A system includes multiple MHACUs for cooling one or more servers in a data hall. The system also includes a pump package for providing cooling fluid to the MHACUs, and a fluid supply line conveying the cooling fluid to the MHACUs. The system also includes at least one computing device configured to: determine that a cooling fluid temperature in a first MHACU has risen to a first temperature that is less than a predetermined maximum temperature; in response to the determination, control the system to provide at least some of the cooling fluid to a second MHACU; determine that the cooling fluid temperature in the second MHACU has risen to a second temperature that is at least the predetermined maximum temperature; and in response to the determination, control the system to provide the cooling fluid to a fluid return line for return to the pump package.

A self-sustained, submerged waterborne data center facility that utilizes a closed-looped heat management system that is both energy-efficient and cost-effective is disclosed. Embodiments employ a closed-looped, energy efficient, cost effective thermal management system that leverages natural resources to control thermal conditions and reduce the overall requirement for cooling power.

A modular data center includes a cooling module with a cooling module enclosure and a first cooling unit housed within the cooling module enclosure. The cooling module enclosure includes a first interface side wall with a first cooling module supply opening that receives a first portion of cooling air from the first cooling unit. The center further includes a data module with a data module enclosure for housing data equipment. The data module enclosure includes a second interface side wall with a first data module supply opening that receives the first portion of cooling air from the first cooling module supply opening such that the first portion of cooling air flows into the data module enclosure and removes heat from the data equipment.

The present disclosure is directed to examples of modular data centers configured to provide cooling to liquid-cooled electronics equipment stored within the modular data centers. In one aspect, a modular data center can be configured to provide cooling without requiring the use of mechanical refrigeration (e.g. vapor-compression or absorption refrigeration), through the use of a dry cooler in combination with an optional evaporative cooler.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a first three-way flow controller is associated with a single-phase fluid and a second three-way flow controller is associated with a two-phase fluid, with a first three-way flow controller to enable a first flow path of a single-phase fluid from a coolant distribution unit to a cold plate or to enable a second flow path to a heat exchanger to cool a two-phase fluid to be used in a cold plate, and with a second three-way flow controller to enable a third flow path of a two-phase fluid to a cold plate or to enable a fourth flow path to a heat exchanger.

A cooling system configured to remove heat from a chimney of a server cabinet. The system includes a first heat exchanger unit in the chimney of the server cabinet. The first heat exchanger has a fluid inlet for receiving a working fluid and a fluid outlet for discharging the working fluid. The first heat exchanger also has an upstream surface receiving waste heat generated by one or more servers and a downstream surface that discharges air cooled by the first heat exchanger. The upstream surface is generally perpendicular to the downstream surface.

A system includes multiple modular hot aisle cooling units (MHACUs) arranged in a series in a data hall, each MHACU configured to cool multiple servers in the data hall, the servers arranged in multiple containment modules within the data hall, each containment module comprising a hot aisle. The system also includes multiple vestibules, each connected to the hot aisles of at least two of the multiple containment modules and configured to allow heated air to flow between the hot aisles. The system also includes a pump package configured to provide cooling fluid to the multiple MHACUs. The system also includes at least one computing device configured to control at least one of air throughput, leaving air temperature, or leaving fluid temperature in each of the multiple MHACUs to customize cooling levels to different ones of the multiple containment modules.

Provided is a rack, comprising: a plurality of rack units; and a plurality of lockers each housing a different respective subset of the rack units, wherein respective lockers among the plurality comprise: a first respective barrier disposed between a respective pair of the rack units; a second respective barrier disposed between another respective pair of the rack units; a third respective barrier that is orthogonal to the first barrier and the second barrier, the third respective barrier being moveably or removeably coupled to the rack; a respective volume configured to receive one or more computing devices; and a respective lock configured to secure the third respective barrier to the rack in the closed position when in a locked state.

Systems and methods for cooling in a datacenter are disclosed. In at least one embodiment, a thermal load bank (TLB) system to test a hybrid datacenter cooling system includes one or more thermal features to generate heat within a TLB system and includes one or more hybrid cooling features to provide air and liquid cooling responses to such heat generated by one or more thermal features.

A container data center is provided. The data center is provided in a shipping container, and the container data center includes a cooling system including a plurality of cooling devices for cooling the data center; a power supply and distribution system including a power supply circuit for supplying power to the data center; and a control system electrically connected to the cooling system and the power supply and distribution system; wherein the control system comprises a plurality of control devices, the plurality of control devices each configured to control a part of the cooling devices, and when a first part of the plurality of control devices cannot work, a working mode of a second part of the control devices is adjusted to control the plurality of the cooling devices.