A modular server design includes a server chassis, a cooling module within the server chassis housing at least one cooling unit, an electronics module within the server chassis holding a motherboard, and a cooling connecting panel. The cooling connecting panel includes a number of cooling channels to fluidly connect the at least one cooling unit of the cooling module with a cooling device on the motherboard. The cooling module includes components to enable proper heat and fluid transfer.

An electronic device is disclosed. The electronic device includes a chassis and at least one plugin unit mounted in the chassis. The plugin unit includes a substrate, a heat receiving member, a radiator, and a heat transfer member. The substrate mounts a first electronic component and a second electronic component having a higher heat release value than the first electronic component. The heat receiving member receives heat by contacting the second electronic component. The radiator is shaped as a duct. The heat transfer member transfers the heat from the heat receiving member to the radiator. The chassis includes a fan that generates air-current inside the radiator and on one or more component mounting surfaces of the substrate.

A computing rack apparatus which reduces the manufacturing cost by simplifying the structure thereof and in which the temperature of the internal air is utilized in the cooling unit is disclosed. The apparatus comprises: a rack housing which houses a server, a rack frame which is disposed inside the rack housing and on which the server is fastened and mounted; and a cooling unit which has a discharge port which is disposed inside the rack housing and discharges cooling air and a suction port which sucks the internal air through a cooling zone, wherein the discharge port is located in a first region with respect to a boundary portion defined by a front surface of the server, and the suction port is located in a second region with respect to the boundary portion, and the first and second regions form the cooling zone.

A distributed composite refrigeration system includes a multichannel heat exchanger and at least two refrigeration units. The at least two refrigeration units are connected to at least two indoor areas in one-to-one correspondences. Each refrigeration unit includes a refrigeration part, a heat exchange part, and a heat dissipation part. A refrigerant flows between the refrigeration part and the heat exchange part, an intermediate medium flows in the heat exchange part, and the refrigerant and the intermediate medium implement heat exchange at the heat exchange part. The heat exchange part delivers the intermediate medium obtained after heat exchange to the heat dissipation part and/or the multichannel heat exchanger for heat dissipation. The multichannel heat exchanger is thermally connected to an external pipe network, and the intermediate medium performs heat exchange with a heat carrying body in the external pipe network.

A system including a data center rack enclosure, a first aisle emulator, and a second aisle emulator. The data center rack enclosure is configured to retain a data center rack, which has a first side and a second side. The first aisle emulator is coupled with the data center rack enclosure and provides a first controlled test environment with first temperature and a first gas flow to the first side of the data center rack. The second aisle emulator is coupled with the data center rack enclosure and provides a second controlled test environment for the second side of the data center rack.

A motherboard including a main circuit board, a first connector, a power circuit board and a second connector. The first connector is disposed on the main circuit board. A periphery of the power circuit board is spaced apart from a periphery of the main circuit board. The second connector is disposed on the power circuit board. The first cable electrically connects the first connector with the second connector.

A server rack with a plurality of compute nodes is positioned in a facility that includes a spine and the server rack includes a middle of rack (MOR) switch located near the middle of the server rack, vertically speaking. The MOR switch includes a plurality of ports that are connected via passive cables to the compute nodes provided in the server rack. In an embodiment the passive cables are configured to function at 56 Gbps using non-return to zero (NRZ) encoding and each cable may be about or less than 1.5 meters long. An electrical to optical panel (EOP) can be positioned adjacent a top of the server rack and the EOP includes connections to the MOR switch and to the spine, thus the EOP helps connect the MOR switch to the spine. Connections between adjacent server racks can provide for additional compute bandwidth when needed.

Self-contained server assemblies for housing servers or server blades and associated computing facilities are disclosed herein. In one embodiment, a server assembly includes an enclosure having an interior space housing a server blade, a dielectric coolant submerging heat producing components of the server blade, and a condenser assembly having a condenser coil in fluid communication with a vapor gap in the interior space. The condenser coil is configured to receive a coolant that removes heat from a vapor of the dielectric coolant in the vapor gap, thereby condensing the vapor into a liquid form to be returned to the server blade.

Data center mechanical infrastructure is incrementally deployed and commissioned to support incremental changes in computing capacity in a data center while mitigating interaction between infrastructure being commissioned and installed computer systems. Incremental mechanical infrastructure commissioning can be concurrent with incremental electrical infrastructure commissioning and includes operating mechanical infrastructure to remove heat generated as a result of operating electrical infrastructure to support simulated electrical loads as part of electrical infrastructure commissioning. Incremental mechanical infrastructure deployment can be based on the power support capacity provided by incrementally deployed electrical infrastructure. Incremental infrastructure deployment can include partitioning a space in which incremental mechanical infrastructure is configured to provide cooling, so that heat generation and removal in the space, based on commissioning the incremental mechanical infrastructure, is isolated electrical and cooling support provided to electrical loads located in a remainder of the data center.

A modular data center includes a base electrical module having a casing, a controller supported by the casing, and a power distribution unit coupled to the controller. The modular data center further includes an equipment rack having a frame coupled to the base electrical module, with the frame of the equipment rack being configured to receive electronic equipment. The electronic equipment receives power from the base electrical module. The base electrical module is external to the equipment rack.