The present disclosure discloses a corner protection device for a display screen and a display screen assembly. In the corner protection device, when a locking member slides on a base to be in a locked state, a locking block is inserted into a locking slot, a first protrusion is inserted into a first through hole of a first corner protection plate, and a second protrusion is inserted into a second through hole of a second corner protection plate. The first corner protection plate and the second corner protection plate protrude from a corner of the display screen. When the locking member slides on the base to be in an unlocked state, the first protrusion or the second protrusion drives the locking block to disengage from the locking slot, and the first corner protection plate and the second corner protection plate are received in a corner of the display screen.

Disclosed are an integrated LED packaging structure and a packaging method, and relates to the technical field of LED packaging. The disclosure includes a shell, a bottom end of the shell is fixedly connected to a pin platform, a top end of the shell is fixedly connected to an LED plug, three lamp beads are fixedly mounted at a top end of the LED plug, a bottom end of the pin platform is fixedly connected to a cup cavity, and a bottom end of the cup cavity is fixedly connected to connecting pins. The top end of the LED plug is provided with LED sockets in positions corresponding to the lamp beads, and bottom ends of inner sides of the LED sockets are fixedly connected to insulating plates. Furthermore, a combination of an in-line and SMD form is adopted, and the lower half part adopts an SMD structure.

An LED carrier plate, comprising a carrier plate front side and a carrier plate back side, wherein a plurality of through holes penetrate the carrier plate front side and the carrier plate back side, and the plurality of through holes at least comprise two rows of through holes; at least every three through holes enclose one island-shaped carrier plate region on the carrier plate front side; and at least two electrode pins are arranged in the island-shaped carrier plate region, and are configured to be connected to an LED arranged on the carrier plate front side. In addition, further disclosed is an LED display device using the LED carrier plate. The carrier plate and the LED display device can achieve both light transmission and LED display/lighting effects.

An electronic device includes a first substrate, a first circuit layer, a second circuit layer, a side circuit layer, a light-shielding layer, a protective layer, and a circuit board. The first substrate has a first surface, a second surface, and a side surface. The first surface is opposite to the second surface. The side surface connects the first surface and the second surface. The first circuit layer is disposed on the first surface. The second circuit layer is disposed on the second surface. The side circuit layer is disposed on the side surface and electrically connected to the first circuit layer and the second circuit layer. The light-shielding layer is disposed on the side circuit layer. The protective layer is disposed on the light-shielding layer and the second circuit layer, and continuously extends from the side surface to the second surface. The protective layer includes an opening exposing a portion of the second circuit layer. The circuit board is electrically connected to the second circuit layer through the opening.

An integrated circuit package includes a substrate having a first surface and a second surface. An electronic integrated circuit chip has a first surface and a second surface, with the second surface mounted on the first surface of the substrate. A preformed glass cover is assembled on the first surface of the substrate and arranged to contain the electronic integrated circuit chip.

A display device includes: a display panel including: a substrate including an ultra-thin glass and a plurality of pixels on the substrate; and a cover panel including: a first sheet under the display panel and a second sheet in direct contact with a lower surface of the first sheet and having a modulus of 30 gigapascals (Gpa) or more.

Display structures and methods of fabrication are described. In an embodiment, a display structure includes an array of pixel driver chips embedded in an insulation layer, a redistribution layer (RDL) over and in electrical contact with the array of pixel driver chips, and an array of light emitting diodes (LEDs) over and in electrical contact with the RDL, where the array of LEDs includes different groups of LEDs designed for different wavelength emission spectra, and the top surfaces of the LEDs are coplanar.

A display apparatus includes a through hole panel, a mounting module including a plurality of light emitting diodes (LEDs) and disposed to oppose the through hole panel, and a plurality of supporting reinforcement parts including a first portion of one or more supporting reinforcement parts disposed in a first direction and in contact with the through hole panel, and a second portion of one or more supporting reinforcement parts disposed in a second direction and in contact with the mounting module. The first portion and the second are configured to adjust a spacing distance between the through hole panel and the mounting module.

A display includes a first housing portion having graphic openings and a second housing portion spaced apart from the first housing portion. A first circuit board has LEDs and is disposed between the first and second housing portions. A first side wall and a second side wall define photon recycling cavities in a sequence wherein adjacent photon recycling cavities have a shared end wall an LED. The first side wall has a first angular surface and the second side wall has a second angular surface. The first angular surface and the second angular surface redirecting light from an associated LED of the plurality of LEDs so that light from the plurality of light emitting diode is indirectly communicated through the graphic openings after reflecting from the first angular surface and the second angular surface.

A light-emitting unit and a light-emitting device are provided. The light-emitting unit includes a light-emitting chip and an optical encapsulant. The light-emitting unit has a top surface and a bottom surface opposite to each other in the thickness direction, and a surrounding side surface. The top surface and the bottom surface are surrounded by the surrounding side surface, and the light-emitting chip includes a connection pad located on the bottom surface and a wire bonding point that is located on the top surface. The surrounding side surface of the light-emitting chip is surrounded by the optical encapsulant, and the top surface and the bottom surface of the light-emitting chip are exposed outside of the optical encapsulant.