A semiconductor electrostatic discharge (ESD) protection circuit comprises an N diode for limiting negative going voltages with reference to ground (V.sub.SS) and a P diode for limiting positive going voltages with reference to a positive supply voltage (V.sub.DD). The N-diode is formed in a single P-well surrounded by an N-well ring. The P-diode is formed in a single N-well surrounded by a P-well ring. The N-diode comprises a plurality of N+ fingers, each N+ finger is surrounded by a P+ guard ring. The P-diode comprises a plurality of P+ fingers, each P+ finger surrounded by an N+ guard ring. The plurality of N+ fingers and P+ fingers are coupled to an input-output pad. The P+ guard rings are coupled to ground (V.sub.SS) and the N+ guard rings are coupled to the positive supply voltage (V.sub.DD).

An integrated circuit includes first to second transistors and a resistive device. The first transistor is coupled between a pad and a first voltage terminal that provides a first supply voltage. The second transistor is coupled in parallel with the first transistor. A breakdown voltage of the first transistor is different from a trigger voltage of the second transistor. The resistive device is coupled between the pad and a second voltage terminal that provides a second supply voltage higher than the first supply voltage, and operates with the second supply voltage in an electrostatic discharge (ESD) event when the first and second transistors discharge a ESD current between the pad and the first voltage terminal.

The present disclosure provides a motherboard and a manufacturing method for the motherboard, the motherboard includes at least one display area, a periphery area surrounding the at least one display area, a plurality of test terminals, an electrostatic discharge line, a plurality of resistors and at least one thin film transistor. The plurality of test terminals are respectively electrically connected to the electrostatic discharge line through the plurality of resistors. At least one of the plurality of resistors includes an inorganic nonmetal trace. The at least one thin film transistor includes an active layer, and the inorganic nonmetal trace includes a same semiconductor matrix material as the active layer of the at least one thin film transistor.

An integrated circuit includes a first horizontal conductor and a second horizontal conductor. The integrated circuit includes a first diode between a first first-type block and a first second-type block, a second diode between a second first-type block and a second second-type block, and a third diode between a third first-type block and a third second-type block. The first first-type block and the first second-type block are aligned along a first column. The second first-type block and the second second-type block are aligned along a second column. The third first-type block and the third second-type block are aligned along a third column. The second first-type block is connected to the first second-type block through the second horizontal conductor. The third first-type block is conductively connected to the second second-type block through the first horizontal conductor.

A semiconductor device includes a substrate; a circuit region provided with a power supply wiring, a ground wiring, and a signal line; and a first diode connected between the signal line and a first wiring. The first wiring is one of the power supply wiring and the ground wiring. The first diode includes a first impurity region of a first conductive type, electrically connected to the signal line, and a second impurity region of a second conductive type, different from the first conductive type, electrically connected to the first wiring. The signal line, the first wiring, or both is formed in the substrate.

An electronic device is provided, which comprises: a substrate comprising an active region and a peripheral region; a common conductive line disposed corresponding to the peripheral region of the substrate; and a scan line disposed on the substrate, wherein the scan line is electrically connected to a first static discharge conductive line through a first electrostatic protection circuit in the peripheral region, wherein the common conductive line is electrically separated from the first static discharge conductive line; wherein in a top view of the substrate, there is a first distance between the common conductive line and the first static discharge conductive line, and the first distance is greater than or equal to 1.5 m and less than or equal to 12 mm.

A transient voltage suppressor (TVS) device includes a silicon controlled rectifier (SCR) as the clamp device between a high-side steering diode and a low-side steering diode. The SCR includes alternating emitter and base regions arranged interleaving in a direction along a major surface of a semiconductor layer and orthogonal to a current path of the SCR. The TVS device realizes low capacitance and high holding voltage at the protected node.

An intergrated circuit (IC) package includes a die, a package substrate coupled to the die, and a first electrostatic discharge (ESD) protection component coupled to the package substrate, where the first electrostatic discharge (ESD) protection component is configured to provide package level electrostatic discharge (ESD) protection. In some implementations, the first electrostatic discharge (ESD) protection component is embedded in the package substrate. In some implementations, the die includes an internal electrostatic discharge (ESD) protection component configured to provide die level electrostatic discharge (ESD) protection. In some implementations, the internal electrostatic discharge (ESD) protection component and the first electrostatic discharge (ESD) protection component are configured to provide cumulative electrostatic discharge (ESD) protection for the die.

An integrated circuit device includes at least two epitaxially grown active regions grown onto a substrate, the active regions being placed between a first gate device and a second gate device. The integrated circuit device includes at least one dummy gate between the two epitaxially grown active regions and between the first gate device and the second gate device, wherein each active region is substantially uniform in length. The first gate device and the second device are formed over a first well having a first conductivity type and the dummy gate is formed over a second well having a second conductivity type.

The short-circuit protection circuit for a Gate Driver on Array (GOA) liquid crystal panel contains a power module, a first booster module, a feedback module, and a second booster module series-connected in the this order. A control module is electrically connected to the first booster, feedback, and second booster modules. The power module provides a power voltage. The control module provides a pulse width modulation (PWM) signal so as to control the first and second booster modules to transform the power voltage into driving voltage. The feedback module extracts a feedback current from a current flowing from the first to the second booster module and provides a feedback signal to the control module. When the feedback current exceeds a current threshold, the control module cuts off the PWM signal output so as to achieve short-circuit protection. A liquid crystal panel incorporating the above short-circuit protection circuit is also provided.