A photodetector device includes a germanium semiconductor layer including a plurality of nanostructures at an upper surface of the germanium semiconductor layer, a conductive layer on the plurality of nanostructures, the conductive layer and the germanium semiconductor layer forming a first Schottky junction, and a tunneling barrier layer between the germanium semiconductor layer and the conductive layer.

A device and a method of forming a device. The method comprises forming an oxide material film; forming two metal electrodes on the oxide material film, the two metal electrodes laterally spaced from each other such that an electric path between the two electrodes comprises at least a portion of the oxide material film; configuring the oxide material film such that a current-voltage characteristic of the device as measured via the two metal electrodes exhibits nonlinearity and rectification.

The present invention relates to plasmonic components, more particularly plasmonic waveguides, and to plasmonic photodetectors that can be used in the field of microoptics and nanooptics, more particularly in highly integrated optical communications systems in the infrared range (IR range) as well as in power engineering, e.g. photovoltaics in the visible range. The present invention also specifies a method for producing a plasmonic component, more particularly for photodetection on the basis of internal photoemission.

An analyte-detection system has an optical waveguide with first and second cladding layers adjacent a core; a light source coupled to provide light to the waveguide; a photodetector such as a metal-semiconductor-metal, vertical PIN, or horizontal PIN photodetectors, the photodetector having an absorber configured to detect light escaping from the waveguide through the first cladding layer; multiple, separate, photocurrent collectors, where each photocurrent collector collects current from a separate portion of the photodetector absorber; and at least one current-sensing amplifier for receiving photocurrent. The photodetector absorber is an undivided absorber region for multiple photocurrent collectors. Either separate amplifiers are provided for each of the multiple photocurrent collection lines, or multiplexing logic couples selected photocurrent collectors to amplifiers, while coupling unselected photocurrent collectors to a bias generator.

A semiconductor device has a layered structure. The semiconductor device includes a metallic layer of thickness 1-100 nm, with a thickness optimized to absorb light in a wavelength range of operation. The device further includes an adjacent semiconductor layer additionally adjacent to an ohmic electrical contact, wherein the interface between the metallic layer and the semiconductor layer is electrically rectifying and energy selective. The device further includes a reflective back surface positioned opposite to the semiconductor layer relative to incident light providing broadband reflection in the wavelength range of operation. The semiconductor layer includes a quantum well adjacent to the metallic layer, wherein the energy selectivity is provided by the quantum well allowing charge carrier tunneling from the metallic layer. The device further may include an additional anti-reflection dielectric layer deposited on the metallic layer that is configured to minimize reflection of light in the wavelength range of operation.

A semi-reflective display and a method for fabricating and assembling a semi-reflective display are presented, where the display may be comprised of visible light rectifying antenna arrays tuned to four different colors, which when forward biased may use electric power to amplify reflected colored light, and when reversed biased may generate electric power by absorbing light. TFT-tunnel diode logic may be used to control each sub-pixel.

A rectifier comprising a metal-insulator-metal (MIM) structure. The insulator may be a native oxide with an adjacent layer of graphene. In one implementation, the rectifier is used in an electromagnetic energy collector consisting of a planar waveguide formed of multiple material layers having at least two different dielectric constants. MIM rectifiers are aligned with mirrors are formed within the waveguide core. In some arrangements, a plurality of MIM rectifiers are disposed in a column or 3D array beneath each mirror.

A photoelectric conversion element includes a first electrode, a ferroelectric layer provided on the first electrode, and a second electrode provided on the ferroelectric layer, the second electrode being a transparent electrode, and a pn junction being formed between the ferroelectric layer and the first electrode or the second electrode.

A UVC Metal-Semiconductor-Metal photodetector with metallic contacts made of Ni and/or Au and/or Ti, characterized in that the photodetector comprises an aluminum alloy with Ga2O3, providing a broadened and/or shifted spectral response toward shorter wavelengths compared to a Ga2O3-only based detector. The invention also relates to an imaging system based on a UVC focal plane array with a network of MSM photodetectors with metallic contacts made of Ni and/or Au and/or Ti, based on (Al)Ga2O3, for remote detection/location/optical imaging of a fire, corona discharge, missile launch, ozone hole monitoring, or gas detection. The invention also relates to MSM UVC photodetectors designed on a substrate that is transparent in the UVC, allowing back-illumination to facilitate the manufacturing of flip-chip devices with higher efficiency compared to front-illuminated detectors by avoiding light reflections from the front surface metallic contacts.

Provided herein are MXene-containing photodetectors and related methods. Also provided are MXene-containing THz polarizers as well as MXene-containing MOSFETs, MESFETs, and HEMFETs.