Semiconductor devices and more particularly edge-emitting semiconductor devices and related methods are disclosed. Exemplary edge-emitting semiconductor devices include LED edge emitters. Electrical connections for edge-emitting devices may be provided along certain device edges with opposing edges forming light-emitting edges. LED edge emitters may be vertically arranged and assembled together to form LED arrays with reduced pitch. Related methods include bonding multiple wafer-level structures, such as LED wafers, together, followed by separation techniques that result in individual edge emitters or groupings of edge emitters in the form of LED arrays.

A metallic structure for an optical semiconductor device, including a base body having disposed thereon at least in part metallic layers in the following order; a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and a silver or silver alloy plated layer, wherein the silver or silver alloy plated layer has a thickness in a range of 0.001 m or more and 0.01 m or less.

A protective sheet according to the present invention is a protective sheet for being attached to a protected surface of an electronic component having the protected surface, one surface of a glass piece forming a display surface of a display apparatus, or one surface of a glass plate for obtaining the glass piece. The protective sheet includes a protective layer for being attached to the protected surface of the electronic component, the one surface of the glass piece, or the one surface of the glass plate. The protective layer is made of one of a water-soluble resin composition and a curable resin composition with its adhesiveness reducible by curing reaction.

The present disclosure provides a drive base plate, a light-emitting base plate, a display device, and a manufacturing method for the drive base plate. The drive base plate includes: a substrate; and a first conductive layer and a first block layer disposed on the substrate, the first conductive layer includes multiple first conductive portions arranged at intervals, and each of the first conductive portions includes a first contact pad; the first block layer includes first hollowed-out regions, each of the first hollowed-out regions corresponds to a respective first contact pads, an orthographic projection of the first contact pad on the substrate is within the orthographic projection of the first hollowed-out region on the substrate, and the material of the first block layer includes an oxidation-resistant material.

A leather-like light-emitting display device can include a leather-like sheet that is a laminate of a colored resin layer forming an outer surface layer, and a fiber substrate; a light-emitting portion disposed below the leather-like sheet; and a light-blocking portion configured to partially limit transmission of light, and interposed between any layers from the colored resin layer to the light-emitting portion. The leather-like light-emitting display device is configured to exhibit light-emitting display with a luminance Ya of 200 cd/m.sup.2 or less in a non-light emitting region corresponding to the light-blocking portion and a luminance Yb of 100 to 2,000 cd/m.sup.2 in a light-emitting region corresponding to a portion other than the light-blocking portion, both as measured from a surface of the colored resin layer, and Yb/Ya being 2.0 or more.

A chip structure is provided. The chip structure includes a chip wafer unit and a color conversion layer substrate unit arranged on a light-exit side of the chip wafer unit. The chip wafer unit includes a plurality of sub-pixel light-emitting functional layers. The color conversion layer substrate unit includes a color conversion layer arranged on the light-exit side of the chip wafer unit. The chip wafer unit further includes a first bonding layer, arranged between the sub-pixel light-emitting functional layers and the color conversion layer, and configured to bond the chip wafer unit and the color conversion layer substrate unit.

A display device includes a display panel and a cover window disposed on the display panel. The display panel includes a deformation part, which is curvedly deformable, and a non-deformation part adjacent to the deformation part. The cover window includes a first cover part overlapping the non-deformation part and including crystallized glass, and a second cover part overlapping the deformation part and not including the crystallized glass.

A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region.

An emitter and a method for emitting light are described. The emitter has a substrate with a substrate surface and at least one LED element arranged on the substrate surface for generating the light to be emitted. An active cooling unit for cooling the at least one LED element has at least one cooling channel. The at least one cooling channel is arranged on the substrate surface in a beam path of at least one portion of the light to be emitted, which can be generated by means of the at least one LED element, for redirecting the light to be emitted.

A display device includes a display panel in which a first region, a second region, and a third region are defined along a first direction, a window module disposed on the display panel, and including a window substrate, a coating member covering a side surface of the display panel and a side surface of the window module, and a lower substrate disposed under the display panel. A side surface of the window substrate is disposed more inwardly than the side surface of the display panel is, and a side surface of the coating member is connected to the lower substrate.