In a luminescent diode and a method for manufacturing the same, a planar buried heterostructure (PBH) and a ridge waveguide structure are combined, so that the luminescent diode can be operated to generate a high output of 100 mW or more at low current. Further, it is possible to reduce electro-optic loss. In addition, the luminescent diode is applied to a wavelength tunable external cavity laser, so that it is possible to provide an external cavity laser having excellent output characteristics.

This invention discloses a method for the fabrication of GaN-based vertical cavity surface-emitting devices featuring a silicon-diffusion defined current blocking layer (CBL). Such devices include vertical-cavity surface-emitting laser (VCSEL) and resonant-cavity light-emitting diode (RCLED). The silicon-diffused P-type GaN region can be converted into N-type GaN and thereby attaining a current blocking effect under reverse bias. And the surface of the silicon-diffused area is flat so the thickness of subsequent optical coating is uniform across the emitting aperture. Thus, this method effectively reduces the optical-mode field diameter of the device, significantly decreases the spectral width of LED, and produces single-mode emission of VCSEL.

The embodiments described herein provide a high-luminous flux laser-based white light source. A plurality of laser packages are arranged in an array pattern on a common support member. The plurality of laser packages each include one or more laser diode devices and a phosphor member. The phosphor member converts a fraction of the electromagnetic radiation from each of the laser diode devices to an emitted electromagnetic radiation and a white light is outputted.

A light emitting device includes a laminated body having an active layer constituting a light waveguide, and first and second clad layers, and first and second electrodes. The light waveguide has first and second light emission surfaces from which light is emitted. The laminated body has a connection area connected to the second electrode. A width of the connection area is smallest at a central position where distances to the first and second light emission surfaces are equal, and increases toward end portion sides in an extending direction of the light waveguide. An outer edge of the connection area is provided with a first portion on the first light emission surface side, a second portion on the second light emission surface side, and third and fourth portions connecting the first and second portions. The third and fourth portions are smooth when viewed from the stacking direction.

In a light emitting device, a second electrode is provided over a ridge portion having a constant width in a plan view, a second cladding layer includes an electrical connection region electrically connected to the second electrode, the active layer constitutes a light waveguide through which light is guided in a region overlapping the ridge portion in the plan view, the light waveguide is provided with a first light emission surface and a second light emission surface from which the light is emitted, and, in the plan view, a width of the electrical connection region at a central position equidistant from the first light emission surface and the second light emission surface is smaller than a width of an end of the electrical connection region in an extending direction of the light waveguide.

In a light emitting device, a light waveguide is provided with a first region including a central position, a second region including a first light emission surface, and a third region including a second light emission surface. A second cladding layer includes a plurality of noncontact regions. The plurality of noncontact regions intersect the light waveguide. A ratio of an area in which the plurality of noncontact regions overlap the first region to an area of the first region is greater than a ratio of an area in which the plurality of noncontact regions overlap the second region to an area of the second region, and is greater than a ratio of an area in which the plurality of noncontact regions overlap the third region to an area of the third region.

The present invention provides a light emitting device which emit light having a high-order level without increasing a current injection density to an active layer. A light emitting device according to the present invention includes an upper electrode layer, a lower electrode layer, and an active layer provided between them. In this case, light is emitted by injection of electric current to the active layer through the upper electrode layer and the lower electrode layer, the active layer has a plurality of quantum-confined structures, and a first quantum-confined structure has a ground level having an energy level E.sub.0 and a high-order level having an energy level E.sub.1, and a second quantum-confined structure has an energy level E.sub.2 which is higher than the E.sub.0, and the E.sub.1 and the E.sub.2 are substantially matched.

This invention discloses a method for the fabrication of GaN-based vertical cavity surface-emitting devices featuring a silicon-diffusion defined current blocking layer (CBL). Such devices include vertical-cavity surface-emitting laser (VCSEL) and resonant-cavity light-emitting diode (RCLED). The silicon-diffused P-type GaN region can be converted into N-type GaN and thereby attaining a current blocking effect under reverse bias. And the surface of the silicon-diffused area is flat so the thickness of subsequent optical coating is uniform across the emitting aperture. Thus, this method effectively reduces the optical-mode field diameter of the device, significantly decreases the spectral width of LED, and produces single-mode emission of VCSEL

Integrated circuit chips may be optically interconnected using microLEDs. Some interconnections may be vertically-launched parallel optical links. Some interconnections may be planar-launched parallel optical links.

Materials containing picocrystalline quantum dots that form artificial atoms are disclosed. The picocrystalline quantum dots (in the form of boron icosahedra with a nearly-symmetrical nuclear configuration) can replace corner silicon atoms in a structure that demonstrates both short range and long-range order as determined by x-ray diffraction of actual samples. A novel class of boron-rich compositions that self-assemble from boron, silicon, hydrogen and, optionally, oxygen is also disclosed. The preferred stoichiometric range for the compositions is (B.sub.12H.sub.w).sub.xSi.sub.yO.sub.z with 3w5, 2x4, 2y5 and 0z3. By varying oxygen content and the presence or absence of a significant impurity such as gold, unique electrical devices can be constructed that improve upon and are compatible with current semiconductor technology.