Thin film devices such as solar cells are typically patterned on substrates as thin films requiring that the devices be electrically isolated when arrays are formed and/or be mechanically separated for packaging. With the development of thin film processes based upon perovskite inks then large area substrates can be implemented. Further, such perovskite inks and their low temperature processing allow them to employ low temperature flexible and/or conformal substrates such as polymeric substrates for example. Accordingly, a requirement exists for electrical isolating and/or mechanically isolating thin film devices with different physical layer structures, different geometries etc. on a wide range of substrates.

An apparatus for transportation of a thin film substrate under vacuum conditions is described. The apparatus for transportation includes a rotatable roller with a substrate facing surface including a first substrate facing surface portion, wherein the substrate facing surface includes one or more gas outlets, wherein the one or more gas outlets are configured for releasing a gas flow and the roller includes a deposition region and at least one non-deposition region. The apparatus further includes a gas distribution for providing the gas flow through the one or more gas outlets into an interspace between the thin film substrate and the first substrate facing surface portion, and a sealing belt conveyor system including one or more sealing belts provided at the at least one non-deposition region.

The present teachings relate to a photovoltaic packaging comprising a polymer back layer, photovoltaic cells electrically connected to each other, a polymer front layer which is transparent to light, and which is configured to be connected to the polymer back layer by means of welding, wherein the photovoltaic cells are located between the front and back layer, the front and back layer being connected to each other by means of a welded connection, such that the photovoltaic cells is completely enclosed between the front layer and the back layer by the welded connection, surrounding the photovoltaic cells, and wherein each individual cell is separated from the remaining of the photovoltaic cells by the welded connection. The present teachings also relate to a method of manufacturing, and to a solar panel.

A method and a wet bench for processing a plurality of solar cell substrates are described. Each solar cell substrate includes a silicon wafer. The method includes steps of removing at least a partial area of a near-surface layer of the silicon wafer by an etching process by treating the surface of the solar cell substrate with an etching liquid, and producing a silicon oxide thin film at least on a partial surface of the solar cell substrate by treating the partial surface with an oxidising liquid. The solar cell substrates are subjected to process steps (i) and (ii) sequentially, one after the other within a single processing apparatus. The wet bench usable for etching liquid baths as well as oxidation liquid baths in which the solar cell substrates may be superficially oxidised, for example in an ozone-containing solution.

Embodiments of the present disclosure provide a method for welding cell strings and a series welding machine. The method includes: forming an arrangement of a plurality of solar cells; inspecting the arrangement of the plurality of solar cells; providing a plurality of initial welding strips including first initial welding strips and second initial welding strips, the first initial welding strips interleave with the second initial welding strips in a first direction; cutting each of the first initial welding strips at first cutting positions, and cutting each of the second initial welding strips at second cutting positions, to obtain a plurality of welding strips; moving each welding strip in a second direction to form a set of welding strips; transferring the set of welding strips onto the arrangement of the plurality of solar cells; and welding the plurality of welding strips to corresponding solar cells to form a cell string.

Pattern transfer printing (PTP) methods are provided, which comprise: (i) handling a tape with multiple pattern transfer sheets having patterns of trenches, to controllably deliver the pattern transfer sheets for paste filling and consecutively for pattern transfer, (ii) mixing, continuously and uniformly, at least two types of conductive printing pastes having different particle sizes and/or at least one type of conductive printing paste with a NIR (near infrared) absorbing dyeto form a uniform paste mixture, (iii) filling the trenches on the delivered pattern transfer sheets with the paste mixture, (iv) controllably delivering wafers for the pattern transfer, and (v) transferring the paste mixture from the pattern transfer sheets onto the delivered wafers, by releasing the paste mixture from the trenches upon illumination by a laser beam. The methods yield highly accurate, ultrafine conductive lines, e.g., for photovoltaic (PV) applications.

The semiconductor device comprises a semiconductor substrate (1), a photosensor (2) integrated in the substrate (1) at a main surface (10), an emitter (12) of radiation mounted above the main surface (10), and a cover (6), which is at least partially transmissive for the radiation, arranged above the main surface (10). The cover (6) comprises a cavity (7), and the emitter (12) is arranged in the cavity (7). A radiation barrier (9) can be provided on a lateral surface of the cavity (7) to inhibit cross-talk between the emitter (12) and the photosensor (2).

An ion implantation system having a grid assembly. The system includes a plasma source configured to provide plasma in a plasma region; a first grid plate having a plurality of apertures configured to allow ions from the plasma region to pass therethrough, wherein the first grid plate is configured to be biased by a power supply; a second grid plate having a plurality of apertures configured to allow the ions to pass therethrough subsequent to the ions passing through the first grid plate, wherein the second grid plate is configured to be biased by a power supply; and a substrate holder configured to support a substrate in a position where the substrate is implanted with the ions subsequent to the ions passing through the second grid plate.

A laser processing system can be utilized to produce high-performance interdigitated back contact (IBC) solar cells. The laser processing system can be utilized to ablate, transfer material, and/or laser-dope or laser fire contacts. Laser ablation can be utilized to remove and pattern openings in a passivated or emitter layer. Laser transferring may then be utilized to transfer dopant and/or contact materials to the patterned openings, thereby forming an interdigitated finger pattern. The laser processing system may also be utilized to plate a conductive material on top of the transferred dopant or contact materials.

Examples of a substrate processing apparatus includes a chamber configured to contain a stage, a light receiving device configured to receive light inside the chamber, and a substrate transfer apparatus that includes a shaft and a rotation arm configured to rotate with rotation of the shaft and is configured to supply a plurality of light beams having different amounts of light to the light receiving device.