Patent classifications
H10H29/853
LIGHT EMITTING APPARATUS AND LIGHT EMITTING MODULE COMPRISING THE SAME
A light emitting apparatus and a light emitting module including the same, and, more particularly, a light emitting apparatus including a light emitting device and a molding layer covering the light emitting device, and a light emitting module including the same. The light emitting apparatus includes a substrate, at least one light emitting device disposed on a surface of the substrate, a first molding layer covering at least a region of the light emitting devices, and a second molding layer surrounding an outer periphery of the substrate.
LIGHT EMITTING APPARATUS AND LIGHT EMITTING MODULE COMPRISING THE SAME
A light emitting apparatus and a light emitting module including the same, and, more particularly, a light emitting apparatus including a light emitting device and a molding layer covering the light emitting device, and a light emitting module including the same. The light emitting apparatus includes a substrate, at least one light emitting device disposed on a surface of the substrate, a first molding layer covering at least a region of the light emitting devices, and a second molding layer surrounding an outer periphery of the substrate.
LIGHTING DEVICE
A lighting device may include a substrate, light sources, a resin layer disposed on the substrate and the light sources, and a phosphor layer disposed on the resin layer. A surface of the resin layer has a flat upper surface and a plurality of side surfaces on an outer side of the flat upper surface. At least one of the plurality of side surfaces of the resin layer has a curved surface. The phosphor layer has a first region disposed on the flat upper surface of the resin layer and a second region disposed on the plurality of side surfaces of the resin layer. Light generated from the plurality of light sources is emitted through the flat upper surface and the curved surface of the resin layer.
DISPLAY BASEPLATE, MOULD ASSEMBLY, SPLICED DISPLAY MODULE AND DISPLAY APPARATUS
Provided are a display baseplate, a mould assembly, a spliced display module, and a display apparatus. The display baseplate includes a backplate light emitters and an encapsulation layer. The backplate includes a first main surface and a second main surface that are opposite to each other, and side surfaces connected to the first main surface and the second main surface light emitters are located on the first main surface, the encapsulation layer is at least partially located on the first main surface and covers the plurality of light emitters. The spliced display module includes a splicing units, the splicing units each include a splicing frame and a display baseplate, the display baseplate is fixed on the splicing frame with the light emitters away from the splicing frame; and the splicing frames of adjacent splicing units are spliced together. The display apparatus includes a display baseplate or a spliced display module.
LIGHT EMITTING SUBSTRATE, METHOD FOR MANUFACTURING THEREOF, AND DISPLAY APPARATUS
Provided are a light emitting substrate, a method for manufacturing same, and a display apparatus. The light emitting substrate includes a base substrate; a plurality of light emitting units located at a side of the base substrate; a plurality of protective structures located at a side of the plurality of light emitting units facing away from the base substrate; the plurality of protective structures each covers a respective one of the plurality of light emitting units; and a plurality of reflective patterns located at a side of the plurality of protective structures facing away from the plurality of light emitting units; orthographic projections of the plurality of reflective patterns on the base substrate fall within orthographic projections of the plurality of protective structures on the base substrate.
DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME
A display panel is disclosed and includes a driving backplane, a plurality of light-emitting devices and an encapsulation structure. The plurality of light-emitting devices are located on a first side of the driving backplane and are disposed at intervals. A light-emitting device includes a device main body and device pins. The device main body includes a light-emitting portion, and the device pins are electrically connected to the driving backplane. The encapsulation structure is located on the first side of the driving backplane and includes a light-shielding pattern and a plurality of encapsulation portions. The light-shielding pattern has a plurality of accommodation regions, an accommodation region exposes at least one light-emitting device. At least part of an encapsulation portion is located in the accommodation region and covers the light-emitting device. A light-emitting portion of at least one light-emitting device is located in the accommodation region.
Light-Emitting Substrate, Backlight Module and Display Device
A light-emitting substrate includes a first substrate, a reflective layer and support columns. The reflective layer is disposed on the first substrate and provided with first openings. At least for two of cross-sections, parallel to a place where the first substrate is located, of a first opening, an area of a cross-section relatively proximate to the first substrate is less than an area of a cross-section relatively away from the first substrate. The support columns are located on a side of the reflective layer away from the first substrate and fixed on the first substrate. An orthographic projection of a support column on the first substrate is a first projection, an orthographic projection a minimum cross-section of the cross-sections is a second projection, and the second projection lies within a range of the first projection.
Light-Emitting Substrate, Backlight Module and Display Device
A light-emitting substrate includes a first substrate, a reflective layer and support columns. The reflective layer is disposed on the first substrate and provided with first openings. At least for two of cross-sections, parallel to a place where the first substrate is located, of a first opening, an area of a cross-section relatively proximate to the first substrate is less than an area of a cross-section relatively away from the first substrate. The support columns are located on a side of the reflective layer away from the first substrate and fixed on the first substrate. An orthographic projection of a support column on the first substrate is a first projection, an orthographic projection a minimum cross-section of the cross-sections is a second projection, and the second projection lies within a range of the first projection.
ARRAY SUBSTRATE, LIGHT-EMITTING SUBSTRATE, BACKLIGHT MODULE, AND DISPLAY APPARATUS
An array substrate includes a substrate, a first conductive layer, at least one insulating layer disposed on a side of the first conductive layer away from the substrate, and a second conductive layer disposed on a side of the at least one insulating layer away from the substrate. The first conductive layer includes a plurality of signal lines, and the plurality of signal lines include device power supply lines. The at least one insulating layer is provided with a first via hole therein. The second conductive layer includes a plurality of device conductive portion groups and a plurality of chip conductive portion groups. A device conductive portion group includes first conductive portions at intervals. A chip conductive portion group includes second conductive portions at intervals. A first conductive portion of the device conductive portion group is in electrical contact with a device power line through the first via hole.
ARRAY SUBSTRATE, LIGHT-EMITTING SUBSTRATE, BACKLIGHT MODULE, AND DISPLAY APPARATUS
An array substrate includes a substrate, a first conductive layer, at least one insulating layer disposed on a side of the first conductive layer away from the substrate, and a second conductive layer disposed on a side of the at least one insulating layer away from the substrate. The first conductive layer includes a plurality of signal lines, and the plurality of signal lines include device power supply lines. The at least one insulating layer is provided with a first via hole therein. The second conductive layer includes a plurality of device conductive portion groups and a plurality of chip conductive portion groups. A device conductive portion group includes first conductive portions at intervals. A chip conductive portion group includes second conductive portions at intervals. A first conductive portion of the device conductive portion group is in electrical contact with a device power line through the first via hole.