An array substrate includes gate lines extending in a first direction and being portions of a gate metal film, source lines extending in a second direction and being portions of a source metal film, and first and second TFTs arranged alternately in the first direction. The first TFTs include first semiconductor portions that are portions of a first semiconductor film, first gate electrodes that are portions of the gate metal film, and first source electrodes and first drain electrodes that are portions of the source metal film. The second TFTs include second semiconductor portions that are portions of a second semiconductor film above the first semiconductor film via an insulating film, second gate electrodes that are portions of the gate metal film, and second source electrodes and second drain electrodes that are portions of the source metal film. The first and second semiconductor portions are alternately arranged.

In a thin film transistor layer, a first semiconductor film made of an oxide semiconductor, a first gate insulating film made of an inorganic insulating film, a first metal film, a first interlayer insulating film made of an inorganic insulating film, a second metal film, a protective insulating film made of an inorganic insulating film, and a flattening film made of an organic resin material are sequentially layered. The protective insulating film includes a thin film portion provided at a portion where a plurality of first wiring lines formed of the first metal film and a plurality of second wiring lines formed of the second metal film intersect with each other so as to be thinner than a portion of the protective insulating film around the intersecting portion.

A semiconductor device having a high degree of integration is provided. A first and second transistors which are electrically connected to each other and a first insulating layer are included. The first transistor includes a first semiconductor layer, a second insulating layer, and a first to third conductive layers. The second transistor includes a second semiconductor layer, a third insulating layer, and a fourth to sixth conductive layers. The first insulating layer is positioned over the first conductive layer and includes an opening reaching the first conductive layer. The second conductive layer is positioned over the first insulating layer. The first semiconductor layer is in contact with a top surface of the first conductive layer, an inner wall of the opening, and the second conductive layer. The third conductive layer is positioned over the second insulating layer to overlap with the inner wall of the opening. The third insulating layer is positioned over the fourth conductive layer. The fifth and sixth conductive layers are positioned over the fourth conductive layer with the third insulating layer therebetween. The second semiconductor layer is in contact with top surfaces of the fifth and sixth conductive layers, side surfaces thereof that face each other, and a top surface of the third insulating layer sandwiched between the fifth conductive layer and the sixth conductive layer.

An array substrate and a display panel. In the array substrate, orthographic projections of a first scan line connected to a first oxide transistor and a second scan line connected to a second oxide transistor on the substrate are separated from an orthographic projection of a first connection line connected between the first oxide transistor and a first transistor, and an orthographic projection of a second connection line connected between the first oxide transistor and the second oxide transistor on the substrate, thereby solving a problem of lateral crosstalk.

Related to the field of display panels, an array substrate, a manufacturing method thereof, and a display panel. The array substrate includes: the base substrate, the buffer layer, the active layer, the gate insulation layer, the gate, the interlayer insulation layer, the source, and the drain, which are stacked together. By using the gate insulation layer as a conductive mask of the active layer, and by adjusting the width of the gate and the width of the gate insulation layer, a width difference between the channel region and the gate is within the preset range, which reduces the problem of excessive width difference caused by the diffusion phenomenon of the channel region, and can at the same time meet the switching characteristics requirements of the thin film transistor and the definition requirements of the display panel.

A display device with a narrower frame can be provided. In the display device, a first layer, a second layer, and a third layer are provided to be stacked. The first layer includes a gate driver circuit and a data driver circuit, the second layer includes a demultiplexer circuit, and the third layer includes a display portion. In the display portion, pixels are arranged in a matrix, an input terminal of the demultiplexer circuit is electrically connected to the data driver circuit, and an output terminal of the demultiplexer circuit is electrically connected to some of the pixels. The gate driver circuit and the data driver circuit are provided to include a region overlapping some of the pixels. The gate driver circuit and the data driver circuit have a region where they are not strictly separated from each other and overlap each other. Five or more gate driver circuits and five or more data driver circuits can be provided.

To improve field-effect mobility and reliability in a transistor including an oxide semiconductor film. A semiconductor device includes a transistor including an oxide semiconductor film. The transistor includes a region where the maximum value of field-effect mobility of the transistor at a gate voltage of higher than 0 V and lower than or equal to 10 V is larger than or equal to 40 and smaller than 150; a region where the threshold voltage is higher than or equal to minus 1 V and lower than or equal to 1 V; and a region where the S value is smaller than 0.3 V/decade.

A thin film transistor includes an oxide semiconductor layer having crystallinity over a substrate, a gate electrode overlapping the oxide semiconductor layer, and an insulating layer between the oxide semiconductor layer and the gate electrode. The oxide semiconductor layer includes a plurality of crystal grains. Each of the plurality of crystal grains includes at least one of a crystal orientation <001>, a crystal orientation <101>, and a crystal orientation <111> obtained by an EBSD method. In occupancy rates of crystal orientations calculated based on measurement points having crystal orientations with a crystal orientation difference greater than or equal to 0 degrees and less than or equal to 15 degrees with respect to a normal direction of a surface of the substrate, an occupancy rate of the crystal orientation <111> is greater than an occupancy rate of the crystal orientation <001> and an occupancy rate of the crystal orientation <101>.

Provided is a display device with extremely high resolution, a display device with higher display quality, a display device with improved viewing angle characteristics, or a flexible display device. Same-color subpixels are arranged in a zigzag pattern in a predetermined direction. In other words, when attention is paid to a subpixel, another two subpixels exhibiting the same color as the subpixel are preferably located upper right and lower right or upper left and lower left. Each pixel includes three subpixels arranged in an L shape. In addition, two pixels are combined so that pixel units including subpixel are arranged in matrix of 32.

An organic light emitting display (OLED) device includes an organic light emitting diode having an anode and a cathode. The organic light emitting diode is configured to receive a reference voltage. A control transistor includes a first control electrode and a first semiconductor active layer. The control transistor is configured to receive a control signal. A driving transistor includes a second control electrode that is electrically connected to the control transistor, an input electrode that is configured to receive a power voltage, an output electrode that is electrically connected to the anode of the organic light emitting diode, and a second semiconductor active layer that includes a different material from that of the first semiconductor active layer. A shielding electrode is disposed on the second semiconductor active layer, overlapping the driving transistor, and configured to receive the power voltage.