A light-emitting module includes: a light-emitting device including a first light-emitting element configured to output first light having a peak wavelength in a range from 430 nm to 480 nm; and a second light-emitting element configured to output second light having a peak wavelength in a range from 500 nm to 600 nm; and a wavelength conversion member configured to absorb light having a wavelength included in at least one of the first light and the second light and output third light having a peak wavelength in a range from 600 nm to 780 nm. The first light-emitting element and the second light-emitting element are disposed in the light-emitting device, and the wavelength conversion member is disposed separately from the light-emitting device.

An image display device manufacturing method includes: providing a first substrate that includes: a circuit including a circuit element formed on a light-transmitting substrate, and a first insulating film covering the circuit; forming, on the first insulating film, a conductive layer including a portion made of a single crystal metal; forming, on the portion made of the single crystal metal, a semiconductor layer including a light-emitting layer; etching the semiconductor layer to form a light-emitting element; forming a second insulating film covering the conductive layer, the light-emitting element, and the first insulating film; forming a via passing through the first insulating film and the second insulating film; and electrically connecting the light-emitting element and the circuit element through the via at a light-emitting surface facing a surface of the light-emitting element on a first insulating film side.

The invention relates to a light-converting optoelectronic device comprising light-emitting diodes and conversion pads (40). Spacer portions (23) that are conductive and transparent, are located between the reflective portion (22) and the lower conductive portion (31) of the converting luminous pixels (Px.sub.ac) only or of the non-converting luminous pixels (Px.sub.sc) only. Moreover, the thickness (e.sub.31.opt) of the lower conductive portions (31) and the thickness (e.sub.23.opt) of the spacer portions (23) are predefined so as to maximize: in the non-converting luminous pixels (PX.sub.sc), an extraction efficiency of the emitted light from the light emitting diode; and in the converting luminous pixels (PX.sub.ac), a coupling efficiency of the light emitted by the active portion (32) with optical modes supported in the conversion portion (40).

A display panel including a first substrate, a second substrate, a first bank structure, a second bank structure, a light-emitting element, and a color conversion pattern is provided. The first bank structure is disposed on the first substrate. The second bank structure is disposed on the second substrate. The light-emitting element is disposed in a first accommodation space defined by the first bank structure. The color conversion pattern includes a first portion and a second portion overlapping each other and separated from each other. The first portion is disposed on the first substrate and covers the light-emitting element. The second portion is disposed on the second substrate and located in a second accommodation space defined by the second bank structure. In a direction perpendicular to a stacking direction of the two substrates, a second width of the second portion is less than a first width of the first portion.