Light-emitting diode (LED) packages and more particularly a light collector for light mixing in LED packages to improve the far field emission pattern (FFP) of the LED packages are disclosed. The LED package can include one or more LED chips with different wavelength ranges, and the light collector placed over the LED chips can have a reflective surface, save for a reduced aperture through which the light from the LED chips can be emitted after mixing in the light collector. The LED package can also include a lens to further improve the FFP. In an embodiment, the light collector can include diffuser material to facilitate the mixing of the light within the light collector. The LED package with the light collector mixes multiple emission point sources into a single point source, or reduced-area source, that considerably improves the FFP of multi-colored LED chips of the LED package.

Disclosed is a light emitting diode display device comprising a light emitting diode over a substrate, and an optical element provided with liquid crystal molecule randomly distributed therein and configured to change a path of light emitted from the light emitting diode.

A lighting device disclosed in an embodiment of the invention includes: a lighting module emitting a first light and a second light; and a lens disposed on the lighting module to block light of a shorter wavelength among the first light and the second light and transmit light of a longer wavelength, wherein the lighting module includes: a substrate; a plurality of light emitting devices disposed on the substrate and emitting a first light; a resin layer covering the plurality of light emitting devices; and a phosphor layer disposed on the resin layer to convert the first light into second light, wherein the first and second light travel through the phosphor layer in the lens direction, and the second light may pass through the lens.

An array substrate, a method of manufacturing the array substrate, and a display device are provided. The array substrate includes: a transparent rigid base; light-emitting chips on the transparent rigid base, each light-emitting chip including a chip body and a pin coupled to the chip body, a light-exiting surface of the chip body facing towards the transparent rigid base, and the pin being on a side of the chip body facing away from the transparent rigid base; a driving wire layer on a side of the pin facing away from the transparent rigid base; and a driving chip structure on a side of the driving wire layer facing away from the transparent rigid base. The driving chip structure is coupled to pins of the plurality of light-emitting chips through the driving wire layer, and is used for provide driving signals for the light-emitting chips.

A light emitting device including: a substrate; a light emitting element on the substrate, and having a first end and a second end in a longitudinal direction; first and second banks on the substrate and spaced apart from each other with the light emitting element interposed therebetween; a first electrode on the first bank and adjacent to the first end of the light emitting element; a second electrode on the second bank and adjacent to the second end of the light emitting element; a first contact electrode coupling the first electrode and the first end of the light emitting element, and a second contact electrode coupling the second electrode and the second end of the light emitting element. When viewed on a plane, the first electrode partially overlaps the first bank, and the second electrode partially overlaps the second bank.

A light-emitting diode (LED) chip includes a substrate and an epitaxial structure. The epitaxial structure includes a first semiconductor layer, an active layer and a second semiconductor layer that are sequentially disposed on the substrate in such order. The second semiconductor layer has a light-emitting surface that is opposite to the active layer and that is formed with a microstructure. The microstructure includes a plurality of first protrusions that are separately disposed on the light-emitting surface, and a plurality of second protrusions that are disposed on the first protrusions and on the light-emitting surface between any two adjacent ones of the first protrusions.

A display device includes a bank pattern disposed on a substrate, a first electrode pattern disposed on the bank pattern, a light-emitting element disposed on the first electrode pattern to be electrically connected to the first electrode pattern, a second electrode pattern configured to cover the light-emitting element, an inorganic insulating layer configured to cover the bank pattern, the first electrode pattern, and the light-emitting element between the first electrode pattern and the second electrode pattern, and a diffusion layer which includes a plurality of diffusion particles and is in contact with the inorganic insulating layer.

A light emission device according to an embodiment of the present disclosure includes a light source unit and a wavelength conversion layer. The light source unit has a light emission surface and emits first light from the light emission surface. The wavelength conversion layer is disposed on a side of the light emission surface of the light source unit, has a first surface disposed to face the light emission surface and a second surface disposed on an opposite side of the first surface, and includes a plurality of wavelength conversion materials that converts the first light into second light in a different wavelength band and a plurality of scattering particles. The wavelength conversion layer has a lower absorption coefficient of the first light in the vicinity of the first surface than in the vicinity of the second surface.

A display device includes a bank including an opening defining a plurality of pixels; a plurality of light emitting elements disposed in the plurality of pixels; a color conversion layer disposed on the plurality of light emitting elements in the opening; and a low refractive layer disposed on the color conversion layer in the opening.

A light-emitting module is provided. The light-emitting module includes a circuit substrate and a first light-emitting element disposed on the circuit substrate. The light-emitting module also includes an optical pattern disposed on the circuit substrate and adjacent to the first light-emitting element. The light-emitting module further includes a lens covering the first light-emitting element and the optical pattern.