An electronic component has an electronic semiconductor chip and a heat sink which is provided for dissipating heat generated during the operation of the electronic semiconductor chip. A lower face of the electronic semiconductor chip is secured to an upper face of the heat sink and is thermally connected to the heat sink. A connecting surface which is formed between the lower face of the electronic semiconductor chip and the upper face of the heat sink is segmented into connecting surface segments, wherein adjacent connecting surface segments are mutually spaced on a plane which is parallel to the lower face of the electronic semiconductor chip.

Display devices are provided. The display device includes a substrate, a plurality of light-emitting elements, a back plate, and a carrier. The substrate has a first thermal expansion coefficient. The plurality of light-emitting elements is disposed on the substrate. The back plate is disposed corresponding to the substrate and has a second thermal expansion coefficient. The carrier is disposed between the substrate and the back plate and has a third thermal expansion coefficient. The absolute value of the difference between the third thermal expansion coefficient and the first thermal expansion coefficient is less than or equal to the absolute value of the difference between the third thermal expansion coefficient and the second thermal expansion coefficient.

A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region.

An emitter and a method for emitting light are described. The emitter has a substrate with a substrate surface and at least one LED element arranged on the substrate surface for generating the light to be emitted. An active cooling unit for cooling the at least one LED element has at least one cooling channel. The at least one cooling channel is arranged on the substrate surface in a beam path of at least one portion of the light to be emitted, which can be generated by means of the at least one LED element, for redirecting the light to be emitted.

A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

A display apparatus may include a display panel configured to display an image, a plate disposed on a rear surface of the display panel, a heat dissipation member disposed on a rear surface of the plate and having a first hole, and an adhesive member disposed between the plate and the heat dissipation member and having a second hole. The heat dissipation member may include a body part and a pattern part.

An electronic device includes a heat dissipation structure that includes one or more openings. An electronic component is disposed on a surface of the heat dissipation structure and over the one or more openings. The electronic component is coupled to the heat dissipation structure by an adhesion material in the one or more openings.

Lensed optics for a modular linear light emitting device for precisely illuminating vertical and horizontal surfaces where needed at the required light intensity and uniformity ratio/s.

An electronic device is provided. The electronic device includes a cover including a first surface which is a portion of an outer surface of the electronic device and a second surface facing in a direction opposite to the first surface, and including a light transmission portion, a substrate disposed in an inner space of the electronic device, a light source disposed on the substrate to emit light through the light transmission portion, and a heat dissipation sheet disposed on the second surface of the cover to surround at least a portion of the light transmission portion, and a heat dissipation sheet attached on the second surface of the cover to surround at least a portion of the light transmission portion, wherein the heat dissipation sheet includes a heat diffusion member, and a light reflection member.

A light source module includes a frame having a plurality of mounting surfaces at different levels and side surfaces respectively connected to the plurality of mounting surfaces; a plurality of heat dissipaters respectively disposed on the plurality of mounting surfaces and extending to cover a side surface of the frame; and a light source including a plurality of light emitting devices respectively disposed on the plurality of heat dissipaters and respectively positioned above the plurality of mounting surfaces.