An adapter device for chip packaging test is disclosed in the present disclosure. The adapter device for chip packaging test includes: a connection plate comprising a plurality of packaging testing units. Each packaging testing unit includes: a plate slot for accommodating a micro chip, a signal transmission sheet coupled with the plate slot, a signal connector coupled with the plate slot, and a chip substrate. In some embodiments, the adapter device for chip packaging test further includes: an adapter plate coupled with the connection plate through an inter-plate connection region included in the adapter plate. A method for chip packaging testing includes bonding a plurality of the micro chips to the chip substrates of the connection plate, coupling the connection plate with the adapter plate, inspecting the plurality of micro chips, and identifying a faulty micro chip using the identification code.

An interposer may include a temporary substrate, a common pad disposed on the temporary substrate and light emitting diodes (LEDs) disposed on the common pad. Each of the light emitting diodes may include a first electrode, a first semiconductor layer, an emission layer, a second semiconductor layer, a second electrode, and a passivation layer. The second electrode, the second semiconductor layer, the emission layer, the first semiconductor layer and the first electrode may have a structure formed from sequential lamination. The passivation layer may enclose the second semiconductor layer, the emission layer and the first semiconductor layer. The common pad may be electrically connected to the second electrode at a lower side of the light emitting diodes. The first electrode in each of the light emitting diodes may extend to an upper portion of the passivation layer. A method for inspecting light emitting diodes disposed on a temporary substrate is also disclosed.

A method for manufacturing an LED display includes a dicing step for dicing a plurality of circuit boards from a multi-sided board having the plurality of circuit boards formed within its surface, a first arrangement step for arranging the plurality of circuit boards on a carrier board, a second arrangement step for arranging the carrier board on a mounting stage, and a mounting step for mounting a plurality of LED chips on the plurality of circuit boards on the mounting stage.

An LED display installation system and an LED display installation method are provided. The LED display installation system includes a plurality of display screen installation frames, each display screen installation frame can be installed with an LED display screen; adjacent display screen installation frames are connected through a combination of a curvature lock component and a U-shaped lock component; a third installation side of the display screen installation frames is provided with at least one fastening part, a fourth installation side thereof is provided with at least one second U-shaped lock component. Adjacent display screen installation frames are assembled or dissembled by a cooperation of the fastening part and the second U-shaped lock component; the display screen installation frames are connected horizontally through the first and second installation sides, connected vertically through third and fourth installation sides, and assembled into a support frame for a large LED display screen.

An electromagnetic shielding cap for an electronic circuit includes a main surface and four lateral surfaces. A recessed portion is present in the first lateral surface provided by an open cavity in and at a base of the first lateral surface. An electronic circuit, such as an optical transmission and/or reception device, includes a chip bonded to a first main surface of a substrate. The electromagnetic shielding cap is mounted over the chip to the first main surface of the substrate. The circuit further includes an additional cap made of polymer material. The electromagnetic shielding cap is assembled to the substrate using a solder joint soldered both to a metal pad of the substrate and to at least one wall of the recessed portion. The second cap may be positioned over or under the first cap.

A manufacturing method includes providing a first substrate including a circuit layer and an electronic element disposed on the circuit layer, providing a second substrate, bonding the first substrate and the second substrate to form an electronic module, cutting the electronic module, forming a wire on a first surface exposed after cutting the electronic module and on a second surface of the electronic module, wherein the first surface is adjacent to the second surface and the wire is electrically connected to the circuit layer, and disposing a driving element on the second surface of the electronic module to be electrically connected to the wire.

An etching device includes a stage on a target substrate, and a nozzle part opposing the stage with the target substrate therebetween. The stage includes a first surface parallel to a plane defined by a first direction and a second direction crossing the first direction, and a second surface parallel to a third direction which forms a first angle with the second direction, and the second surface includes a first side parallel to the first direction, and a second side opposing the first side in the third direction and adjacent to the first surface. The nozzle part includes a (1-1)-th nozzle, a (1-2)-th nozzle spaced apart from the (1-1)-th nozzle in the first direction, and a (2-1)-th nozzle disposed between the (1-1)-th nozzle and the (1-2)-th nozzle.

A pad for lamination includes a first pad which applies a first pressure to a first area of a display panel, and a second pad which is at least partially surrounded by the first pad in a plan view and which applies a second pressure to a second area different from the first area of the display panel. After the first pad fixes at least a portion of the first area of the display panel, the second pad stretches the second area of the display panel, such that a display device may be manufactured in which defects such as, for example, wrinkles of the display panel which may occur in a lamination process are minimized in quantity or reduced in size.

An etching device includes a stage on which a target substrate is disposed, a nozzle which opposes the stage with the target substrate therebetween and injects an etchant toward the stage, and a mask part including a first mask and a second mask and disposed between the target substrate and the nozzle. The mask part operates in one of a first mode and a second mode. In the first mode, the second mask is spaced from the first mask by a first width in a first direction, and in the second mode, the second mask is spaced from the first mask by a second width in the first direction. The second width is greater than the first width.