A transparent display module includes: a transparent substrate; a line pattern provided on the transparent substrate in a form of a two-dimensional grid; a plurality of micro-pixel integrated circuits (ICs) provided on the line pattern; a plurality of inorganic light emitting elements provided on the line pattern or the plurality of micro-pixel ICs; a plurality of transparent areas formed in areas in which the line pattern is not provided, and at least one pixel circuit configured to supply a driving current to the plurality of inorganic light emitting elements.

A light-emitting substrate and a manufacturing method thereof are disclosed. In the embodiment of the present disclosure, by providing a groove on a base plate in the manufacturing method of the light-emitting substrate, the accuracy of coating the solder resist ink layer can be improved so as to reduce a distance between the solder resist ink layer and the pad assembly and avoid poor soldering or soldering failure caused by the overflow of the solder resist ink onto the pad.

A light emitting apparatus includes: a circuit board; a plurality of light emitting devices connected to the circuit board; and a reflective sheet that reflects light emitted from the plurality of light emitting devices and includes a plurality of reflective cells which respectively accommodate the plurality of light emitting devices. The plurality of reflective cells include a plurality of low-reflection patterns. The plurality of low-reflection patterns include a pattern disposed closer to an edge of the reflective sheet, size of which is relatively smaller than size of other patterns.

A display device is provided in the disclosure. The display device includes a first flexible substrate, a second flexible substrate, a display unit, a color conversion layer, a support layer, a first adhesive layer, a protective layer and a second adhesive layer. The second flexible substrate is disposed opposite to the first flexible substrate. The display unit is disposed between the first flexible substrate and the second flexible substrate. The color conversion layer is disposed between the second flexible substrate and the display unit. The support layer is disposed under the first flexible substrate. The first adhesive layer is disposed between the support layer and the first flexible substrate. The protective layer is disposed on the second flexible substrate. The second adhesive layer is disposed between the second flexible substrate and the protective layer.

A display device includes: a display panel including: a substrate including an ultra-thin glass and a plurality of pixels on the substrate; and a cover panel including: a first sheet under the display panel and a second sheet in direct contact with a lower surface of the first sheet and having a modulus of 30 gigapascals (Gpa) or more.

The present disclosure provides a light-emitting chip, a light-emitting device and a display apparatus. The light-emitting chip includes a pixel circuit layer, a light-emitting unit group located on a side of the pixel circuit layer, and a plurality of conductive pads located on a side of the pixel circuit layer facing away from the light-emitting unit. The pixel circuit layer includes at least a part of the structure of the pixel circuit and a plurality of signal lines. The light-emitting unit group includes at least one light-emitting unit, the light-emitting unit is electrically connected with the pixel circuit. One of the conductive pads is electrically connected with one of the signal lines. The light-emitting device includes the plurality of light-emitting chips and the second drive circuit, the plurality of conductive pads are connected with the second drive circuit. The display apparatus includes a light-emitting device.

A display includes a first housing portion having graphic openings and a second housing portion spaced apart from the first housing portion. A first circuit board has LEDs and is disposed between the first and second housing portions. A first side wall and a second side wall define photon recycling cavities in a sequence wherein adjacent photon recycling cavities have a shared end wall an LED. The first side wall has a first angular surface and the second side wall has a second angular surface. The first angular surface and the second angular surface redirecting light from an associated LED of the plurality of LEDs so that light from the plurality of light emitting diode is indirectly communicated through the graphic openings after reflecting from the first angular surface and the second angular surface.

A lighting device having a support supporting first light emitting diodes and second light emitting diodes each having a light emitting surface, wherein the light emitting surface of each first light emitting diode has a first area and the light emitting surface of each second light emitting diode has a second area, the second area being strictly lower than the first area.

The present disclosure provides a wiring substrate, a method manufacturing the same, and an electronic device. The wiring substrate includes a base substrate, a plurality of pad groups on the base substrate, each pad group including at least two pads. Two pads adjacent in a first direction or a second direction of the at least two pads are spaced apart. Each pad includes a plurality of sides including at least one selected side and at least one non-selected side, any one pad is adjacent to another pad along the first direction or the second direction, the selected side of the any one pad is a side facing the adjacent another pad, and a distance between the selected side of the any one pad facing the adjacent another pad and the selected side of the adjacent another pad facing the any one pad is 30 m and <100 m.

A display apparatus can include a display panel on which a video is reproduced, a metal plate disposed behind the display panel, a first circuit board disposed behind the metal plate and electrically connected to the display panel, a chip on film, a driving element disposed on the chip on film and protruding from the chip on film, and a reinforcing plate disposed at a position at which at least a portion thereof overlaps the driving element behind the chip on film and adhered to the chip on film. The chip on film can have one side electrically connected to the display panel, another side electrically connected to the first circuit board, and a portion provided to be bent.