Patent classifications
H10H20/0362
OPTICAL FILTERING FOR SEMICONDUCTOR DEVICE PACKAGING
An example electronic device including a semiconductor die and a mold compound overlying the die, and the mold compound is chemically altered to attenuate electromagnetic radiation within a range of wavelengths or frequencies.
EDGE-EMITTING SEMICONDUCTOR DEVICES AND RELATED METHODS
Semiconductor devices and more particularly edge-emitting semiconductor devices and related methods are disclosed. Exemplary edge-emitting semiconductor devices include LED edge emitters. Electrical connections for edge-emitting devices may be provided along certain device edges with opposing edges forming light-emitting edges. LED edge emitters may be vertically arranged and assembled together to form LED arrays with reduced pitch. Related methods include bonding multiple wafer-level structures, such as LED wafers, together, followed by separation techniques that result in individual edge emitters or groupings of edge emitters in the form of LED arrays.
METALLIC STRUCTURE FOR OPTICAL SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE
A metallic structure for an optical semiconductor device, including a base body having disposed thereon at least in part metallic layers in the following order; a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and a silver or silver alloy plated layer, wherein the silver or silver alloy plated layer has a thickness in a range of 0.001 m or more and 0.01 m or less.
PROTECTIVE SHEET, METHOD FOR PRODUCING ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING GLASS PIECE FORMING DISPLAY SURFACE OF DISPLAY APPARATUS
A protective sheet according to the present invention is a protective sheet for being attached to a protected surface of an electronic component having the protected surface, one surface of a glass piece forming a display surface of a display apparatus, or one surface of a glass plate for obtaining the glass piece. The protective sheet includes a protective layer for being attached to the protected surface of the electronic component, the one surface of the glass piece, or the one surface of the glass plate. The protective layer is made of one of a water-soluble resin composition and a curable resin composition with its adhesiveness reducible by curing reaction.
DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME
A display device includes a display panel and a cover window disposed on the display panel. The display panel includes a deformation part, which is curvedly deformable, and a non-deformation part adjacent to the deformation part. The cover window includes a first cover part overlapping the non-deformation part and including crystallized glass, and a second cover part overlapping the deformation part and not including the crystallized glass.
Display device and method of manufacturing the same
A display device includes: a substrate having a display area and a non-display area; and a pixel in each of a pixel area in the display area. Each of the pixels includes: an insulating layer on the substrate and having an opening; first and second electrodes on the insulating layer and spaced apart from each other; a plurality of light emitting elements in the opening; a first contact electrode electrically connecting one end of the light emitting elements and the first electrode to each other; a second contact electrode electrically connecting another end of the light emitting elements and the second electrode to each other; a first insulating pattern on the first contact electrode; and a second insulating pattern on the second contact electrode. The first insulating pattern and the second insulating pattern are on the same layer and spaced apart from each other.
Display device and manufacturing method thereof
A display device and a manufacturing method thereof are provided. The display device includes a display substrate, sub-pixels on the display substrate, each of the sub-pixels including a first electrode and a second electrode on the display substrate and spaced apart from each other, light emitting elements between the first electrode and the second electrode, an insulating layer covering the light emitting elements, a protective pattern on the insulating layer and overlapping one of the light emitting elements, and a bank on the insulating layer at a boundary of one of the sub-pixels.
Method for making electronic device arrays using a temporary substrate
A method for making light emitting device LED arrays includes the steps of providing a plurality of LEDs having a desired configuration (e.g., VLED, FCLED, PLED); attaching the LEDs to a carrier substrate and to a temporary substrate; forming one or more metal layers and one or more insulator layers configured to electrically connect the LEDs to form a desired circuitry; and separating the LEDs along with the layered metal layers and insulator layers that form the desired circuitry from the carrier substrate and the temporary substrate.
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
A display device includes a display panel in which a first region, a second region, and a third region are defined along a first direction, a window module disposed on the display panel, and including a window substrate, a coating member covering a side surface of the display panel and a side surface of the window module, and a lower substrate disposed under the display panel. A side surface of the window substrate is disposed more inwardly than the side surface of the display panel is, and a side surface of the coating member is connected to the lower substrate.
DEVICE AND METHOD FOR MANUFACTURING DISPLAY APPARATUS
A device for manufacturing a display apparatus includes a chamber including a first zone, a second zone, and a third zone arranged along a linear path, an inorganic film deposition mask disposed in the first zone, an organic film deposition mask disposed in the second zone, a deposition unit disposed in the third zone, and a susceptor which reciprocates between the first zone, the second zone, and the third zone.