A cooling fan (1) for cooling an electronic device (2) is disclosed. The cooling fan (1) comprises a heat sink (5) thermally connectable to the electronic device (2), the heat sink (5) having a first clearance side (6a, 6b) centered relative to a longitudinal axis (L) of the heat sink (5), and several thermally conductive fan blades (13) arranged in a circle centered on the longitudinal axis (L). The fan blades (13) are rotatable relative to the heat sink (5) about the longitudinal axis (L) by a motor (19) and each fan blade (13) has a second clearance side (14) facing the first clearance side (6a, 6b). A clearance space (18) is provided between the first clearance side (6) and each second clearance side (14), the majority of said clearance spaces (18) having a size of 100 micrometer or less in a direction perpendicular to the first clearance side (6a, 6b) and the corresponding second clearance side (18).

Contrary to conventional wisdom, which holds that light-emitting diodes (LEDs) should be cooled to increase efficiency, the LEDs disclosed herein are heated to increase efficiency. Heating an LED operating at low forward bias voltage (e.g., V<k.sub.BT/q) can be accomplished by injecting phonons generated by non-radiative recombination back into the LED's semiconductor lattice. This raises the temperature of the LED's active rejection, resulting in thermally assisted injection of holes and carriers into the LED's active region. This phonon recycling or thermo-electric pumping process can be promoted by heating the LED with an external source (e.g., exhaust gases or waste heat from other electrical components). It can also be achieved via internal heat generation, e.g., by thermally insulating the LED's diode structure to prevent (rather than promote) heat dissipation. In other words, trapping heat generated by the LED within the LED increases LED efficiency under certain bias conditions.

The present disclosure provides a display module, which includes a silicon-based micro light emitting diode display panel and a heat dissipation device. The heat dissipation device includes a heat dissipation cavity disposed on a back surface of the silicon-based micro light emitting diode display panel and an electro-deformation member disposed on a cavity bottom of the heat dissipation cavity. In case that the electro-deformation member is powered on, the electro-deformation member deforms to avoid a channel causing an external environment to be in communication with the heat dissipation cavity, so that external air enters the heat dissipation cavity. External air has a relatively low temperature and can carry away 10 heat of the silicon-based micro light emitting diode display panel, so as to reduce a temperature of the silicon-based micro light emitting diode display panel, and improve a heat dissipation capability of the display module.

A cooling system includes a plurality of sensor sub-units arranged in a grid having first sides configured to be thermally connected to a heat source and opposing second sides. The heat source including a plurality of sub-regions that correspond with the first sides of each of the plurality of sensor sub-units. The plurality of sensor sub-units are configured to sample temperatures of the sub-regions of the heat source. The cooling system also includes a plurality of solid-state cooling sub-units configured to dissipate heat, a plurality of heat exchanger channels and a controller configured to determine the one or more sub-regions of the heat source to cool. Each heat exchanger channel is configured to dissipate heat. At least one surface of at least one of the heat exchanger channels includes a coating configured to boost conversion of heat energy being dissipated into infrared radiation.

A cooling system includes a plurality of sensor sub-units arranged in a grid having first sides configured to be thermally connected to a heat source and opposing second sides. The heat source including a plurality of sub-regions that correspond with the first sides of each of the plurality of sensor sub-units. The plurality of sensor sub-units are configured to sample temperatures of the sub-regions of the heat source. The cooling system also includes a plurality of solid-state cooling sub-units configured to dissipate heat, a plurality of heat exchanger channels and a controller configured to determine the one or more sub-regions of the heat source to cool. Each heat exchanger channel is configured to dissipate heat. At least one surface of at least one of the heat exchanger channels includes a coating configured to boost conversion of heat energy being dissipated into infrared radiation.

The present application discloses a display module and a display device. The display module comprises a substrate, a light emitting device, a radiation component and a detection unit. The light emitting device is on one side of the substrate, and the radiation component is on one side of the light-emitting device close to the substrate. An orthographic projection of the radiation component on the substrate overlapping at least in part with an orthographic projection of the light-emitting device on the substrate.

An integrated circuit includes an SOI substrate having a semiconductor layer over a buried insulator layer. An electronic device has an NWELL region in the semiconductor layer, a dielectric over the NWELL region, and a polysilicon plate over the dielectric. A white space region adjacent the electronic device includes a first P-type region in the semiconductor layer and adjacent the surface. The P-type region has a first sheet resistance and the NWELL region has a second sheet resistance that is greater than the first sheet resistance.