The present invention includes a cartridge and system utilizing the cartridge that cools a computer. The cartridge first within a server stand and urges forced fluid into the computer.

An electronic device is disclosed. The electronic device includes a chassis and at least one plugin unit mounted in the chassis. The plugin unit includes a substrate, a heat receiving member, a radiator, and a heat transfer member. The substrate mounts a first electronic component and a second electronic component having a higher heat release value than the first electronic component. The heat receiving member receives heat by contacting the second electronic component. The radiator is shaped as a duct. The heat transfer member transfers the heat from the heat receiving member to the radiator. The chassis includes a fan that generates air-current inside the radiator and on one or more component mounting surfaces of the substrate.

Custom cooling strategies may be implemented for different regions in computers, servers, and other information handling systems. Chassis architecture may have multiple cooling fans, with each fan cooling a different region via dedicated duct work. A user or administrator may thus implement different cooling strategies for internal components, based on different thermal curves defined for each different region.

The present disclosure is directed to examples of modular data centers configured to provide cooling to liquid-cooled electronics equipment stored within the modular data centers. In one aspect, a modular data center can be configured to provide cooling without requiring the use of mechanical refrigeration (e.g. vapor-compression or absorption refrigeration), through the use of a dry cooler in combination with an optional evaporative cooler.

A thermal management system for an enclosure containing electrical components includes a cooling unit for controlling temperature inside the enclosure and a controller for the cooling unit, the controller being configured so that it can receive a three-phase power input signal and distribute power and control connected components using the three-phase signal. The controller can protect the compressor in critical scenarios such as thermal overload and overcurrent. The controller can output various faults such as missing phase alarm, imbalance phase alarm, overcurrent alarm, thermal overload alarm, door open alarm, and temperature and pressure alarms. An auto phase sequence correction controls the phase relay, accepting 3 phase 480 VAC power input from facility power terminal, supplying 3 phase power to the compressor and motor impellers, 12V DC power to a display unit, and 24V DC power to a remote access control module.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a first three-way flow controller is associated with a single-phase fluid and a second three-way flow controller is associated with a two-phase fluid, with a first three-way flow controller to enable a first flow path of a single-phase fluid from a coolant distribution unit to a cold plate or to enable a second flow path to a heat exchanger to cool a two-phase fluid to be used in a cold plate, and with a second three-way flow controller to enable a third flow path of a two-phase fluid to a cold plate or to enable a fourth flow path to a heat exchanger.

High-efficiency cooling is performed in a data center in response to a cooling and/or humidity demand using a system having multiple cooling loops. The system includes a plurality of integrated cooling systems each comprising one or more specifically sized chillers and a liquid loop to address the cooling demand. A free cooling heat exchanger is coupled to the first liquid loop for use when a wet-bulb temperature surrounding the data center is at or below a free cooling set point of the first chilled liquid loop. The system isolates humidity control components to a second chilled liquid loop, and enables greater control of the first chilled liquid loop of the data center to meet specific IT loads.

A disclosed example includes: a resource utilization analyzer to determine 1) first workloads of a first workload type deployed in a first server room in a data center, and 2) second workloads of a second workload type deployed in the first server room; a workload authorizer to determine that first virtual machines executing the first workloads and second virtual machines executing the second workloads cause a first server rack to generate an amount of heat; and a migrator to migrate the first virtual machines from the first server rack of the first server room to a second server rack of a second server room in the data center to reduce a temperature in the first server room based on the amount of heat, the migrator to migrate the first virtual machines to the second server rack without migrating the second virtual machines to the second server rack.

A thermal management module includes a fluid system in fluid communication with a main cooling fluid source; a first cooling fluid manifold, and a second cooling fluid manifold. The first cooling fluid manifold is in fluid communication with the fluid system and provides a cooling fluid between the fluid system and a first server rack adjacent to the thermal management module. The second cooling fluid manifold is in fluid communication with the fluid system and provides the cooling fluid between the fluid system and a second server rack adjacent to the thermal management module. The manifold is in internal position when no rack liquid is needed adjacently, and it is extended to the adjacent rack once fluid distribution is needed from the rack.

Embodiments are disclosed of an information technology (IT) cooling system. An IT container defines an internal volume and an immersion tank-which is adapted to submerge one or more servers in a two-phase immersion fluid and has a tank inlet fluidly coupled to a source of the two-phase immersion fluid. One or more cooling devices can be thermally coupled to a heat-generating component in a server, and each cooling device has a liquid inlet at or near its bottom and a vapor outlet at or near its top. A liquid distribution manifold below the cooling devices has a main liquid inlet and a plurality of liquid distribution outlets; at least one liquid distribution outlet is fluidly coupled to the liquid inlet of a cooling device. A vapor return above the one or more cooling devices has a plurality of vapor collection inlets and a main vapor outlet. At least one vapor collection inlet is fluidly coupled to the vapor outlet of a cooling device, so that a second two-phase fluid circulates through the liquid distribution manifold, the cooling devices, and the vapor return manifold.