A modular server design includes a server chassis, a cooling module within the server chassis housing at least one cooling unit, an electronics module within the server chassis holding a motherboard, and a cooling connecting panel. The cooling connecting panel includes a number of cooling channels to fluidly connect the at least one cooling unit of the cooling module with a cooling device on the motherboard. The cooling module includes components to enable proper heat and fluid transfer.

A noise suppressing heat exchanger (also referred to as heat sink) includes a plurality of heat dissipating fins formed with baffles. The baffles suppress noise from a fan by slowing air flow and creating internal reflections within the heat exchanger that reflect noise away from the air flow path, absorbing sound energy and potentially setting up standing waves which dissipate noise via destructive interference. Other embodiments may be described and/or claimed.

A computing device includes a heat dissipation component, a heating or cooling apparatus, and a printed circuit board. The heating or cooling apparatus includes a heating or cooling component and a wire, and the heating or cooling component is affixed to a surface of the heat dissipation component. The printed circuit board includes a printed circuit board component, and the heat dissipation component is affixed to the printed circuit board component and configured to heat or cool the printed circuit board component.

A fan cage is at least adapted to a first fan and a second fan smaller than the first fan. The fan cage includes a cage body and an adjustment member. The cage body defines a first accommodation portion in a size fitting the first fan. The adjustment member is movably disposed on the cage body and switchable between a laid down status and an upright status within the first accommodation portion. When the adjustment member is in the upright status, the adjustment member is upright in the first accommodation portion so that the adjustment member and the cage body together define part of the first accommodation portion as a second accommodation portion in a size fitting the second fan.

Several transportable datacenters are described. The transportable datacenters include transport systems allowing them to be transported between an assembly location and an operating location. The transportable datacenters also include a ventilation system for cooling processors positioned in racks in the datacenters. The ventilation system draws cold air from the environment, through processor bays containing the processors and then exhausts the air back to the environment.

A fan management system includes a chassis housing a storage fan system, a storage system cooled by the storage fan system, computing fan subsystems, and computing devices cooled by respective ones of the computing fan subsystems. Each of the computing devices detects a multi-computing-device configuration that includes the computing devices and, in response, determines a computing device chassis location for that computing device. Each computing device then receives fan inventory information that describes the storage fan system and the computing fan subsystems, distinguishes between the storage fan system and the computing fan subsystems based on the fan inventory information, identifies the computing fan subsystem that is configured to cool that computing device based on the computing device chassis location for that computing device, manages the computing fan subsystem that is configured to cool that computing device, and ignores the others of the computing fan subsystems.

A server device includes a casing, an electronic assembly, a cover, and a heat dissipation device. The electronic assembly includes a circuit board and at least one heat source. The circuit board is disposed on the casing, and the heat source is disposed on the circuit board. The cover is removably disposed on the casing. The heat dissipation device includes at least one air cooling heat exchanger and at least one liquid cooling heat exchanger. The air cooling heat exchanger is fixed on and thermally coupled with the heat source. The liquid cooling heat exchanger is fixed on the cover and thermally coupled with the air cooling heat exchanger.

A vibration absorbing assembly is adapted to be disposed on a cable. The vibration absorbing assembly includes a mount frame and a flexible covering component. The mount frame includes a first part and a second part. The second part is detachably assembled with the first part, and the first part and the second part together form an accommodation space. The flexible covering component is located in the accommodation space and pressed by the first part and the second part so as to surround a covering space. The covering space is configured to accommodate the cable.

A server device includes a casing, an electronic assembly, a cover, and a heat dissipation device. The electronic assembly includes a circuit board and at least one heat source. The circuit board is disposed on the casing, and the heat source is disposed on the circuit board. The cover is slidably disposed on the casing. The heat dissipation device includes at least one air cooling heat exchanger and at least one liquid cooling heat exchanger. The air cooling heat exchanger is fixed on and thermally coupled with the heat source. The liquid cooling heat exchanger is fixed on the cover and thermally coupled with the air cooling heat exchanger.

A system, an article of manufacture, and a method are disclosed. The system includes a set of components in an enclosure. The set of components includes electronic devices and airflow moving components configured to maintain airflow across the electronic devices from a front plenum of the enclosure to a rear plenum of the enclosure and direct air from the rear plenum through the first heat exchanger. The set of components also includes a first heat exchanger configured to circulate a cooling liquid and a second heat exchanger configured to maintain a constant temperature of the cooling liquid, wherein the constant temperature is a temperature of the cooling liquid within a threshold distance from a selected temperature.