The invention relates to a device (2) for cooling a plurality of electronic elements (11) that are capable of releasing heat when supplying power to an appliance or vehicle, wherein the electronic elements are arranged in a housing (12), the device (2) comprises at least one element (22) for spraying a diphasic dielectric fluid (3) onto the electronic elements (11), as well as a condenser (26) with a cooling fluid circuit (23), the housing (12) comprises a receptacle (25) for collecting the dielectric fluid (3), the cooling device (2) comprises a dielectric fluid circuit (21) with a circulation pump (24), which is configured to draw the dielectric fluid (3) from the collection receptacle (25) and is directly connected to the spraying element (22), characterised in that the cooling device (2) comprises a system (4) for controlling the internal pressure of the housing (12), the control system (4) comprising a control module (41) configured to generate a control command to control the internal pressure depending on a state of the cooling device and/or a state of the appliance or vehicle.

The disclosure provides a cooling device, for cooling devices that generate heat during their operation. The cooling device includes single phase cooling plates to be attached to the devices to dissipate a majority of the heat from the devices while a first coolant is circulated through the single phase cooling plates. The cooling device also includes a unified cooling plate. The plate is directly attached on top of the single phase cooling plates. The unified cooling plate dissipates a portion of the heat transferred from the single phase cooling plates to the unified cooling plate while a second coolant is circulated through the unified cooling plate and when the first coolant is insufficient to remove the portion of the heat from at least one of the single phase cooling plates. The cooling device may be used as part of an electronic rack, a data center, and in other environments.

A heat exchanger has a structure in which a heat exchanger main body through which coolant flows is obliquely installed in a box-shaped enclosure, the heat exchanger main body is constituted by a header pipe and a plurality of heat transfer pipes connected to the header pipe and disposed at predetermined intervals along a surface of a part of the header pipe, the header pipe has an area adjacent to an inner surface of the enclosure, and a seal section is provided between the inner surface of the enclosure and the area of the header pipe adjacent to the enclosure.

A dilution refrigerator is provided. The dilution refrigerator includes a plurality of thermalization plates configured to be cooled to a plurality of temperatures, and a first thermalization plate of the plurality of thermalization plates includes an integrated heat exchanger. The integrated heat exchanger includes channels formed in the first thermalization plate, and the channels are configured to allow helium to flow through the first thermalization plate during operation of the dilution refrigerator to improve heat exchange and cooling power of the dilution refrigerator.

The disclosure provides a cooling device, for cooling devices that generate heat during their operation. The cooling device includes single phase cooling plates to be attached to the devices to dissipate a majority of the heat from the devices while a first coolant is circulated through the single phase cooling plates. The cooling device also includes a unified cooling plate. The plate is directly attached on top of the single phase cooling plates. The unified cooling plate dissipates a portion of the heat transferred from the single phase cooling plates to the unified cooling plate while a second coolant is circulated through the unified cooling plate and when the first coolant is insufficient to remove the portion of the heat from at least one of the single phase cooling plates. The cooling device may be used as part of an electronic rack, a data center, and in other environments.

A two phase coolant immersion system includes a top section and an immersion section, where the top section and the immersion section are separated by one or more panels. The immersion section includes at least a number of server slots to receive a number of servers, where each of the servers is at least partially submerged within two phase liquid coolant within the immersion section, where, when the servers operate, the servers generate heat that is transferred to the two phase liquid coolant causing some of the two phase liquid coolant to turn into a vapor. The two phase coolant immersion system includes a condensing section interfaced with the immersion section, where the condensing section includes a vapor collection compartment to collect two phase liquid coolant in vapor phase and a liquid collection compartment situated beneath the vapor collection compartment. The one or more panels prevent vapor loss to the environment.

A system having a shell with a shell interior for housing a heat exchanger that is configured to be operable for heat transfer between a first fluid and a second fluid; a refrigerant inlet, wherein the first fluid passes from the refrigerant inlet to the shell interior for heat transfer; a refrigerant inlet manifold, wherein the refrigerant inlet manifold is configured to collect the first fluid from the refrigerant inlet for the heat transfer; a refrigerant outlet, the refrigerant outlet is configured to be operable for supplying the first fluid for electronic device cooling; a coolant inlet, wherein the second fluid flows from the coolant inlet and into the shell interior for the heat transfer; and a coolant outlet for discharging the second fluid out of the shell interior.

In one embodiment, a liquid cooling apparatus includes a first cooling loop to provide cooling liquid to a heat load, wherein the first cooling loop comprises a first condenser unit, a first liquid supply line, and a first vapor return line and a second cooling loop to provide cooling liquid to the heat load, wherein the second cooling loop comprises a second condenser unit, a second liquid supply line, and a second vapor return line, wherein the first vapor return line and the second vapor return line are coupled by an interconnection loop. The liquid cooling apparatus further includes a first pressure sensor coupled to the first vapor return line, a second pressure sensor coupled to the second vapor return line, and at least one main cooling source controlled based on the first pressure sensor and the second pressure sensor.

The instant application pertains to new liquid level monitoring apparatus and a cooling system for computer components that employs the liquid level monitoring apparatus. In one embodiment, the liquid level measurement device comprises a load cell and a buoyancy element. The buoyancy element is configured to be partially submerged in a dielectric liquid. The load cell and the buoyancy element are operably connected such that a change in liquid volume may be determined using Archimedes' principle.

An electronic rack includes a condensing unit to be coupled to a first distribution manifold to circulate single-phase cooling fluid received from a first cooling fluid source. The electronic rack further includes a server chassis unit positioned underneath the condensing unit, and the server chassis unit is coupled to a second distribution manifold to receive two-phase cooling fluid from a second cooling fluid source. The second distribution manifold fills the server chassis which contains one or more electronic devices to at least partially submerged the electronics devices in the two-phase cooling fluid, wherein the two-phase cooling fluid is to extract heat from the electronic devices and to evaporate into vapor upwardly into the condensing unit, and wherein the condensing unit is to condense the vapor into a fluid phase and to return the fluid downwardly back into the server chassis unit.