A system and method for monitoring performance of an industrial process includes an input port for receiving signals representative of one or more performance parameters generated by the industrial process, a user interface including a display and a controller that is operably coupled with the input port and the user interface. The controller is configured to repeatedly receive signals over time via the input port representative of the one or more performance parameters of the industrial process and to generate a plurality of snapshots, wherein each snapshot includes a graphical representation of the one or more performance parameters of the industrial process at a corresponding time. The controller is configured to generate an animatable heat map including two or more of the plurality of snapshots arranged temporally and to display the animatable heat map on the display.

The present application provides a scenario temperature planning method and apparatus, a computer device, and a medium, where the scenario temperature planning method includes: obtaining original data in a current temperature planning cycle in a target scenario, where the original data is data generated based on a user's temperature adjustment operation; performing data merging and data elimination processing on the original data to obtain valid data; and adjusting temperature planning data of the current temperature planning cycle based on the valid data to obtain temperature planning data of a next temperature planning cycle of the current temperature planning cycle, so as to adjust a temperature in a target scenario in the next temperature planning cycle. The technical solution enables the adjusted temperature to meet the user's temperature requirements without requiring the user to manually plan and set the temperature, thereby improving user experience.

Described herein is a hybrid cooling device and a cooling method that use a combination of phase change cooling and air cooling. The hybrid cooling device includes a closed loop two phase system, one or more fans, and an assembly clamp. The two phase system further includes a cold plate, an integrated channel, and a radiator, and a pressure sensor. The cold plate can include phase change fluid for extracting heat from electronics on a printed circuit board sandwiched between the cold plate and the assembly clamp. The one or more fans can be used to create airflows for cooling both the cold plate and the radiator. The pressure sensor can be used to control the operation of the hybrid cooling device, which can be deployed in different system environments and server configurations.

An information handling system includes a corrosion controller that may monitor a corrosion sensor array, and determine a type of the corrosion based on a location of a corrosion sensor. The corrosion type may include humidity driven corrosion and non-humidity driven corrosion.

A system includes multiple MHACUs for cooling one or more servers in a data hall. The system also includes a pump package for providing cooling fluid to the MHACUs, and a fluid supply line conveying the cooling fluid to the MHACUs. The system also includes at least one computing device configured to: determine that a cooling fluid temperature in a first MHACU has risen to a first temperature that is less than a predetermined maximum temperature; in response to the determination, control the system to provide at least some of the cooling fluid to a second MHACU; determine that the cooling fluid temperature in the second MHACU has risen to a second temperature that is at least the predetermined maximum temperature; and in response to the determination, control the system to provide the cooling fluid to a fluid return line for return to the pump package.

Examples described herein relate to an interface and a network interface device coupled to the interface and comprising circuitry to: control power utilization by a first set of one or more devices based on power available to a system that includes the first set of one or more devices, wherein the system is communicatively coupled to the network interface and control cooling applied to the first set of one or more devices.

The present disclosure generally relates to a computer circuit board having an integrated voltage regulator assembly that may include a heat sink and at least one voltage regulator module board. The heat sink may have a metal plate with at least one recess in which the voltage regulator module board may be attached. The voltage regulator module board is electrically coupled to a semiconductor package and the heat sink is thermally coupled to the semiconductor package. The computer circuit board is used in high-performance computing devices including computer workstations and computer servers.

A self-sustained, submerged waterborne data center facility that utilizes a closed-looped heat management system that is both energy-efficient and cost-effective is disclosed. Embodiments employ a closed-looped, energy efficient, cost effective thermal management system that leverages natural resources to control thermal conditions and reduce the overall requirement for cooling power.

A system and method for active disturbance rejection based thermal control is configured to receive, at a first active disturbance rejection thermal control (ADRC) controller, a first temperature measurement from a first thermal zone. The ADRC controller generates a first output control signal for controlling a first cooling element, wherein the first output control signal is generated according a first estimated temperature and a first estimated disturbance calculated by a first extended state observer (ESO) of the first ADRC controller.

A modular data center includes a cooling module with a cooling module enclosure and a first cooling unit housed within the cooling module enclosure. The cooling module enclosure includes a first interface side wall with a first cooling module supply opening that receives a first portion of cooling air from the first cooling unit. The center further includes a data module with a data module enclosure for housing data equipment. The data module enclosure includes a second interface side wall with a first data module supply opening that receives the first portion of cooling air from the first cooling module supply opening such that the first portion of cooling air flows into the data module enclosure and removes heat from the data equipment.