be removably installed inside said housing (2), and a rear face (20) on which there are arranged electrical connectors suitable for being connected to the electrical module (M), characterised in that the fluid cooling system comprises a cold plate (3) that is disposed on the rear face (20) of the housing (2) that is suitable for cooling the electrical module (M) when said electrical module (M) is installed inside the housing (2).

An electronics rack comprising a first cage, a first heat sink positioned at a rear and in thermal communication with the first cage, a second cage positioned above the first cage, and a second heat sink in thermal communication with the second cage. In another aspect, the present invention provides an electronics rack comprising a frame, a cage, a heat sink positioned at a rear of the frame, and a compliant thermal collector operatively positioned between the cage and the heat sink. The compliant thermal collector can comprise a heat pipe having a non-linear shape that facilitates flexing of the heat pipe to change the length of the thermal collector. The thermal collector advantageously includes a plurality of heat pipes and a contact bar coupling the plurality of heat pipes. Preferably, the rack further includes an adjusting mechanism (e.g., threaded rods) for adjusting a position of the contact bar.

Cooling apparatus cooling for an electrical or electronic device, comprising an at least partially hollow body containing a refrigerant and having a plurality of electrically conductive sections Each electrically conductive section has a respective coupling portion suitable to be operatively associated with a corresponding electrically conductive part of the electrical or electronic device, wherein the at least partially hollow body further comprises one or more electrically insulating sections. Each electrically insulating section is positioned between and electrically insulates from each other two adjacent electrically conductive sections.

A cooling system for electronic equipment including an evaporator, a rack to which the electronic equipment can be mounted above the evaporator, and a condenser spaced apart from the evaporator. Air warmed by the electronic equipment is directed to the evaporator, cooled at the evaporator, and directed back to the electronic equipment to cool the electronic equipment.

A heat exchanger module includes a condenser unit and an evaporator unit. The evaporator unit includes N pieces of parallel-flow heat exchangers arranged adjacently, and the coolant temperatures reduce gradually from the first to Nth parallel-flow heat exchangers along an air flow direction in the evaporator unit. A counter-current mounting method is adopted in the parallel-flow heat exchangers of the evaporator unit in the heat exchanger module provided by the present invention. The coolant temperature of each parallel-flow heat exchanger is lower than that of the previous one, the temperature difference between air and coolant is relatively uniform by using the counter-current method so as to reach a better heat exchange effect.

A method for cooling an information technology system, comprising: receiving a flow of at least a subcooled liquid phase change refrigerant; cooling the information technology system by sensible heat transfer in an evaporator, to produce at least gaseous refrigerant; and exchanging heat from the at least gaseous refrigerant from the evaporator to the subcooled liquid phase change refrigerant. The phase change refrigerant may be a hydrofluorocarbon ether having a boiling point of 30-65° C. at 1-12 bar.