A detector may be provided with an array of sensing elements. The detector may include a semiconductor substrate including the array, and a circuit configured to count a number of charged particles incident on the detector. The circuit of the detector may be configured to process outputs from the plurality of sensing elements and increment a counter in response to a charged particle arrival event on a sensing element of the array. Various counting modes may be used. Counting may be based on energy ranges. Numbers of charged particles may be counted at a certain energy range and an overflow flag may be set when overflow is encountered in a sensing element. The circuit may be configured to determine a time stamp of respective charged particle arrival events occurring at each sensing element. Size of the sensing element may be determined based on criteria for enabling charged particle counting.

The present disclosure provides a semiconductor device including: a first semiconductor layer including a first region and a second region adjacent to the first region; a first insulator layer provided above the first semiconductor layer; an intermediate semiconductor layer, having an n-type conduction, provided above the first region of the first semiconductor layer and above the first insulator layer; a second insulator layer provided above the intermediate semiconductor layer; a second semiconductor layer provided above the first region of the first semiconductor layer and above the second insulator layer; a sensor formed in the second region of the first semiconductor layer; a contact electrode connected to the intermediate semiconductor layer; and a circuit element formed in the second semiconductor layer.

A method of preparing two dimension bent X-ray crystal analyzers in strips feature is provided. A crystal wafer in strips is bonded to a curved substrate which offers the desired focus length. A crystal wafer in strips is pressed against the surface of the substrate forming curved shape by anodic bonding or glue bonding. The bonding is permanently formed between crystal wafer and its substrate surface, which makes crystal wafer has same curvature as previously prepared substrate.

The present disclosure provides a semiconductor device including: a first semiconductor layer including a first region and a second region adjacent to the first region; a first insulator layer provided above the first semiconductor layer; an intermediate semiconductor layer, having an n-type conduction, provided above the first region of the first semiconductor layer and above the first insulator layer; a second insulator layer provided above the intermediate semiconductor layer; a second semiconductor layer provided above the first region of the first semiconductor layer and above the second insulator layer; a sensor formed in the second region of the first semiconductor layer; a contact electrode connected to the intermediate semiconductor layer; and a circuit element formed in the second semiconductor layer.

A semiconductor detector includes a plate-shaped semiconductor part, a signal output electrode for outputting a signal provided at one surface of the semiconductor part, a plurality of curved electrodes provided at the one surface of the semiconductor part and which have distances from the signal output electrode that are different from each other, and an arc-shaped collection electrode for collecting an electric charge generated at the semiconductor part. The plurality of curved electrodes are applied with voltage to generate in the semiconductor part a potential gradient in which a potential varies toward the signal output electrode. The collection electrode is located at a part of the semiconductor part between an adjacent pair of curved electrodes. The collection electrode is connected to a curved electrode located a distance from the signal output electrode shorter than a distance between the collection electrode and the signal output electrode among the curved electrodes.

For manufacturing a radiation window for an X-ray measurement apparatus, an etch stop layer is first produced on a polished surface of a carrier. A thin film deposition technique is used to produce a boron carbide layer on an opposite side of the etch stop layer than the carrier. The combined structure including the carrier, the etch stop layer, and the boron carbide layer is attached to a region around an opening in a support structure with the boron carbide layer facing the support structure. The middle area of carrier is etched away, leaving an additional support structure.

Presented herein are X-ray sensors comprising graphitic carbon nitride materials (gCNs) and a processes for the manufacture of the gCNs and X-ray sensors.

An electrical generator system including a radionuclide material; and a sandwich structure, the sandwich structure including: a layer of an n-type semiconductor material; a layer of intrinsic n-type semiconductor material; a layer of p-type semiconductor material; and metal electrodes, one of the electrodes being in direct contact with said n-type semiconductor material and another electrode being in contact with the p-type semiconductor material, forming metal-semiconductor junctions therebetween; wherein radiation emissions received from said radionuclide material are converted into electrical energy at said metal-semiconductor junctions; and electrical contacts connected to said electrodes which facilitate the flow of said electrical energy when connected to a load.

The invention relates to radiation detection with a directly converting semiconductor layer for converting an incident radiation into electrical signals. Sub-band infra-red (IR) irradiation considerably reduces polarization in the directly converting semi-conductor material when irradiated, so that counting is possible at higher tube currents without any baseline shift. An IR irradiation device is integrated into the readout circuit to which the crystal is flip-chip bonded in order to enable 4-side-buttable crystals.

A radiation detection element includes plural hexagonal pixels arrayed in a honeycomb form and having sensor portions that generate charges due to radiation being irradiated. The radiation detection element includes charge accumulating capacitors that accumulate generated charges, and TFT switches for reading-out the charges accumulated at the capacitors. The radiation detection element includes scan lines disposed parallel in a first direction, to which switching signals that control switching of the TFT switches are outputted; and data lines disposed parallel in a second direction intersecting the first direction, to which charges read-out by the TFT switches are outputted. The TFT switches are disposed to be, in the first direction, connected to the data lines from alternately different sides of the data line, and such that an arrangement of source electrodes and drain electrodes of the TFT switches is the same in the first direction.