A solar cell is provided with: a semiconductor substrate having a light-receiving surface and a non-light-receiving surface; a PN junction section formed on the semiconductor substrate; a passivation layer formed on the light-receiving surface and/or the non-light-receiving surface; and power extraction electrodes formed on the light-receiving surface and the non-light-receiving surface. The solar cell is characterized in that the passivation layer includes an aluminum oxide film having a thickness of 40 nm or less. As a result of forming a aluminum oxide film having a predetermined thickness on the surface of the substrate, it is possible to achieve excellent passivation performance and excellent electrical contact between silicon and the electrode by merely firing the conductive paste, which is conventional technology. Furthermore, an annealing step, which has been necessary to achieve the passivation effects of the aluminum oxide film in the past, can be eliminated, thus dramatically reducing costs.

Embodiments of the present disclosure relates to the field of solar cells, and in particular to a solar cell and a photovoltaic module. The solar cell includes: a substrate having a front surface and a rear surface; a first tunnel layer and a first doped conductive layer sequentially formed over the front surface of the substrate, the first tunnel layer and the first doped conductive layer are each aligned with a metal pattern region on the front surface; and a second tunnel layer and a second doped conductive layer sequentially formed over the rear surface of the substrate, and in a respective Raman spectrum, a full width at half maximum corresponding to the first doped conductive layer is not greater than a full width at half maximum corresponding to the second doped conductive layer.

A layered structure is provided for a solar cell having tunnel-oxide-passivated contacts. The layered structure includes at least one tunnel oxide layer and a c-SiCx layer, wherein x0.5. A solar cell having tunnel-oxide-passivated contacts is also provided. The solar cell includes at least one crystalline n-doped or p-doped silicon layer, and the layered structure having the tunnel-oxide passivated contacts. A method for producing a layered structure for a solar cell having tunnel-oxide-passivated contacts is additionally provided. The method includes providing a substrate layer comprising a silicon layer, depositing a tunnel oxide layer on the substrate layer, and depositing a u c-SiCx:H layer, which is n-doped or p-doped, on the tunnel oxide layer.

A method of making a single-photon detector includes growing an epitaxial multi-layer structure that includes a buffer layer, an absorption layer, a transition layer, a field control charge layer, a multiplication layer, an inversion layer, a migration layer, a window layer, and an Ohmic contact layer sequentially on a substrate. A curved diffusion region is formed in the window layer and the Ohmic contact layer via a diffusion process. A mesa structure is formed by etching the epitaxial multi-layer. A light input window is formed on the substrate. A p-type electrode is formed on the Ohmic contact layer, and an n-type electrode is formed on the substrate. The inversion layer provides supplementary regulation of an electric field distribution that is regulated by the field control charge layer. A single-photon detector made from the method, and a single-photon detector array made with a multitude of the single-photon detectors are also provided.

The application discloses a solar cell and a preparation method for a solar cell. The preparation method for a solar cell comprises: sequentially forming a tunnel silicon oxide layer, an N-type doped polysilicon layer, and a back passivated anti-reflection film on a back surface of an N-type silicon substrate; performing grooving on the back passivated anti-reflection film, and forming a nickel metal layer in a grooved region; printing a back fine gate electrode on the nickel metal layer, and printing a back main gate electrode on the back passivated anti-reflection film, wherein the back fine gate electrode is electrically connected to the back main gate electrode.

A process for fabricating a detecting device includes producing a getter pad based on amorphous carbon resting on a mineral sacrificial layer that covers a thermal detector and producing a thin encapsulating layer that rests on the mineral sacrificial layer and that covers an upper face and sidewalls of the getter pad. The mineral sacrificial layer is removed via a first chemical etch, and a protective segment of the getter pad is removed via a second chemical etch.

An N-type double-sided solar cell preparation method comprises: sequentially forming a front aluminum oxide passivation layer and a front silicon nitride anti-reflection layer on a front face of an N-type silicon wafer. The front aluminum oxide passivation layer is prepared by using a plasma-enhanced atomic layer deposition method, and the deposition conditions thereof involve: any frequency in the frequency range of 40 kHz to 400 kHz is selected to be a radio-frequency power supply frequency, a gaseous aluminum source is first introduced into a plasma apparatus in a vacuum state, such that a layer of aluminum source molecules is adsorbed on the surface of the silicon wafer, and a gaseous oxygen source is then introduced, such that the oxygen source is ionized into plasma and reacts with the aluminum source to obtain aluminum oxide.

A solar cell and a photovoltaic module are provided. The solar cell includes an N-type substrate having a front surface and a rear surface, a passivation stack disposed on the front surface, and a tunneling oxide layer and a doped conductive layer disposed on the rear surface. The passivation stack includes an oxygen-containing dielectric layer including a metal oxide material, a first passivation layer including an oxygen-containing silicon nitride material, and a second passivation layer including a silicon oxynitride material. A thickness of the oxygen-containing dielectric layer is in a range of 1 nm to 15 nm in a direction perpendicular to the front surface, a thickness of the first passivation layer is in a range of 30 nm to 60 nm in the direction perpendicular to the front surface, and a thickness of the second passivation layer is in a range of 20 nm to 40 nm in the direction perpendicular to the front surface.

A passivation process, including the following successive steps: a) providing a structure including a crystalline silicon-based substrate having opposite first and second surfaces; first and second oxide films; b) applying ultraviolet radiation to the structure, under an ozone atmosphere, in such a way that the first oxide film has: a thickness strictly greater than the thickness of the second oxide film, and/or a composition closer to the stoichiometric compound; c) forming first and second polysilicon layers on the first and second oxide films, respectively, these first and second polysilicon layers comprising phosphorus atoms and boron atoms, respectively; d) applying a heat treatment at a temperature greater than or equal to the electrical activation temperature of the boron atoms so as to electrically activate the phosphorus atoms and the boron atoms concomitantly.

The disclosure provides a solar cell and a back contact structure thereof, a photovoltaic module, and a photovoltaic system. The back contact structure includes a first doped region having an opposite polarity to a silicon substrate and a second doped region having a same polarity as the silicon substrate. An isolation region is arranged between the first doped region and the second doped region. The protective region arranged on the first doped region includes an insulation layer and a third doped layer having a same polarity as the second doped region. An opening is provided in the protective region to connect the first conductive layer to the first doped region. In the present invention, scratches caused by belt transmission in an existing cell fabrication process is resolved.