A solar battery module according to an embodiment has at least one solar battery panel, a flexible substrate and a package. A solar battery cell is formed in the at least one solar battery panel. The flexible substrate is directly or indirectly connected to the at least one solar battery panel. A bypass diode is mounted on the flexible substrate. The flexible substrate forms a bypass line of the at least one solar battery panel. The package accommodates the at least one solar battery panel. The flexible substrate has a base material and a wiring. The wiring is supported by the base material. The wiring has a flying lead and a terminal. The flying lead protrudes from the base material. The flying lead is connected to the at least one solar battery panel. The terminal is provided on an outward side of the package.

The formation of solar cell contacts using a laser is described. A method of fabricating a back-contact solar cell includes forming a poly-crystalline material layer above a single-crystalline substrate. The method also includes forming a dielectric material stack above the poly-crystalline material layer. The method also includes forming, by laser ablation, a plurality of contacts holes in the dielectric material stack, each of the contact holes exposing a portion of the poly-crystalline material layer; and forming conductive contacts in the plurality of contact holes.

Embodiments of the present disclosure relates to the field of solar cells, and in particular to a solar cell and a photovoltaic module. The solar cell includes: a substrate having a front surface and a rear surface; a first tunnel layer and a first doped conductive layer sequentially formed over the front surface of the substrate, the first tunnel layer and the first doped conductive layer are each aligned with a metal pattern region on the front surface; and a second tunnel layer and a second doped conductive layer sequentially formed over the rear surface of the substrate, and in a respective Raman spectrum, a full width at half maximum corresponding to the first doped conductive layer is not greater than a full width at half maximum corresponding to the second doped conductive layer.

In a method for manufacturing a solar cell panel according to an embodiment of the present invention, a step of forming an electrode comprises the steps of: forming a main electrode part on a conductive region; and forming a connection electrode part on the main electrode part by using a paste comprising metal particles having a first metal, a solder material having a second metal different from the first metal, and an adhesive material.

The invention relates to a functional device (100) comprising a multilayer stack comprising, in succession: a first protective film (101), placed on a front side of said device (100), an encapsulating assembly (107), a second protective film (105), placed on the back side of the device, at least one electrically or optically active element (110) embedded in the encapsulating assembly, and an electrical connecting element (160) directly connected to said electrically or optically active element and suitable for transporting electricity from or to said electrically or optically active element, one end (162) of said electrical connecting element exiting directly from said functional device.

A solar cell can include a first plurality of metal contact fingers, and a second plurality of metal contact fingers interdigitated with the first plurality of metal contact fingers, wherein at least one of the first plurality of metal contact fingers comprises a wrap-around metal finger that passes between a first edge of the solar cell and at least one contact pads. A photovoltaic (PV) string including a solar cell with a wrap-around metal contact finger. A method of coupling an electrically conductive connector to a solar cell with a wrap-around metal contact finger.

Aligned metallization approaches for fabricating solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a semiconductor layer over a semiconductor substrate. A first plurality of discrete openings is in the semiconductor layer and exposes corresponding discrete portions of the semiconductor substrate. A plurality of doped regions is in the semiconductor substrate and corresponds to the first plurality of discrete openings. An insulating layer is over the semiconductor layer and is in the first plurality of discrete openings. A second plurality of discrete openings is in the insulating layer and exposes corresponding portions of the plurality of doped regions. Each one of the second plurality of discrete openings is entirely within a perimeter of a corresponding one of the first plurality of discrete openings. A plurality of conductive contacts is in the second plurality of discrete openings and is on the plurality of doped regions.

A solar cell is provided, including a substrate having a first surface and a second surface opposite to each other, an emitter formed on the first surface of the substrate and including a textured structure on a side away from the first surface, a passivation structure formed on the textured structure, first electrodes penetrating the passivation structure and in electrical contact with the textured structure of the emitter, and conductive eutectic layers each formed between a respective first electrode and the emitter and including first conductive particles and second conductive particles. Each of the first conductive particles has a shape different from a shape of any of the second conductive particles. The first conductive particles and the second conductive particles have a first number, the first conductive particles have a second number, and a ratio of the second number to the first number in a range of 20% to 80%.

A self-powered electronic system comprises a first chip (401) of single-crystalline semiconductor embedded in a second chip (302) of single-crystalline semiconductor shaped as a container bordered by ridges. The assembled chips are nested and form an electronic device assembled, in turn, in a slab of weakly p-doped low-grade silicon shaped as a container (330) bordered by ridges (331). The flat side (335) of the slab includes a heavily n-doped region (314) forming a pn-junction (315) with the p-type bulk. A metal-filled deep silicon via (350) through the p-type ridge (331) connects the n-region with the terminal (322) on the ridge surface as cathode of the photovoltaic cell with the p-region as anode. The voltage across the pn-junction serves as power source of the device.

Photovoltaic cells, methods for fabricating surface mount multijunction photovoltaic cells, methods for assembling solar panels, and solar panels comprising photovoltaic cells are disclosed. The surface mount multijunction photovoltaic cells include through-wafer-vias for interconnecting the front surface epitaxial layer to a contact pad on the back surface. The through-wafer-vias are formed using a wet etch process that removes semiconductor materials non-selectively without major differences in etch rates between heteroepitaxial III-V semiconductor layers.