An electronic device includes a first substrate, a first circuit layer, a semiconductor chip, and a transparent conductive layer. The first circuit layer is disposed on the first substrate. The semiconductor chip is disposed on the first substrate and electrically connected to the first circuit layer. The semiconductor chip includes a semiconductor die, a filling layer, and a reflective layer. The semiconductor die has a surface and another surface opposite to the surface. The filling layer surrounds the semiconductor die. The reflective layer is disposed on the filling layer and the semiconductor die. The reflective layer includes a first part and a second part. The first part is disposed on the surface of the semiconductor die. The second part is disposed on the filling layer. The conductive layer is disposed on the another surface of the semiconductor die and connects to the second part.

A semiconductor light emitting device may be provided that reduces product defects of a light emitting device by including a distributed Bragg reflector disposed at an edge of a light emitting structure, while improving the luminous efficiency of the light emitting device.

A light emitting apparatus and a light emitting module including the same, and, more particularly, a light emitting apparatus including a light emitting device and a molding layer covering the light emitting device, and a light emitting module including the same. The light emitting apparatus includes a substrate, at least one light emitting device disposed on a surface of the substrate, a first molding layer covering at least a region of the light emitting devices, and a second molding layer surrounding an outer periphery of the substrate.

A 3D semiconductor device including: a first level including a first single crystal layer and first transistors, which each include a single crystal channel; a first metal layer with an overlaying second metal layer; a second level including second transistors, overlaying the first level; a third level including third transistors, overlaying the second level; a fourth level including fourth transistors, overlaying the third level, where the second level includes first memory cells, where each of the first memory cells includes at least one of the second transistors, where the fourth level includes second memory cells, where each of the second memory cells includes at least one of the fourth transistors, where the first level includes memory control circuits, where second memory cells include at least four memory arrays, each of the four memory arrays are independently controlled, and at least one of the second transistors includes a metal gate.

A light-emitting device includes a first light emitter and a second light emitter. A first drive current through the first light emitter and a second drive current through the second light emitter flow in opposite directions. A period in which the first drive current flows and a period in which the second drive current flows at least partially overlap each other. This structure causes the phase of an electromagnetic wave induced by the first drive current to be opposite to the phase of an electromagnetic wave induced by the second drive current, thus allowing the electromagnetic waves to at least partially cancel each other and reducing electromagnetic interference.

A micro LED panel having a micro LED array and the system and method to manufacture the micro LED panel are provided according to the present disclosure. The micro LED array includes at least one micro LED structure. The micro LED structure at least includes: a mesa structure and a re-growth layer. In some embodiments, the mesa structure comprises a first type epitaxial layer, a light emitting layer and a second epitaxial layer. In some embodiments, the re-growth layer is grown on at least part of the sidewall of the first type epitaxial layer, the whole sidewall of the light emitting layer and at least part of the sidewall of the second type epitaxial layer. The present disclosure can decrease the non-radiation recombination at the sidewall of the mesa structure and improve the light emitting efficiency of the micro LED structure.

A micro LED panel having a micro LED array and the system and method to manufacture the micro LED panel are provided by the present disclosure. The micro LED array includes at least one micro LED structure. The micro LED structure at least includes: a mesa structure and a photonic crystal structure array. The photonic crystal structure array formed through the mesa structure from top to bottom, thereby realizing higher directional light emission, simpler structure and lower cost.

A display substrate, a display panel, and preparation methods thereof. The display substrate includes a base substrate, a bonding pad, and an insulating layer. The bonding pad is located on one side of the base substrate and includes at least two bonding pad layers stacked in a thickness direction of the base substrate. The insulating layer is located between adjacent two of the bonding pad layers, and the insulating layer includes a via. In adjacent two of the bonding pad layers, the bonding pad layer on the side away from the base substrate extends into the via and is electrically connected to the bonding pad layer on the side close to the base substrate.

A light engine with distinct light sources sharing at least one optic may employ scattering particles to change the illuminance line profiles of one or more of the light sources so that they are more uniformly mixed in the far-field. The scattering particles may be integrated into phosphor layers of specific light sources or may be disposed in a separate layer. The scattering particles may be tunable based on the particular characteristics of the light source, such as their spectral characteristics or their chemical mixing characteristics.

A light source unit includes: a display device configured to emit light that has a substantially Lambertian light distribution and to display a picture; a first prism sheet on which the light emitted from the display device is incident; and an imaging optical system that includes an input element on which light emitted from the first prism sheet is incident and an output element on which light that has passed through the input element is incident, and configured such that light emitted from the output element forms a first image corresponding to the picture. The imaging optical system has a substantially telecentric property on a side of the first image.