H10H20/857

LED PACKAGE STRUCTURE AND DISPLAY DEVICE
20250234689 · 2025-07-17 ·

A LED package structure is provided, comprising a light-emitting layer, a first medium layer, a second medium layer, a third medium layer and a reflective layer. A first surface of the first medium layer is attached to the light-emitting layer. A second surface of the first medium layer is attached to the third surface of the second medium layer, a refractive index of the second surface is larger than a refractive index of the third surface. A fourth surface of the second medium layer is attached to the fifth surface of the third medium layer, a refractive index of the fourth surface is larger than a refractive index of the fifth surface. The reflective layer is provided on a side of the third medium layer away from the second medium layer. A display device is also provided.

DISPLAY APPARATUS AND ELECTRONIC DEVICE
20250234691 · 2025-07-17 ·

Provided is a display apparatus including a substrate, a repair line disposed on the substrate, an insulating layer covering the repair line, a first thin-film transistor disposed in the insulating layer, a first connection line disposed on the insulating layer and at least a portion of the repair line, and a light-emitting element disposed on the first connection line and connected to the first connection line, wherein the insulating layer includes a first groove on the repair line.

EDGE-EMITTING SEMICONDUCTOR DEVICES AND RELATED METHODS

Semiconductor devices and more particularly edge-emitting semiconductor devices and related methods are disclosed. Exemplary edge-emitting semiconductor devices include LED edge emitters. Electrical connections for edge-emitting devices may be provided along certain device edges with opposing edges forming light-emitting edges. LED edge emitters may be vertically arranged and assembled together to form LED arrays with reduced pitch. Related methods include bonding multiple wafer-level structures, such as LED wafers, together, followed by separation techniques that result in individual edge emitters or groupings of edge emitters in the form of LED arrays.

DRIVE SUBSTRATES AND DISPLAY PANELS
20250006746 · 2025-01-02 ·

Drive substrates and display panels are provided. In a thin film transistor of the drive substrate, a structure with double-gate and double-active layer is formed by a first active layer, a first gate, a first sub-gate of a second gate, and a part of a second active layer in an area adjacent to an output electrode; and a structure with single active layer and top gate is formed by a second sub-gate of the second gate and a part of the second active layer in an area adjacent to an input electrode. The first gate and the second gate together control a first channel of the first active layer and a first portion of a second channel of the second active layer.

LIGHT-EMITTING DIODE LIGHT SOURCE HAVING HIGH LUMINOUS EFFICIENCY
20250006710 · 2025-01-02 · ·

A light-emitting diode (LED) light source having high luminous efficiency includes a substrate, a positive electrode pad, a negative electrode pad, a first LED chip and a second LED chip. The positive electrode pad is disposed on the substrate. The negative electrode pad is disposed on the substrate, and there is a groove formed between the negative electrode pad and the positive electrode pad. The first LED chip is disposed on the positive electrode pad, and electrically connected to the positive electrode pad and negative electrode pad. The second LED chip is disposed on the negative electrode pad, and electrically connected to the positive electrode pad and negative electrode pad. A portion of the first LED chip protrudes from the positive electrode pad and covers a portion of the groove.

DISPLAY ELEMENT AND MANUFACTURING METHOD THEREOF

A display element includes a first spacer, a second spacer, at least one first electrode, a second electrode, at least one LED structure, a reflective layer, a first transparent molding layer and a transparent conductive layer. The second spacer is located on one side of the first spacer. The first electrode is surrounded by the first spacer. The second electrode is surrounded by the second spacer. The LED structure is located on the first electrode. The reflective layer is located on a sidewall of the first spacer facing the LED structure. The first transparent molding layer is located on the reflective layer and surrounds the LED structure. The transparent conductive layer is located on the top surface of the second semiconductor layer and the top surface of the first transparent molding layer, and extends to the second electrode.

ANTIOXIDANTS, BACKLIGHT MODULES AND MANUFACTURING METHOD THEREOF
20250006867 · 2025-01-02 ·

Disclosed are an antioxidant, a backlight module and a manufacturing method thereof. The antioxidant includes a film-forming component and a volatilization-suppressing additive. The film-forming component includes at least one of a substituted or unsubstituted acrylic resin, isopropanolamine, and imidazoline, and a boiling point of the volatilization-suppressing additive is greater than that of the film-forming component.

DISPLAY ELEMENT AND MANUFACTURING METHOD THEREOF
20250006860 · 2025-01-02 ·

A display element includes a substrate, a three-colored LED light emitting structure, a first insulation layer, a first active device layer, at least one conductive via and at least one electrode. The three-colored LED light emitting structure is located on the substrate. The first insulation layer is located on the fourth semiconductor layer. The first active device layer is located on the first insulation layer, and the first active device layer includes at least one transistor. The conductive via extends from the first active device layer to and electrically connects at least one of the first semiconductor layer, the second semiconductor layer, the third semiconductor layer and the fourth semiconductor layer. The electrode is located upon the first active device layer.

OPTICAL PANEL
20250006866 · 2025-01-02 · ·

An optical panel includes a first substrate, a second substrate, and a display medium layer. The first substrate includes a first carrier having active and peripheral areas, a first metal wire pattern extending from the peripheral area to a central portion of the active area, a first insulating layer, and a first transparent electrode. The first insulating layer is located on the first carrier and the first metal wire pattern and has a first through hole overlapping the central portion. A portion of the first metal wire pattern is located below the first through hole. The first transparent electrode overlaps the active area entirely and is electrically connected to the first metal wire pattern. The second substrate has a second carrier and a second transparent electrode overlapping the first transparent electrode. The display medium layer is located between the first transparent electrode and the second transparent electrode.

DISPLAY APPARATUS
20250006881 · 2025-01-02 · ·

A display apparatus may include a substrate; a plurality of pixels on the substrate in a row direction and a column direction and including a plurality of sub-pixels; a plurality of sub-pixel circuits in the plurality sub-pixels on the substrate; and a plurality of gate lines on the substrate and connected to the plurality of sub-pixel circuits. Each of the plurality of sub-pixels may include a plurality of sub-light emitting diodes configured to emit light of the same color, at least one sub-light emitting diode of one sub-pixel included in one of the plurality of pixels may be configured to be driven by a gate line, and a sub-light emitting diode of another sub-pixel included in the same one of the plurality of pixels may be configured to be driven by another gate line that is different from the gate line.