A method of treatment of at least one cut solar cell, the method including steps of: providing the at least one solar cell, said cell having previously been subjected to a cutting process; and performing a carrier injection treatment on at least a cut edge of the cell.

The present disclosure relates to a method for fabricating an array of nanoprojections, where the nanoprojections may include nanopillars, nanowires, nanoneedles or nanocones. The present disclosure also relates to an array of the nanoprojections, and to uses of such arrays.

A metal-semiconductor contact structure is provided. The metal-semiconductor contact structure includes a doped silicon-based semiconductor layer and a metal electrode in contact with each other. A contact region between the doped silicon-based semiconductor layer and the metal electrode includes a first conductive region and a second conductive region. In the first conductive region, the metal electrode is recessed towards an inner direction of the doped silicon-based semiconductor layer to form a pit island, a silicon-based eutectic in conductive connection with the doped silicon-based semiconductor layer is provided in the pit island, and a conductive crystal in conductive connection with the silicon-based eutectic is provided. A conductive aggregate including a glass phase material and metal conductive particles is provided in the second conductive region, and the metal conductive particles have a same kind of the metal element as the conductive crystal.

A metal-semiconductor contact structure and a preparation method thereof, a solar cell and a photovoltaic module are provided. The metal-semiconductor contact structure includes a metal electrode and a semiconductor layer in contact with each other. The metal electrode has a metal element, and the semiconductor layer has a semiconductor element and a doping element for doping the semiconductor layer. A contact interface between the metal electrode and the semiconductor layer has a hole and a conductive structure. The conductive structure includes a conductive eutectic adjacent to the semiconductor layer, and a conductive crystal extending from the conductive eutectic into the hole. The conductive eutectic includes a eutectic formed by the metal element and the semiconductor element, and the conductive crystal includes a crystal formed by crystallization of the metal element.

A method for depositing a metallic material on a surface of a substrate comprising the steps of: providing the substrate having opposite first and second major surfaces; providing an arrangement for depositing a metallic material on a surface of the substrate, the arrangement comprising: a support structure having an electrode, a counter electrode, and an electrolyte for depositing metal ions onto one or more portions of the first major surface of the at least one substrate; attaching the substrate to the support structure wherein the electrode is in electrical contact with the substrate; contacting the substrate and the counter electrode with the electrolyte; and thereafter passing an electrical current through the electrolyte between the first major surface of the at least one substrate and the counter electrode such that the metallic material is deposited at at least some areas of the first major surface of the at least one substrate.

The embodiments of the present disclosure relate to the photovoltaic field and provide a photovoltaic cell and a preparation method thereof, and a photovoltaic module. The photovoltaic cell includes: a substrate having a first surface; a passivation layer located on the first surface, the passivation layer has a groove exposing the first surface, and the passivation layer has a side wall forming the groove; and a grid line extending along a first direction, the grid line is at least partially located in the groove and is in ohmic contact with a part of the first surface exposed by the groove, and a gap is formed between the grid line at least partially located in the groove and the side wall along the first direction. A material of the grid line includes a low-fire-through conductive material.